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7638412 |
Method and system for reducing charge damage in silicon-on-insulator technology
According to one embodiment of the invention, a silicon-on-insulator device includes an insulative layer formed overlying a substrate and a source and drain region formed overlying the insulative...
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7635670 |
Chromium-free etching solution for si-substrates and uses therefor
The present invention relates to a novel etching solution suitable for characterizing defects on semiconductor surfaces, including silicon germanium surfaces, as well as a method for treating...
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7629257 |
Combined etching and doping substances
The invention concerns etching and doping substances free of hydrochloric/fluoride acid used for etching inorganic layers as well as for doping subjacent layers. The invention also concerns a...
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7629266 |
Etch compositions and methods of processing a substrate
The invention includes an etchant composition containing isopropyl alcohol and one or more of HF, NH 4 F and tetramethyl ammonium fluoride (TMAF). The invention encompasses a method of processing a...
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7622389 |
Selective contact formation using masking and resist patterning techniques
A method for manufacturing a semiconductor device including selective conductive contacts includes the step of depositing a resist over first and second memory device components, each of the first...
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7618898 |
Method and apparatus for forming contact hole
A method of forming a contact hole in an insulating film coating amorphous Si having an irregular surface formed on an insulating substrate, for connecting the amorphous Si to a conductor film...
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7615206 |
Methods of fabricating nanoscale-to-microscale structures
Methods for the production of shaped nanoscale-to-microscale structures, wherein a nanoscale-to-microscale template is provided having an original chemical composition and an original shape, and...
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7616291 |
Lithographic processing cell and device manufacturing method
A double processing technique for device manufacture includes performing a first patterning step to form apertures in a resist layer which apertures are filled before the first resist layer is...
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7611960 |
Method and system for wafer backside alignment
Disclosed is a method and a system for wafer backside alignment. A zero mark patterning on front side of a substrate. A plurality of layers are deposited on the front side of the substrate. The...
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7608541 |
Method of forming fine pattern, liquid crystal display device having a fine pattern and fabricating method thereof
A method of forming fine pattern includes providing a film, forming a photo-resist pattern on the film, ashing the photo-resist pattern and patterning the film by using the ashed photo-resist...
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7608540 |
Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition
A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to...
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7608542 |
Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method
A large-size glass substrate, from which a photomask substrate is formed, is prepared by processing a large-size glass substrate stock by (1) a flattening removal quantity based on height data of...
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7601643 |
Arrangement and method for fabricating a semiconductor wafer
An arrangement and method for fabricating a semiconductor wafer which utilizes a nonaqueous solvent rinse is disclosed.
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7601641 |
Two step optical planarizing layer etch
Methods are provided for etching during fabrication of a semiconductor device. The method includes initially etching to partially remove a portion of one or more lithographic-aiding layers...
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7598173 |
Electro-optic displays, and components for use therein
An electro-optic display comprises a substrate ( 100 ), non-linear devices ( 102 ) disposed substantially in one plane on the substrate ( 100 ), pixel electrodes ( 106 ) connected to the non-linear...
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7598177 |
Methods of filling trenches using high-density plasma deposition (HDP)
Methods of filling trenches/gaps defined by circuit elements on an integrated circuit substrate are provided. The methods include forming a first high-density plasma layer on an integrated circuit...
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7598174 |
Feature patterning methods
Methods of patterning features, methods of patterning material layers of semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a method of...
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7598178 |
Carbon precursors for use during silicon epitaxial film formation
The present invention provides systems and methods of forming an epitaxial film on a substrate. After heating in a process chamber, the substrate is exposed to a silicon source and at least one of...
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7592260 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device, wherein an interlayer insulating layer, a lower barrier metal layer, a metal layer having a low resisvitity value, an upper barrier metal layer, a...
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7592201 |
Adjustments of masks by re-flow
As a step in performing a process on a structure, a hole pattern is provided in a thin layer of organic resin masking material formed over the structure to provide a process mask. A processing step...
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7591806 |
High-aspect-ratio microdevices and methods for transdermal delivery and sampling of active substances
High-aspect-ratio microdevices comprising microneedles, microknives and microblades and their manufacturing methods are disclosed. These devices can be used for the delivery of therapeutic agents...
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7585424 |
Pattern reversal process for self aligned imprint lithography and device
This invention provides a pattern reversal process for self aligned imprint lithography (SAIL). The method includes providing a substrate and depositing at least one layer of material upon the...
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7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing
Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive...
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7582532 |
Method for fabricating semiconductor device
A method for fabricating a semiconductor device includes etching a predetermined portion of a substrate to form a first recess having a bottom middle portion roundly projected and bottom edge...
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7582220 |
Etching method
In an etching method for etching an etching target film formed on a substrate placed inside an airtight processing chamber 104 by inducing a processing gas into the processing chamber 104 , the...
