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7425498 Semiconductor device with dummy electrode  
A semiconductor device includes a gate electrode having a straight portion, a dummy electrode located at a point on the extension of the straight portion, a stopper insulating film, a sidewall...
7422980 Methods of positioning and/or orienting nanostructures  
Methods of positioning and orienting nanostructures, and particularly nanowires, on surfaces for subsequent use or integration. The methods utilize mask based processes alone or in combination...
7422975 Composite inter-level dielectric structure for an integrated circuit  
A method is provided for making an inter-level dielectric for a microelectronic device formed on a substrate. The method begins by forming first and second spacer layers over a substrate layer....
7416976 Method of forming contacts using auxiliary structures  
A semiconductor product includes a substrate having a substrate surface. A plurality of wordlines are arranged at a distance from one another and running along a first direction. A plurality of...
7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus  
A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps....
7407886 Method for preparing a contact plug structure  
A contact plug structure for a checkerboard dynamic random access memory comprises a body portion, two leg portions connected to the body portion and a dielectric block positioned between the two...
7388279 Tapered dielectric and conductor structures and applications thereof  
Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby...
7387912 Packaging of electronic chips with air-bridge structures  
A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A...
7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method  
A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a...
7365006 Semiconductor package and substrate having multi-level vias fabrication method  
A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second...
7358183 Method for manufacturing wiring and method for manufacturing semiconductor device  
The present invention provides a method for manufacturing a wiring and a method for manufacturing a semiconductor device, which do not require a photolithography step in connecting a pattern of an...
7356920 Micro-machined structure production using encapsulation  
Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the...
7358521 Lateral phase change memory and method therefor  
Briefly, in accordance with an embodiment of the invention, a lateral phase change memory and a method to manufacture a phase change memory is provided. The method may include forming a conductor...
7332430 Method for improving the mechanical properties of BOC module arrangements  
The invention relates to a method for improving the mechanical properties of BOC module arrangements in which chips have 3D structures, solder balls, μ springs or soft bumps which are mechanically...
7329605 Semiconductor structure formed using a sacrificial structure  
A method of forming a buried conductive structure in a semiconductor device includes the steps of forming a first insulating layer on a semiconductor layer; forming a sacrificial structure on at...
7321169 Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus  
A semiconductor device includes a protrusion group composed of a plurality of first protrusions arranged on a mounting surface with predetermined gaps; a plurality of second protrusions for...
7319240 Array substrate with reduced pixel defect, method of manufacturing the same and liquid crystal display panel having the same  
An array substrate includes a transparent substrate, a switching element, an insulating layer and a pixel electrode. The switching element includes a gate electrode formed on the transparent...
7316968 Methods of forming semiconductor devices having multiple channel MOS transistors  
In a method of manufacturing a semiconductor device, a preliminary active pattern including gate layers and channel layers is formed on a substrate. The gate layers and the channel layers are...
7314818 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment  
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump....
7314816 Masking layer in substrate cavity  
A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package...
7291532 Low resistance contact in a semiconductor device  
In a method for manufacturing a contact electrically contacting an electrically conductive silicon structure, a substrate with a surface is provided, the substrate having the silicon structure at...
7288475 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner  
The present invention provides a method of forming a rigid interconnect structure, and the device therefrom, including the steps of providing a lower metal wiring layer having first metal lines...
7282440 Integrated circuit contact  
A process is provided for forming vertical contacts in the manufacture of integrated circuits and devices so manufactured. The process eliminates the need for precise mask alignment and allows the...
7279418 Plastically deformable irreversible storage medium and method of producing one such medium  
The storage medium comprises an array of memory cells (3) which can be addressed by first (1) and second (2) conductors. Each memory cell (3) comprises one zone (10) of an active layer (8) which...
7279419 Formation of self-aligned contact plugs  
Methods of forming a contact structure for semiconductor assemblies are described. One method provides process steps to create an inner dielectric isolation layer after the contact region is...
7279231 Electroless plating structure  
The present invention relates to a cobalt electroless plating bath composition. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect...
7273811 Method for chemical vapor deposition in high aspect ratio spaces  
A method of depositing conformal film into high aspect ratio spaces includes the step of forming a gradient of precursor gas inside the space(s) prior to deposition. The gradient may be formed,...
