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7632746 |
Method for patterning metal line in semiconductor device
A method for patterning a metal line includes forming a barrier metal layer and a metal layer, etching the metal layer, etching the barrier metal layer to form a passivation layer on an etched...
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7629253 |
Method for implementing diffusion barrier in 3D memory
One or more diffusion barriers are formed around one or more conductors in a three dimensional or 3D memory cell. The diffusion barriers allow the conductors to comprise very low resistivity...
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7626264 |
Substrate for device bonding and method for manufacturing same
A substrate for device bonding is provided, which enables bonding of a device with high bond strength to an Au electrode formed on a substrate such as aluminum nitride by soldering the device at a...
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7615474 |
Method for manufacturing semiconductor device with reduced damage to metal wiring layer
A method for manufacturing a semiconductor device includes (a) forming a conductive film on a first surface having an electrode of a semiconductor substrate having an integrated circuit formed...
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7605079 |
Manufacturing method for phase change RAM with electrode layer process
A method for manufacturing a phase change memory device comprises forming an electrode layer. Electrodes are made in the electrode layer using conductor fill techniques that are also used...
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7605460 |
Method and apparatus for a power distribution system
A method and apparatus is provided to reduce the spreading inductance and increase the distributed capacitance of power planes within the power distribution system of a semiconductor package...
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7575994 |
Semiconductor device and manufacturing method of the same
The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film...
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7576706 |
Image display device including two display panels and method of manufacturing the same
An image display device includes a driving unit to provide first and second image signals and first and second control signals to display images, a first display unit to display first images in...
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7576005 |
Dense seed layer and method of formation
Methods of forming dense seed layers and structures thereof are provided. Seed layers including a monolayer of molecules having a density of about 0.5 or greater may be manufactured over a metal...
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7566975 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes a semiconductor substrate, a copper-containing metal interconnect over the semiconductor substrate, and a copper-containing connection plug, and the metal...
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7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
In an enhanced technique for electroless metal deposition, the substrate is heated to or above the operating temperature for the specific plating solution, while the plating solution may be...
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7553754 |
Electronic device, method of manufacture of the same, and sputtering target
In an electronic device comprising a first electrodes consisting of a metal oxide and a second electrode consisting of an aluminum alloy film directly contacted and electrically connected to the...
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7553750 |
Method for fabricating electrical conductive structure of circuit board
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically...
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7550328 |
Method for production of thin-film semiconductor device
Disclosed herein is a method for production of a thin-film semiconductor device which includes, a first step to form a gate electrode on a substrate, a second step to form a gate insulating film of...
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7550380 |
Electroless plating of metal caps for chalcogenide-based memory devices
A method of forming a metal cap over a conductive interconnect in a chalcogenide-based memory device is provided and includes, forming a layer of a first conductive material over a substrate,...
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7547623 |
Methods of forming lead free solder bumps
Methods of forming an electronic device may include forming an under bump seed metallurgy layer on an electronic substrate. A nickel layer may be formed on the under bump seed metallurgy layer so...
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7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
A first conductive layer is formed. An insulating layer is formed so that at least a part of the insulating layer is disposed on the first conductive layer. A second conductive layer is formed so...
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7520049 |
Method for manufacturing a planar resistance heating element
Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance...
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7517785 |
Electronic interconnects and methods of making same
A method for making an interconnect is provided. The method includes depositing a conductive layer on a substrate, depositing a protective layer on the conductive layer, patterning the protective...
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7514355 |
Multilayer interconnection structure and method for forming the same
A multilayer interconnection structure of the present invention includes first interconnection, second interconnection belonging to an interconnection layer different from an interconnection layer...
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7514354 |
Methods for forming damascene wiring structures having line and plug conductors formed from different materials
Methods are provided for forming dual damascene interconnect structures using different conductor materials to fill via holes and line trenches. For example, a method for forming an interconnection...
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7507660 |
Deposition processes for tungsten-containing barrier layers
In one embodiment, a method for forming a barrier material on a substrate is provided which includes exposing a dielectric layer on the substrate to a plasma during a preclean process, wherein the...
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7504287 |
Methods for fabricating an integrated circuit
A method is provided for fabricating a semiconductor device which includes a first contact point and a second contact point located above the first contact point. A first material layer is...