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7579309 |
Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor
The present invention relates to a method for characterizing defects on silicon surfaces, such as silicon wafers, a method for treating silicon surfaces with an etching solution, and an etching...
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7579278 |
Topography directed patterning
A pattern having exceptionally small features is formed on a partially fabricated integrated circuit during integrated circuit fabrication. The pattern comprises features formed by self-organizing...
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7572732 |
Method to modulate etch rate in SLAM
Several techniques are described for modulating the etch rate of a sacrificial light absorbing material (SLAM) by altering its composition so that it matches the etch rate of a surrounding...
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7569484 |
Plasma and electron beam etching device and method
Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching function and concurrently form a...
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7566665 |
Semiconductor device manufacturing method and manufacturing line thereof
The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor...
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7563382 |
Mask and method of fabricating the same, and method of machining material
A method of fabricating a mask which can endure use for a long time and can be used for forming an isolated pattern with a high aspect ratio. The method includes the steps of: forming a soft...
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7553775 |
Method for coating semiconductor surface, process for production of semiconductor particles using said method, and optical element using said semiconductor particles
The present invention provides a method for coating a group 4 semiconductor surface composed mainly of a group 4 semiconductor elements and a process for producing group 4 semiconductor...
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7553679 |
Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current
Plasma parameters such as plasma ion density, wafer voltage, etch rate and wafer current in the chamber are determined from external measurements on the applied RF bias electrical parameters such...
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7553767 |
Method for fabricating semiconductor device having taper type trench
A method for fabricating a semiconductor includes: etching a substrate to a predetermined depth to form an upper trench with taper edges; etching the substrate beneath the upper trench to form a...
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7544625 |
Silicon oxide thin-films with embedded nanocrystalline silicon
A method is provided for forming a silicon oxide (SiOx) thin-film with embedded nanocrystalline silicon (Si). The method deposits SiOx, where x is in the range of 1 to 2, overlying a substrate,...
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7544620 |
Process for digging a deep trench in a semiconductor body and semiconductor body so obtained
A process for digging deep trenches in a body of semiconductor material includes forming a mask having an opening, above a surface of a semiconductor body. A passivating layer is conformally formed...
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7544307 |
Metal polishing liquid and polishing method using it
A metal polishing liquid which contains a compound represented by the following formula (1), an aromatic heterocyclic ring compound, and an oxidizing agent, and a chemical mechanical polishing...
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7541285 |
Substrate processing apparatus and substrate processing method
A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the...
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7541286 |
Method for manufacturing semiconductor device using KrF light source
A semiconductor device manufacturing method using a KrF light source is disclosed. Embodiments relate to a method for manufacturing a semiconductor device including forming an oxide film over a...
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7541228 |
Semiconductor device, method of manufacturing the same, and method of designing the same
An object of the present invention is to provide a semiconductor device formed by laser crystallization by which formation of grain boundaries in the TFT channel formation region can be avoided,...
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7537657 |
Silicon wafer and process for producing it
A process for producing a single-crystal silicon wafer, comprises the following steps:
producing a layer on the front surface of the silicon wafer by epitaxial deposition or production of a...
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7537990 |
Method of manufacturing semiconductor devices
A method of manufacturing semiconductor devices includes: preparing a semiconductor substrate over which a laminated structure including an insulating layer is formed; forming over the insulating...
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7531102 |
Simultaneous selective polymer deposition and etch pitch doubling for sub 50nm line/space patterning
First radicals and second radicals are simultaneous deposited into a space defined by two adjacent lines of photoresists and an underlying layer. A portion of the first radicals and the second...
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7531470 |
Method and apparatus for electronic device manufacture using shadow masks
Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least...
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7527704 |
Method for preparing film structure comprising ferroelectric single crystal layer
A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a...
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7528076 |
Method for manufacturing gate oxide layer with different thicknesses
A method of manufacturing gate oxide layers with different thicknesses is disclosed. The method includes that a substrate is provided first. The substrate has a high voltage device region and a low...
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7526357 |
Pulse modulation laser writing system
A pulse modulation laser writing system generates a motion control file for controlled motion of a sample under modulated laser beam exposure and generates a laser script file for generating a...
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7521362 |
Methods for the optimization of ion energy control in a plasma processing system
A method in a plasma processing system for etching a feature through a dielectric layer of a dual damascene stack on a semiconductor substrate is disclosed. The method includes placing the...
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7517805 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method of in-situ ash strip to eliminate memory effect and reduce wafer damage
An in-situ ashing method for stripping a photoresist layer following a fluorocarbon based etch that transfers a pattern through a dielectric layer is disclosed. The method is especially effective...
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7514369 |
Method of producing porous silicon particles by stain-etching and silicon nanoparticles from stain-etched silicon powder
The present invention is for a porous silicon powder comprising silicon particles wherein the outermost layers of said particles are porous. The present invention is also directed to a method of...
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