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9040346 Semiconductor package and methods of formation thereof  
In one embodiment, a semiconductor package includes a semiconductor chip having a first contact region on a first major surface and a second contact region on an opposite second major surface. The...
9018050 Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)  
A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis,...
9006097 Cu pillar bump with electrolytic metal sidewall protection  
A method of forming a bump structure includes providing a semiconductor substrate and forming an under-bump-metallurgy (UBM) layer on the semiconductor substrate. The method further includes...
8956918 Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier  
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier;...
8956975 Electroless plated material formed directly on metal  
A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking...
8946088 Method of metal deposition  
A method of forming a metal layer on an electrically insulating substrate comprises depositing a photocatalyst layer onto the substrate and depositing a mask layer comprising voids on the...
8946087 Electroless copper deposition  
A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is...
8911551 Electroless plating apparatus and method  
An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte...
8900998 Process for electroless deposition of gold and gold alloys on silicon  
A plating bath for electroless deposition of gold and gold alloy layers on such silicon-based substrates, includes Na(AuCl4) and/or other gold (III) chloride salts as a gold ion source. The bath...
8895441 Methods and materials for anchoring gapfill metals  
One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface...
8889479 Nonvolatile memory elements with metal-deficient resistive-switching metal oxides  
Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed by depositing a metal-containing material on a silicon-containing...
8883641 Solution and method for activating the oxidized surface of a semiconductor substrate  
The present invention relates to a solution and a method for activating the oxidized surface of a substrate, in particular of a semiconducting substrate, for its subsequent coating by a metal...
8872297 Integrated photodiode for semiconductor substrates  
A substrate section that is at least partially fabricated to include contact elements and materials. The substrate section includes doped regions that have a heavily doped N-type region and a...
8865518 Methods for forming resistive switching memory elements  
Resistive switching memory elements are provided that may contain electroless metal electrodes and metal oxides formed from electroless metal. The resistive switching memory elements may exhibit...
8846529 Electroless plating of cobalt alloys for on chip inductors  
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based...
8846451 Methods for depositing metal in high aspect ratio features  
Methods for depositing metal in high aspect ratio features formed on a substrate are provided herein. In some embodiments, a method includes applying first RF power at VHF frequency to target...
8841766 Cu pillar bump with non-metal sidewall protection structure  
Sidewall protection processes are provided for Cu pillar bump technology, in which a protection structure on the sidewalls of the Cu pillar bump is formed of at least one of non-metal material...
8835248 Method for forming metal wire  
Techniques for fabricating metal lines in semiconductor systems are disclosed. The metal may be tungsten. A hybrid Chemical Vapor Deposition (CVD)/Physical Vapor Deposition (PVD) process may be...
8828863 Electroless copper deposition with suppressor  
A method for providing metal filled features in a layer is provided. A nonconformal metal seed layer is deposited on tops, sidewalls, and bottoms of the features, wherein more seed layer is...
8809124 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same  
A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core...
8772155 Filling cavities in semiconductor structures having adhesion promoting layer in the cavities  
High aspect ratio trenches may be filled with metal that grows more from the bottom than the top of the trench. As a result, the tendency to form seams or to close off the trench at the top during...
8766441 Methods and apparatus for solder on slot connections in package on package structures  
Solder on slot connections in package on package structures. An apparatus includes a substrate having a front side surface and a back side surface; a first passivation layer disposed over at least...
8748313 Electroforming technique for mask formation  
A method for making a mask for semiconductor manufacturing. The method includes providing a base layer, forming a conductive layer on the base layer, and forming a photoresist layer on the...
8741773 Nickel-silicide formation with differential Pt composition  
Embodiments of the invention provide a method of forming nickel-silicide. The method may include depositing first and second metal layers over at least one of a gate, a source, and a drain region...
8735302 High productivity combinatorial oxide terracing and PVD/ALD metal deposition combined with lithography for gate work function extraction  
Metal gate high-k capacitor structures with lithography patterning are used to extract gate work function using a combinatorial workflow. Oxide terracing, together with high productivity...
