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8822335 Semiconductor device with air gap and method for fabricating the same  
A method for fabricating a semiconductor device includes forming a semiconductor structure having an open portion over a substrate, forming a sacrificial spacer on sidewalls of the open portion,...
8815723 Process for enhancing image quality of backside illuminated image sensor  
A method of forming an image sensor device includes forming a light sensing region at a front surface of a silicon substrate and a patterned metal layer there over. Thereafter, the method also...
8816515 Semiconductor module having sliding case and manufacturing method thereof  
There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one...
8810024 Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units  
A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted...
8796135 Microelectronic elements with rear contacts connected with via first or via middle structures  
A microelectronic unit includes a microelectronic element, e.g., an integrated circuit chip, having a semiconductor region of monocrystalline form. The semiconductor region has a front surface...
8796137 Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect  
A semiconductor device has a first semiconductor die with a sloped side surface. The first semiconductor die is mounted to a temporary carrier. An RDL extends from a back surface of the first...
8790953 Method for texturing silicon surface to create black silicon for photovoltaic applications  
The surface of silicon is textured to create black silicon on a nano-micro scale by electrochemical reduction of a silica layer on silicon in molten salts. The silica layer can be a coating, or a...
8786094 Semiconductor devices and methods of manufacture thereof  
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece and a plurality of first conductive lines disposed over the...
8786093 Chip package and method for forming the same  
An embodiment of the invention provides a chip package which includes: a substrate; a device region disposed in or on the substrate; a signal pad disposed in or on the substrate and electrically...
8778790 Manufacturing method of semiconductor device and semiconductor device  
A rewiring is formed by forming a Cu seed layer of copper over an opening and insulating films, forming a photoresist film over the Cu seed layer, a step of forming copper film by plating-growth...
8778798 Electronic device package and fabrication method thereof  
An electronic device package is disclosed. The package includes at least one semiconductor chip having a first surface and a second surface opposite thereto, in which at least one redistribution...
8779574 Semiconductor die including a current routing line having non-metallic slots  
A semiconductor die that includes a plurality of non-metallic slots that extend through a current routing line is disclosed. The semiconductor die comprises a semiconductor circuit that includes a...
8765604 Interconnection structure for an integrated circuit  
The disclosure relates to a method of fabricating an interconnection structure of an integrated circuit, comprising the steps of: forming a first conductive element within a first dielectric...
8765511 Semiconductor device and method for manufacturing the same  
A method for manufacturing a semiconductor device including at least one of the following steps: (1) Forming a lower electrode pattern on/over a substrate. (2) Forming a first interlayer...
8754503 Substrate strip plate structure for semiconductor device and method for manufacturing the same  
The present invention provides a strip plate structure and a method for manufacturing the same. The strip plate structure comprises a strip plate array, which comprises a plurality of strip plates...
8754530 Self-aligned borderless contacts for high density electronic and memory device integration  
A method for fabricating a transistor having self-aligned borderless electrical contacts is disclosed. A gate stack is formed on a silicon region. An off-set spacer is formed surrounding the gate...
8748312 Method of manufacturing substrate for mounting electronic device  
A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode...
8748310 Method for producing a metal contact structure of a photovoltaic solar cell  
A method for producing a metal contact structure of a photovoltaic solar cell, including: applying an electrically non-conductive insulating layer to a semiconductor substrate, applying a metal...
8742602 Vertical electrical interconnect formed on support prior to die mount  
A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into...
8741751 Double contacts for carbon nanotubes thin film devices  
A method of fabricating a semiconductor device is disclosed. A first contact layer of the semiconductor device is fabricated. An electrical connection is formed between a carbon nanotube and the...
8743559 Interconnect pattern for semiconductor packaging  
An interconnect array is described. The interconnect array comprises a pattern of adjacent interconnect tiles, each interconnect tile comprising ten interconnect locations including eight I/O...
8741774 Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough  
A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the...
8741767 Method of forming semiconductor device  
A semiconductor device includes a semiconductor substrate including a cell region and a core region adjacent to the cell region, active regions in the cell region and the core region, an...
