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8178423 Laser beam machining method and laser beam machining apparatus  
A laser beam machining method wherein machining areas in which to form machined grooves and machining start point areas in which to form shallow grooves shallower than the machined grooves are...
8168458 Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices  
A semiconductor wafer contains a plurality of semiconductor die each having a peripheral area around the die. A recessed region with angled or vertical sidewall is formed in the peripheral area. A...
8153464 Wafer singulation process  
A method of singulating a semiconductor die from a wafer is provided. The method includes etching or cutting several trenches into the wafer from a front surface of the wafer, such that each trench...
8148189 Formed ceramic receiver element adhered to a semiconductor lamina  
A method is described to create a thin semiconductor lamina adhered to a ceramic body. The method includes defining a cleave plane in a semiconductor donor body, applying a ceramic mixture to a...
8143081 Method for dicing a diced optoelectronic semiconductor wafer  
A method for dicing an optoelectronic semiconductor wafer has steps of preparing an optoelectronic semiconductor wafer, laser scribing, diamond saw dicing and forming optoelectronic semiconductor...
8129273 Semiconductor device and method for producing the same  
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the...
8119502 Method for packaging components  
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are...
8114701 Camera modules and methods of fabricating the same  
Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first...
8105856 Method of manufacturing semiconductor device with wiring on side surface thereof  
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which...
8097493 Method of manufacturing semiconductor light emitting elements  
A method of manufacturing semiconductor light emitting elements with improved yield and emission power uses laser lift-off and comprises the steps of forming a semiconductor grown layer formed of a...
8084288 Method of construction of CTE matching structure with wafer processing and resulting structure  
A method includes bonding a first side of a metal shim to a silicon shim, removing metal from the metal shim to form a plurality of cleared metal lanes in accordance with a pattern, bonding a...
8071428 Semiconductor device  
A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate...
8067295 Manufacturing method of solar cell module, and solar cell and solar cell module  
A double-side light receiving solar cell in a planer regular hexagon shape and having first electrodes on both surfaces are divided into four pieces by a line A-A′ connecting two opposing apexes a...
8067256 Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method  
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel...
8067819 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line  
The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The semiconductor wafer includes a...
8067258 Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures  
A method of protecting a substrate during fabrication of semiconductor, MEMS, or biotechnology devices. The method includes application of a protective thin film which typically has a thickness...
8062960 Compound semiconductor device and method of manufacturing compound semiconductor device  
The present invention provides a method of manufacturing a compound semiconductor device capable of improving yield when a wafer is divided into device regions. The method of manufacturing a...
8048780 Method of processing optical device wafer  
A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting...
8048768 Joined wafer, fabrication method thereof, and fabrication method of semiconductor devices  
A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer...
8034653 Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module  
A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the...
8022453 Image sensor and manufacturing method for same  
An image sensor including a first region where a pad is to be formed, and a second region where a light-receiving element is to be formed. A pad is formed over a substrate of the first region. A...
8003426 Method for manufacturing package structure of optical device  
A package structure of optical devices has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has at least an optical device and a...
7998763 Method for manufacturing semiconductor apparatus and mold assembly for the same  
A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating...
7998781 Method of manufacturing semiconductor device in which functional portion of element is exposed  
A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin layer into a predetermined shape and...
7993975 Method of manufacturing semiconductor device including mounting and dicing chips  
A semiconductor-device manufacturing method includes: forming terminals on a wafer and across each of dicing lines along which the wafer is cut into a plurality of semiconductor chips; preparing a...
7993977 Method of forming molded standoff structures on integrated circuit devices  
A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of...
7968432 Laser processing apparatus and laser processing method  
A laser processing apparatus has one laser light source that simultaneously radiates laser beams with two wavelengths. Depth positions of focusing points for laser beams are gradually changed in a...
7964432 Method of manufacturing lenses, in particular for an integrated imager  
A method for manufacturing a micro-module for capturing images having an imager and at least one lens, includes manufacturing at least one imager on a first plate of a semiconductor material,...
7964431 Method to make electrical contact to a bonded face of a photovoltaic cell  
A photovoltaic cell is formed by bonding a donor body to a receiver element and cleaving a thin lamina from the donor body. Electrical contact is made to the bonded surface of the lamina through...
7955955 Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures  
A semiconductor product comprises a semiconductor substrate having a top surface and a bottom surface including a semiconductor chip. The semiconductor substrate has a top surface and a perimeter....
7951648 Chip-level underfill method of manufacture  
A process comprises forming a first electrical interconnect structure on a surface of a singulated semiconductor chip having an alignment pattern, which is scanned and stored in a scanning device...
7947574 Laser processing method and semiconductor chip  
A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a...
7943425 Semiconductor wafer sawing system and method  
Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed...
7932121 Semiconductor device and manufacturing method of the same  
A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member...
7923297 Manufacturing method of semiconductor device  
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped shoulder...
7915746 Semiconductor wafer, and semiconductor device formed therefrom  
A semiconductor wafer has a substrate, and a plurality of active areas formed on the substrate. Integrated circuits are formed in the active areas. The semiconductor wafer also has dicing areas...
7901967 Dicing method for semiconductor substrate  
A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a...
7901973 Solid state imaging device and manufacturing method thereof  
To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal...
7875794 Semiconductor wafer processing to increase the usable planar surface area  
The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially...
7871901 Manufacturing method for semiconductor chips  
A method of manufacturing semiconductor chips including forming dividing-groove portions in accordance with dividing regions on the second surface of a semiconductor wafer where an insulating film...
7867825 Semiconductor die with protective layer and related method of processing a semiconductor wafer  
A semiconductor die and a related method of processing a semiconductor wafer are disclosed in which a first interlayer insulator having a recess region of varying configuration and defining a...
7851241 Method for severing brittle material substrate and severing apparatus using the method  
There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device...
7838333 Electronic device package and method of manufacturing the same  
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic...
7838325 Method to optimize substrate thickness for image sensor device  
Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to...
7829440 Method of separating semiconductor dies  
A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, a seed metal layer may be used to...
7829360 Vertical indent production repair  
A method of nanomachining is provided. The method includes plunging a nanometer-scaled tip into a surface of a substrate at a first location in a first direction that is substantially perpendicular...
7816165 Method of forming a device by removing a conductive layer of a wafer  
A method of forming a MEMS device provides a wafer having a base with a conductive portion. The wafer also has an intermediate conductive layer. After it provides the wafer, the method adds a...
7799612 Process applying die attach film to singulated die  
Methods and systems of applying a plurality of pieces of die attach film to a plurality of singulated dice are provided. The method can involve making intervals between rows and columns of a...
7785917 Image sensor and manufacturing method for the same  
An image sensor including a first region where a pad is to be formed, and a second region where a light-receiving element is to be formed. A pad is formed over a substrate of the first region. A...
7781240 Integrated circuit device  
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and...
Matches 1 - 50 out of 248 1 2 3 4 5 >