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7943514 Integrated circuits having TSVs including metal gettering dielectric liners  
An IC includes a substrate having a semiconductor top surface and a bottom surface, wherein the semiconductor top surface includes one or more active circuit components and a plurality of through...
7943504 Self-releasing spring structures and methods  
According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the...
7935630 Wiring structure and wiring designing method  
A designing method of a semiconductor device having a first wire and a second wire with a plurality of vias includes determining a first life time change rate of the semiconductor device in...
7932178 Integrated circuit having a plurality of MOSFET devices  
A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second...
7928577 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same  
Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At...
7923294 Semiconductor package and method for manufacturing the same for decreasing number of processes  
A semiconductor package and a method for manufacturing the same. The semiconductor package includes a semiconductor chip having bonding pads; a first insulation layer pattern; redistribution line...
7923371 Method of manufacturing semiconductor device having contact plugs  
A semiconductor device has a semiconductor substrate in which a plurality of device regions and a plurality of device isolation regions are alternately formed to extend in a first direction; and a...
7910460 Metallic electrode forming method and semiconductor device having metallic electrode  
A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening;...
7910478 Method of manufacturing semiconductor devices  
A method of manufacturing a semiconductor device, forms connection pads electrically connected to integrated circuit portion formed in a semiconductor substrate, lays an insulating film and a...
7884016 Liner materials and related processes for 3-D integration  
In some embodiments, a low-k dielectric film liner, preferably comprising benzocyclobutene, is deposited on the sidewalls of through-silicon vias used in three-dimensional (3-D) integration of...
7884019 Poison-free and low ULK damage integration scheme for damascene interconnects  
A method of forming a dual-damascene structure is disclosed. A lower dielectric hardmask layer and an upper dielectric hardmask layer are deposited on an ultra low-k film. A first via is formed in...
7880763 Semiconductor device and manufacturing method therefor  
A semiconductor device is obtained, in which excellent characteristics are achieved, the reliability is improved, and an SiC wafer can also be used for the fabrication. A plurality of...
7879655 Semiconductor device and a manufacturing method of the same  
A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines...
7875545 Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices  
A method of producing an ohmic contact and a resulting ohmic contact structure are disclosed. The method includes the steps of forming a deposited film of nickel and silicon on a silicon carbide...
7868461 Embedded interconnects, and methods for forming same  
The present invention relates to a semiconductor device comprising first and second active device regions that are located in a semiconductor substrate and are isolated from each other by an...
7868312 Semiconductor memory device and manufacturing method thereof  
A semiconductor memory device is provided in which a phase-change layer can be formed stably and electric current required to cause the phase change of the phase-change layer can be reduced. An...
7868243 Method for producing a nanostructure based on interconnected nanowires, nanostructure and use as thermoelectric converter  
Method for producing a nanostructure based on interconnected nanowires, nanostructure and use as thermoelectric converter The nanostructure comprises two arrays of nanowires made from respectively...
7863111 Thin film transistor for display device including a dispersed carbon nanotube dispersed conductive polymer and manufacturing method of the same  
Provided are a thin film transistor for display devices and a manufacturing method of the thin film transistor. The thin film transistor for display devices includes: a flexible substrate; a gate...
7858439 Stacked semiconductor package and method for manufacturing the same  
Disclosed are a stacked semiconductor package and a method for manufacturing the same. The method for manufacturing a stacked semiconductor package includes preparing a substrate formed with a...
7855421 Embedded phase-change memory and method of fabricating the same  
An embedded memory required for a high performance, multifunction SOC, and a method of fabricating the same are provided. The memory includes a bipolar transistor, a phase-change memory device and...
7855463 Method for producing a circuit module comprising at least one integrated circuit  
An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further...
7851361 Laser ablation to selectively thin wafers/die to lower device RDSON  
A laser ablated wafer for a semiconductor device, such as a MOSFET or other power device, and a method of producing such a wafer to achieve a lower electrical resistance are provided. The method...
7843071 Semiconductor device including wiring and manufacturing method thereof  
A semiconductor construct is provided which has a semiconductor substrate, an external connection electrode, and an electrode enveloping layer for enveloping the external connection electrode....
7842613 Methods of forming microelectronic packaging substrates having through-substrate vias therein  
Methods of forming a substrate for microelectronic packaging may include electroplating a metal seed layer onto a sidewall of a trench extending through the substrate. The sidewall may be...
7838419 Systems and methods to laminate passives onto substrate  
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer,...
7838412 Method for manufacturing a semiconductor device  
A manufacturing method of a semiconductor device wherein a metal pad is etched to form a trench in which a central part is concave in form, or to form a trench in the shape of a cylinder or a...