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7501328 |
Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of...
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7501334 |
Semiconductor devices having a pocket line and methods of fabricating the same
In one embodiment, a semiconductor device comprises an active region isolated by a device isolation layer placed in a semiconductor substrate having a main surface. A molding hole is placed in the...
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7494924 |
Method for forming reinforced interconnects on a substrate
A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support...
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7479451 |
Display device manufacturing method preventing diffusion of an aluminum element into a polysilicon layer in a heating step
The present invention prevents the diffusion of an aluminum element into a polysilicon layer in a heating step when an aluminum-based conductive layer is used in a source/drain electrode which is...
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7479394 |
MgO/NiFe MTJ for high performance MRAM application
An improved tunneling barrier layer is formed for use in a MTJ device. This is accomplished by forming the tunneling barrier layer in two steps. First a layer of magnesium is deposited by DC...
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7473643 |
Dendrite growth control circuit
A circuit is provided which prevents dendrite formation on interconnects during semiconductor device processing due to a dendrite-forming current. The circuit includes a switch located in at least...
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7470619 |
Interconnect with high aspect ratio plugged vias
Described is a method for forming a stackable interconnect. The interconnect is formed by depositing a first contact on a substrate; depositing a seed layer (SL) on the substrate; depositing a...
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7468319 |
Method for preventing a metal corrosion in a semiconductor device
The present invention relates to a method for preventing a metal corrosion in a semiconductor device. The present method includes the steps of etching of a metal layer in a chamber, the metal layer...
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7468316 |
Low fabrication cost, fine pitch and high reliability solder bump
A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the...
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7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating
The idea of the invention is to coat the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring by a 1-20 nm thick metal layer prior to deposition of the interlevel...
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7462523 |
Semiconductor memory device and method for manufacturing the same
A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower...
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7462942 |
Die pillar structures and a method of their formation
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
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7456092 |
Self-releasing spring structures and methods
According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing...
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7446006 |
Semiconductor fabrication process including silicide stringer removal processing
A semiconductor fabrication process includes forming a gate electrode ( 112 ) overlying a gate dielectric ( 114 ) overlying a semiconductor substrate ( 104 ) of a wafer ( 101 ) and a liner...
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7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from...
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7435672 |
Metal-germanium physical vapor deposition for semiconductor device defect reduction
The present invention provides a method of manufacturing a metal silicide electrode ( 100 ) for a semiconductor device ( 110 ). The method comprises depositing by physical vapor deposition,...
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7435680 |
Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal...
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7436067 |
Methods for forming conductive structures and structures regarding same
A method for forming a metal/metal oxide structure that includes forming metal oxide regions, e.g., ruthenium oxide regions, at grain boundaries of a metal layer, e.g., platinum. Preferably, the...
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7427543 |
Method to improve drive current by increasing the effective area of an electrode
The present invention provides source/drain electrode 100 for a transistor 105 . The source/drain electrode 100 comprises a plurality of polysilicon grains 100 located over a source/drain...
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7416975 |
Method of forming contact layers on substrates
A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method...
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7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads
A metal structure ( 100 ) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer ( 102 ). The substrate is protected by an insulating overcoat ( 104 ). The...
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7411298 |
Source/drain electrodes, thin-film transistor substrates, manufacture methods thereof, and display devices
A source/drain electrode is used in a thin-film transistor substrate containing a substrate, a thin-film transistor semiconductor layer, source/drain electrodes, and a transparent picture...
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7407883 |
Electronic package with improved current carrying capability and method of forming the same
An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing...
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7399706 |
Manufacturing method of semiconductor device
There is here disclosed a manufacturing method of a semiconductor device, comprising providing a first film by a PVD process in a recess formed in at least one insulating film, the first film...
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7396763 |
Semiconductor package using flexible film and method of manufacturing the same
A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded...
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7396750 |
Method and structure for contacting two adjacent GMR memory bit
A method and a structure are provided for improving the contact of two adjacent GMR memory bits. Two adjacent bit ends are connected by utilizing a single via.
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7375014 |
Methods of electrochemically treating semiconductor substrates
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second...
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