Matches 1 - 50 out of 376 1 2 3 4 5 6 7 8 >


Match Document Document Title
9000594 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures  
A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the...
8987137 Method of fabrication of through-substrate vias  
A method of manufacturing a through-substrate-via structure. The method comprises providing a substrate having a front-side and an opposite back-side. A through-substrate via opening is formed in...
8980747 Method and system for pre-migration of metal ions in a semiconductor package  
Pre-migration of metal ions is achieved in a controlled manner to form a migrated metalover which an inhibitor is applied to prevent further migration. In a semiconductor circuit, pre-migration of...
8969165 Self-aligned insulating etchstop layer on a metal contact  
A semiconductor device comprising a substrate having a transistor that includes a metal gate structure; a first oxide layer formed over the substrate; a silane layer formed on the first oxide...
8951913 Method for removing native oxide and associated residue from a substrate  
Native oxides and associated residue are removed from surfaces of a substrate by sequentially performing two plasma cleaning processes on the substrate in a single processing chamber. The first...
8921228 Method for selectively depositing noble metals on metal/metal nitride substrates  
A method for forming a noble metal layer by Plasma Enhanced Atomic Layer Deposition (PE-ALD) is disclosed. The method includes providing a substrate in a PE-ALD chamber, the substrate comprising a...
8921227 Semiconductor device assembly and semiconductor device and method of manufacturing the same  
A method of manufacturing, at a reduced cost, a semiconductor device assembly and a semiconductor device, having a conductive support which is not eroded by an etchant for a lift-off layer even...
8916232 Method for barrier interface preparation of copper interconnect  
The embodiments fill the need of improving electromigration and reducing stress-induced voids of copper interconnect by enabling deposition of a thin and conformal barrier layer, and a copper...
8895443 N-metal film deposition with initiation layer  
Provided are methods of depositing N-Metals onto a substrate. Some methods comprise providing an initiation layer of TaM or TiM layer on a substrate, wherein M is selected from aluminum, carbon,...
8883640 Sequential station tool for wet processing of semiconductor wafers  
Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are...
8841211 Methods for forming interconnect structures  
Methods for forming interconnect structures are provided herein. In some embodiments, a method for forming an interconnect on a substrate may include depositing a material atop an upper surface of...
8778797 Systems and methods for selective tungsten deposition in vias  
A method for processing a substrate includes providing a substrate including a metal layer, a dielectric layer arranged on the metal layer, and at least one of a via and a trench formed in the...
8772155 Filling cavities in semiconductor structures having adhesion promoting layer in the cavities  
High aspect ratio trenches may be filled with metal that grows more from the bottom than the top of the trench. As a result, the tendency to form seams or to close off the trench at the top during...
8772164 Method for forming interconnection pattern and semiconductor device  
According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating...
8766107 Through-hole-vias in multi-layer printed circuit boards  
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of...
8729397 Embedded structure  
An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the...
8691667 Method and apparatus for depositing a pattern on a substrate  
This invention relates to a process for forming a continuous pattern on a substrate with a liquid media. Upon the deposition of the liquid media on the substrate, a portion the continuous pattern...
8669183 Manufacturing method of semiconductor device  
This invention is directed to form a homogeneous film in a via hole formed in a semiconductor device using Bosch process. The via hole that penetrates through a predetermined region in a...
8658911 Through-hole-vias in multi-layer printed circuit boards  
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of...
8652966 Semiconductor device manufacturing method and semiconductor device  
A semiconductor manufacturing method includes: forming a seed film including a first metal over a bottom surface and a side wall of an opening portion formed over interlayer insulating films and a...
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures  
A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the...
8647982 Methods of forming interconnects in a semiconductor structure  
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure...
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture  
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface....
8614140 Semiconductor device manufacturing apparatus  
There is provided a semiconductor device manufacturing apparatus capable of recovering a damage of a low dielectric insulating film exposed to CO2 plasma to obtain the low dielectric insulating...
8609526 Preventing UBM oxidation in bump formation processes  
A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed...
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures  
A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the...
8592277 Method of forming low resistance gate for power MOSFET applications  
A method for forming a trench gate field effect transistor includes forming, in a semiconductor region, a trench followed by forming a dielectric layer lining a sidewall and a bottom surface of...
8592312 Method for depositing a conductive capping layer on metal lines  
In one disclosed embodiment, the present method for depositing a conductive capping layer on metal lines comprises forming metal lines on a dielectric layer, applying a voltage to the metal lines,...