7830025 Contact layout structure  
A contact layout structure includes a substrate having at least a first region defined thereon, plural sets of first contact layouts positioned along a predetermined direction in the first region,...
7825403 Circuit board including a substrate with a recessed portion and manufacturing method thereof, electro-optical device and electronic apparatus  
A circuit board includes: a substrate; source and drain electrodes formed on the substrate; an organic semiconductor layer formed on the source and drain electrodes; a gate insulating layer formed...
7825398 Memory cell having improved mechanical stability  
Memory cells are described along with methods for manufacturing. A memory cell described herein includes a bottom electrode comprising a base portion and a pillar portion on the base portion, the...
7816175 Nano-elastic memory device and method of manufacturing the same  
A nano-elastic memory device and a method of manufacturing the same. The nano-elastic memory device may include a substrate, a plurality of lower electrodes arranged in parallel on the substrate,...
7812439 Semiconductor package with reduced length interconnect and manufacturing method thereof  
A semiconductor apparatus includes a semiconductor chip, a wired board, a plurality of bump electrodes, a plurality of external terminals, and insulating material. The semiconductor chip includes...
7811932 3-D semiconductor die structure with containing feature and method  
A die-on-die assembly has a first die (10) and a second die (50). The first die (10) has a first contact extension (28,42) and a peg (32,44,45) extending a first height above the first die. The...
RE41801 Thin-film thermoelectric device and fabrication method of same  
A termoelectric thermoelectric device and method for manufacturing the thermoelectric device. The thermoelectric thermoelectric device includes at least one deposited film of a thermoelectric...
7804167 Wire bond integrated circuit package for high speed I/O  
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the...
7800172 Methods of forming semiconductor devices having multiple channel MOS transistors and related intermediate structures  
In a method of manufacturing a semiconductor device, a preliminary active pattern including gate layers and channel layers is formed on a substrate. The gate layers and the channel layers are...
7800232 Metallic electrode forming method and semiconductor device having metallic electrode  
A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening;...
7781338 Semiconductor device manufacturing method and semiconductor device  
The present invention provides a method for forming a semiconductor device, which comprises the steps of preparing a semiconductor wafer including an electrode pad, an insulating film formed with...
7772101 Phase-change memory device and method for manufacturing the same  
A phase-change memory device and a fabrication method thereof, capable of reducing driving current while minimizing a size of a contact hole used for forming a PN diode in the phase-change memory...
7772622 Field effect transistor and manufacturing method thereof  
A manufacturing method of a field effect transistor in which, a patterned gate electrode is provided on a substrate, and a gate insulator is provided on the substrate and the gate electrode, a...
7772065 Semiconductor memory device including a contact with different upper and bottom surface diameters and manufacturing method thereof  
A semiconductor memory device includes diffusion regions formed in an active region; cell contacts connected to the diffusion regions, respectively; pillars connected to the cell contacts,...
7767493 Post & penetration interconnection  
A method of physically and electrically joining two chips to each other involves aligning an electrically conductive contact of a first chip with a corresponding electrically conductive contact on...
7767568 Phase change memory device and method of fabricating the same  
A phase change memory device and method of manufacturing the same is provided. A first electrode having a first surface is provided on a substrate. A second electrode having a second surface at a...
7767516 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna  
An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles...
7759247 Manufacturing method of semiconductor device with a barrier layer and a metal layer  
This invention provides a semiconductor device and a manufacturing method thereof which can minimize deterioration of electric characteristics of the semiconductor device without increasing an...
7754606 Shielded capacitor structure  
A method and apparatus if provided for shielding a capacitor structure formed in a semiconductor device. In a capacitor formed in an integrated circuit, one or more shields are disposed around...
7754607 Method for manufacturing a liquid crystal display  
A method for manufacturing a liquid crystal display, the method includes steps of depositing a transparent conductive layer, forming a pixel electrode, and four bottom layers, depositing a...
7754596 Semiconductor device preventing electrical short and method of manufacturing the same  
A semiconductor device capable of preventing an electrical short between contacts and their adjacent contact pads and a method of manufacturing the same are provided. A first interlayer insulating...
7749816 Systems and arrangements to interconnect components of a semiconductor device  
Systems and arrangements to interconnect cells and structures within cells of an integrated circuit to enhance cell density are disclosed. Embodiments comprise an adjusted polysilicon gate pitch...
7732260 Semiconductor device power interconnect striping  
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used...
7713871 System for contacting electronic devices and production processes thereof  
An embodiment of a system for contacting at least one electronic device having a plurality of contact elements is proposed. The system includes a substrate having a main surface and a plurality of...