8728876 Method of manufacturing semiconductor device  
The invention prevents a conductive fuse blown out by laser trimming from reconnecting by a plating electrode in a plating process and prevents a plating solution etc from entering a fuse blowout...
8728939 Method for manufacturing semiconductor device and semiconductor manufacturing system  
A single-crystal substrate is placed on a supporting table while maintaining crystalline orientation of the single-crystal substrate. The single-crystal substrate has contacting regions on a...
8722539 Process for through silicon via filling  
A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon...
8709948 Tungsten barrier and seed for copper filled TSV  
Apparatus and methods for filling through silicon vias (TSV's) with copper having an intervening tungsten layer between the copper plug and the silicon are disclosed. Methods are useful for...
8691689 Methods for fabricating integrated circuits having low resistance device contacts  
Methods for fabricating integrated circuits having low resistance device contacts are provided. One method includes depositing an ILD layer of insulating material overlying a device region that...
8691694 Solderless back contact solar cell module assembly process  
In order to better and more efficiently assemble back contact solar cells into modules, the cell to cell soldering and other soldered connections are replaced by electro and/or electroless...
8685850 System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections  
According to one embodiment of the invention, the gate contact is formed by a selective deposition on the gate electrode. One acceptable technique for the selective deposition is by plating....
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby  
An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the...
8663746 Stirring apparatus for combinatorial processing  
An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute...
8647982 Methods of forming interconnects in a semiconductor structure  
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure...
8637397 Method for manufacturing a through hole electrode substrate  
To provide a method of manufacturing a through hole electrode substrate which comprises forming a plurality of through holes passing through the front and back of a wafer-shaped substrate, forming...
8623694 Methods of forming fast ion conductors and memory devices comprising diffused metal ions  
Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory...
8617992 Method of forming metal silicide contact and metal interconnect  
Methods of forming contacts (and optionally, local interconnects) using an ink comprising a silicide-forming metal, electrical devices such as diodes and/or transistors including such contacts and...
8592312 Method for depositing a conductive capping layer on metal lines  
In one disclosed embodiment, the present method for depositing a conductive capping layer on metal lines comprises forming metal lines on a dielectric layer, applying a voltage to the metal lines,...
8575021 Substrate processing including a masking layer  
Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove...
8563433 Process to form via hole in semiconductor wafer  
A process to form a via hole in a semiconductor wafer is disclosed. The process includes steps of, preparing a metal mask and etching the wafer by the metal mask as the etching mask. The...
8563434 Semiconductor device contacts  
A method of fabrication of electrical contact structures on a semiconductor material includes depositing an oxide of a desired contact material by a chemical electroless process on a face of the...
8524528 Methods for forming resistive-switching metal oxides for nonvolatile memory elements  
Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed from resistive-switching metal oxide layers. Metal oxide layers...
8518826 Metallization processes, mixtures, and electronic devices  
One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture...
8518817 Method of electrolytic plating and semiconductor device fabrication  
The disclosure relates generally to semiconductor device fabrication, and more particularly to methods of electroplating used in semiconductor device fabrication. A method of electroplating...
8513061 Method of fabricating a TSV for 3D packaging of semiconductor device  
The present invention relates to a through silicon via (TSV) for 3D packaging to integrate a semiconductor device and a method for manufacturing the same, and more particularly, to a through...
8507376 Method to form solder deposits on substrates  
Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one...
8492263 Protected solder ball joints in wafer level chip-scale packaging  
Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or...
8476170 Method of forming pattern, method of manufacturing semiconductor device, and method of manufacturing template  
According to one embodiment, a pattern formation method includes, before forming a circuit pattern on a substrate using imprinting, a wall pattern with a predetermined height is formed to surround...
8476107 Methods for forming resistive switching memory elements  
Resistive switching memory elements are provided that may contain electroless metal electrodes and metal oxides formed from electroless metal. The resistive switching memory elements may exhibit...