8586479 Methods for forming a contact metal layer in semiconductor devices  
Methods for forming a contact metal layer in a contact structure in semiconductor devices are provided in the present invention. In one embodiment, a method for depositing a contact metal layer...
8557702 Plasma-enhanced atomic layers deposition of conductive material over dielectric layers  
Methods of forming a conductive metal layer over a dielectric layer using plasma enhanced atomic layer deposition (PEALD) are provided, along with related compositions and structures. A plasma...
8557703 Method for pre-migration of metal ions in a semiconductor package  
According to an embodiment of the present disclosure, a method of pre-migrating metal ions is disclosed. A metal in a semiconductor configuration is exposed to water and oxygen to yield metal...
8518797 Method of making an SOI substrate by using a separation layer with regions of non-uniform concentration  
The method includes steps of adding first ions to a predetermined depth from a main surface of a semiconductor substrate by irradiation of the semiconductor substrate with a planar, linear, or...
8513116 Atomic layer deposition of tungsten materials  
Embodiments of the invention provide a method for depositing tungsten-containing materials. In one embodiment, a method includes forming a tungsten nucleation layer over an underlayer disposed on...
8486833 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks  
Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that...
8461037 Method for fabricating interconnections with carbon nanotubes  
A method for fabricating interconnections with carbon nanotubes of the present invention comprises the following steps: forming a dual-layer that contains a catalytic layer and an upper covering...
8450211 Method for fabricating semiconductor device  
A method for fabricating a semiconductor device includes forming an insulation layer containing an impurity, forming a contact hole by etching the insulation layer, performing a treatment to...
8415252 Selective copper encapsulation layer deposition  
A metal interconnect structure provides high adhesive strength between copper atoms in a copper-containing structure and a self-aligned copper encapsulation layer, which is selectively deposited...
8409987 Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics  
Methods of forming low resistivity tungsten films with good uniformity and good adhesion to the underlying layer are provided. The methods involve forming a tungsten nucleation layer using a...
8395257 Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material  
An electric functional layer is produced on a surface of a substrate, having at least an electronic component, particularly a semiconductor chip, provided thereof. The electric functional layer is...
8357599 Seed layer passivation  
A method of processing a microfeature workpiece generally includes depositing a first conducting layer, at least partially reducing oxides on the first conducting layer to provide a reduced first...
8329577 Method of forming an alloy in an interconnect structure to increase electromigration resistance  
By introducing a metallic species into an exposed surface area of a copper region, the electromigration behavior of this surface area may be significantly enhanced. The incorporation of the...
8324103 Vias and method of making  
The invention relates to a method of providing a planar substrate with electrical through connections (vias). The method comprises providing a hole in said substrate and a treatment to render the...
8318533 Method of manufacturing an organic thin film transistor  
An organic thin film transistor that has good adhesiveness and good contact resistance as well as allows ohmic contact between an organic semiconductor layer and a source electrode and a drain...
8298946 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits  
The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and...
8293646 Semiconductor device manufacturing method and substrate processing apparatus  
A high quality interface is formed at a low oxygen-carbon density between a substrate and a thin film while preventing heat damage on the substrate and increase of thermal budget. This method...
8293647 Bottom up plating by organic surface passivation and differential plating retardation  
Embodiments of the present invention generally relates to an apparatus and a method for processing semiconductor substrates. One embodiment provides a method provides a method for processing a...
8278136 Semiconductor device, method for producing the same, sensor and electro-optical device  
A gate electrode, a gate insulation film and an inorganic oxide film are formed in this order on a substrate, and a source electrode and a drain electrode are formed to partially cover the...
8241948 Semiconductor device and manufacturing method of the same  
The manufacturing method of the present invention includes steps of selectively forming a photocatalyst material or a material including an amino group by discharging a composition including the...
8227708 Via structure integrated in electronic substrate  
A system of via structures disposed in a substrate. The system includes a first via structure that comprises an outer conductive layer, an inner insulating layer, and an inner conductive layer...
8227344 Hybrid in-situ dry cleaning of oxidized surface layers  
According to one embodiment, the method includes providing a substrate containing a metal-containing barrier layer having an oxidized surface layer, exposing the oxidized surface layer to a flow...

Matches 1 - 50 out of 376 1 2 3 4 5 6 7 8 >