8742526 Photoelectric conversion device  
A photoelectric conversion device including a substrate, a photoelectric conversion element including a first electrode, a second electrode and an organic compound layer and a sealing member that...
8735285 Method for providing electrical connections to spaced conductive lines  
An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact...
8735289 Method of contacting a doping region in a semiconductor substrate  
According to an embodiment, a method for manufacturing a semiconductor device is provided. The method includes providing a mask layer which is used as an implantation mask when forming a doping...
8728927 Borderless contacts for semiconductor transistors  
Embodiments of the invention include methods of forming borderless contacts for semiconductor transistors. Embodiments may include providing a transistor structure including a gate, a spacer on a...
8729592 Semiconductor light emitting device  
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a first insulating layer, a first interconnect layer, a...
8722536 Fabrication method for circuit substrate having post-fed die side power supply connections  
A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the...
8722535 Pattern forming method, mold and data processing method  
According to one embodiment, a pattern forming method is disclosed. The method can include forming an insulating layer on a major surface of a substrate. The method can include forming first and...
8716857 Split loop cut pattern for spacer process  
A semiconductor fabrication technique cuts loops formed in a spacer pattern. The spacer pattern is a split loop pattern which generally includes a symmetric arrangement of one or more loops in...
8716867 Forming interconnect structures using pre-ink-printed sheets  
A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The...
8710675 Integrated circuit package system with bonding lands  
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent...
8710667 Semiconductor device  
A semiconductor device includes a first interconnect layer and a second interconnect layer provided above or under the first interconnect layer. The first interconnect layer includes a plurality...
8710666 Semiconductor device and method for fabricating the same  
A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip...
8710520 Light emitting diode having multi-cell structure and method of manufacturing the same  
Disclosed is a light emitting diode having a multi-cell structure including a number of unit cells. The light emitting diode is capable of reducing light loss of the light emitting diode surface...
8703608 Control of local environment for polysilicon conductors in integrated circuits  
A method of fabricating gate level electrodes and interconnects in an integrated circuit, and an integrated circuit so fabricated, with improved process margin for the gate level interconnects of...
8703573 Semiconductor device and method of manufacturing the same  
A method of manufacturing the semiconductor device includes sequentially forming first to third mold layer patterns on a substrate and spaced apart from each other, forming a first semiconductor...
8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame  
The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of...
8698315 Semiconductor device  
When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in...
8697476 Processes and compositions for forming photovoltaic devices with base metal buss bars  
A photovoltaic cell such as a solar cell is disclosed. The cell comprises (a) a semiconductor substrate having a front surface, (b) one or more anti-reflection coating layers on the front surface...
8691610 Semiconductor device and method for manufacturing the same  
A method of manufacturing a semiconductor device including at least one of the following steps: (1) Forming a plurality of lower electrodes over a substrate. (2) Forming a first stop film over the...
8686385 Phase-change random access memory device and method of manufacturing the same  
The PCRAM device includes a semiconductor substrate including a switching device; an interlayer insulating layer having a heating electrode contact hole exposing the switching device, a heating...
8680677 Carbon nanotube-based conductive connections for integrated circuit devices  
Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with...
8679974 Method for fabricating interconnecting lines inside via holes of semiconductor device  
A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the...
8669178 Semiconductor device, circuit substrate, and electronic device  
A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode...
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same  
A method for forming semiconductor devices using damascene techniques provides self-aligned conductive lines that have an end-to-end spacing less than 60 nm without shorting. The method includes...
8669582 Light emitting diode  
Disclosed is a light emitting device a light transmissive substrate, a light emitting structure disposed on the light transmissive substrate, comprising a first conductive type semiconductor...
8664106 Method of manufacturing semiconductor device  
A method of manufacturing a semiconductor device, wherein a first substrate where first electrode pads are formed and a second substrate where second electrode pads are formed are stacked and the...
8658524 On-gate contacts in a MOS device  
A MOS device, (400) comprising a semiconductor substrate comprising a channel, an electrode (402) insulated from the channel and positioned at least partly over the channel, and at least one...