7259071 Semiconductor device with dual gate oxides  
A method for making a semiconductor device having a first active region and a second active region includes providing first and second isolation structures defining the first active region on a...
7256123 Method of forming an interface for a semiconductor device  
In a semiconductor device using a polysilicon contact, such as a poly plug between a transistor and a capacitor in a container cell, an interface is provided where the poly plug would otherwise...
7256119 Semiconductor device having trench structures and method  
In one embodiment, a pair of sidewall passivated trench contacts is formed in a substrate to provide electrical contact to a sub-surface feature. A doped region is diffused between the pair of...
7250363 Aligned dummy metal fill and hole shapes  
Aligning metal fill shapes with corresponding holes of a metal shield is provided. The holes of the metal shield are laid out corresponding to a pre-selected grid referenced to a pre-selected...
7247562 Semiconductor element, semiconductor device and methods for manufacturing thereof  
The present invention provides a method of manufacturing a semiconductor element having a miniaturized structure and a semiconductor device in which the semiconductor element having a miniaturized...
7235475 Semiconductor nanowire fluid sensor and method for fabricating the same  
Nanowire fluid sensors are provided. The fluid sensors comprise a first electrode, a second electrode, and at least one nanowire between the first electrode and the second electrode. Each nanowire...
7227254 Integrated circuit package  
A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal...
7226854 Methods of forming metal lines in semiconductor devices  
Methods of forming metal lines in semiconductor devices are disclosed. One example method may include forming lower metal lines and forming an insulation layer on the lower metal lines; etching...
7226851 Method for manufacturing semiconductor device and non-volatile memory  
A method for manufacturing semiconductor device is provided. First, a substrate is provided. Then, a plurality of first gate lines disposed in parallel to each other and a first dummy gate line...
7227171 Small area contact region, high efficiency phase change memory cell and fabrication method thereof  
A contact structure, including a first conducting region having a first thin portion with a first sublithographic dimension in a first direction; a second conducting region having a second thin...
7214602 Method of forming a conductive structure  
A method of forming a conductive structure is disclosed. The method includes forming an interconnect in a substrate, and forming a layer of iridium on the interconnect. The layer of iridium has a...
7211496 Freestanding multiplayer IC wiring structure  
A dielectric wiring structure and method of manufacture therefor. The wiring structure includes air dielectric formed in a hemisphere. The wiring structure also includes, in embodiments, a method...
7205227 Methods of forming CMOS constructions  
The invention includes methods for forming electrical connections associated with semiconductor constructions. A semiconductor substrate is provided which has a conductive line thereover, and...
7199043 Method of forming copper wiring in semiconductor device  
Disclosed in a method of forming a copper wiring in a semiconductor device. A copper layer buries a damascene pattern in which an interlayer insulating film of a low dielectric constant. The...
7195989 Electrochemical fabrication methods using transfer plating of masks  
Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at...
7183606 Flash memory cell and manufacturing method thereof  
A flash memory cell including a p-type substrate, an n-type deep well, a stacked gate structure, a source region, a drain region, a p-type pocket doped region, spacers, a p-type doped region and a...
7179732 Interconnection structure and fabrication method thereof  
An interconnection structure and a fabrication method thereof. A first organic low-k material layer, a stress redistribution layer, a second organic low-k dielectric layer are formed in sequence...
7176131 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same  
An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged....
7163883 Edge seal for a semiconductor device  
An edge seal around the periphery of an integrated circuit device which environmentally protects the copper circuitry from cracks that may form in the low-k interlevel dielectric during dicing....
7157369 Semiconductor device and method of manufacturing thereof  
There is provided a method of manufacturing a semiconductor device that can reduce the number of processes, and decrease contact resistance between plugs. The method comprises forming a first...
7148140 Partial plate anneal plate process for deposition of conductive fill material  
A method of fabricating a semiconductor device is provided. An interlayer dielectric layer is formed on one or more semiconductor layers (402). One or more feature regions are formed in the...
7144799 Method for pre-retaining CB opening  
Disclosed is a method for pre-retaining CB opening in a DRAM manufacture process, wherein a CB opening is filed with a photo-resist layer and an LPD oxidation layer that is filled at room...
7125798 Circuit device and manufacturing method of circuit device  
After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted,...