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9041850 Camera module for tilt balance of lens  
The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light...
9035173 Back electrode type solar cell, back electrode type solar cell with interconnection sheet, solar cell module, method of manufacturing back electrode type solar cell with interconnection sheet, and method of manufacturing solar cell module  
A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar...
9029968 Optical sensor device  
An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate...
9029183 Method and apparatus for image sensor packaging  
Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be...
9024344 Surface passivation by quantum exclusion using multiple layers  
A semiconductor device has a multilayer doping to provide improved passivation by quantum exclusion. The multilayer doping includes at least two doped layers fabricated using MBE methods. The...
9019421 Method of manufacturing a miniaturization image capturing module  
A method of manufacturing a miniaturization image capturing module includes adhesively placing a double side adhesive element onto a carrier board; adhesively placing an image capturing chip onto...
9012264 Integrated circuit package including embedded thin-film battery  
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated...
9000572 Semiconductor package  
A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an...
8999743 Manufacture of solar cell module  
A solar cell module is manufactured by forming silicone coating films (2, 2) on panels (1a, 1b), placing a solar cell matrix (3) on the silicone coating film on panel (1a), providing a seal member...
8993365 Wafer packaging method  
A wafer packaging method includes the following steps. A wafer having a plurality of integrated circuit units is provided. A first surface of the wafer opposite to the integrated circuit units is...
8993364 Integrated thin film solar cell interconnection  
Photovoltaic modules may include multiple flexible thin film photovoltaic cells electrically connected in series, and laminated to a substantially transparent top sheet having a conductive grid...
8987029 Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures  
A method of protecting a substrate during fabrication of semiconductor, MEMS devices. The method includes application of a protective thin film which typically has a thickness ranging from 3...
8980673 Solar cell and method of manufacturing the same  
Provided are a solar cell and a method of manufacturing the same. The method of manufacturing the solar cell includes stacking a solar cell device layer containing GaN on a sacrificial substrate,...
8981387 Light emitting diode assembly having a deformable lens  
A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base,...
8981206 Solar cell device  
A photovoltaic cell including: (a) a housing including an at least partially transparent cell wall having an interior surface; (b) an electrolyte, containing an iodide based species; (c) a...
8980674 Image sensor with improved dark current performance  
Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate that includes an array region and a black level correction region. The array region...
8976291 Image sensor module with substrate defining gas pressure relieving hole and camera module using same  
An image sensor module includes a ceramic substrate, an image sensor, and a filter. The ceramic substrate defines a light transmitting hole and a receiving recess communicating with the light...
8975694 Low resistance power switching device  
A semiconductor device includes a semiconductor substrate with doped regions of a first type and doped regions of a second type. A first metallization layer connects to the doped regions of the...
8969120 Two-stage packaging method of image sensors  
A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a...
8962370 Radiation detector and method of manufacturing the same  
A radiation detector includes a sensor substrate and a scintillator layer. The sensor substrate is configured to be capable of performing photoelectric conversion. The scintillator layer includes...
8955219 Method for fabricating a bond  
The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at...
8956914 Integrated circuit package system with overhang die  
An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the...
8953088 Low profile camera module packaging  
A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and...
8946797 Solid-state imaging device, method of manufacturing solid-state imaging device, apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and electronic device  
There is provided a solid-state imaging device including a sensor substrate having a sensor-side semiconductor layer including a pixel region in which a photoelectric conversion section is...
8946743 Light emitting apparatus  
Disclosed is a light emitting apparatus. The light emitting apparatus includes a package body; first and second electrodes; a light emitting device electrically connected to the first and second...
8937362 Semiconductor device having a reinforcing member for filling a gap between a semiconductor chip and a cover member and manufacturing method for semiconductor device  
An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a...
8933524 Sealing material for solar cell, protective sheet for solar cell, and process for production of solar cell module  
The present invention provides a sealing material for a solar cell that seals a solar cell element of a solar cell in a short time in the production of a solar cell module, thereby enabling...
8927851 Solar cell module and method of manufacturing solar cell module  
Disclosed is a solar cell module that includes: a plurality of solar cells connected with one another in such a manner that electrodes formed on surfaces of neighboring solar cells are connected...
8927319 Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth  
There is disclosed methods of making photosensitive devices, such as flexible photovoltaic (PV) devices, through the use of epitaxial liftoff. Also described herein are methods of preparing...
8927318 Spalling methods to form multi-junction photovoltaic structure  
A method cleaving a semiconductor material that includes providing a germanium substrate having a germanium and tin alloy layer is present therein. A stressor layer is deposited on a surface of...
8921146 Method for manufacturing optical image stabilizer employing scratch drive actuator  
A method for an optical image stabilizer including: providing an SOI wafer substrate which has a plurality of cells, the SOI wafer substrate including an insulating layer, and first and second...
8916397 Method for producing an electronic component and electronic component  
A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at...
8908091 Alignment of lens and image sensor  
Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed...
8900910 Rear-face illuminated solid state image sensors  
A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a...
8900906 Atomic layer deposition strengthening members and method of manufacture  
In one embodiment, a method of forming a semiconductor device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a first trench in the sacrificial...
8896080 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Sealing material for solar cell, protective sheet for solar cell, and process for production of solar cell module
 
The present invention provides a sealing material for a solar cell that seals a solar cell element of a solar cell in a short time in the production of a solar cell module, thereby enabling...
8889458 Method of converting power using a power semiconductor module  
A method of converting power using a power semiconductor module includes conducting power to power semiconductor devices; converting the conducted power with the power semiconductor devices;...
8883540 Method for manufacturing photovoltaic module formed on corrugated-sheet building material  
A method for manufacturing a photovoltaic module formed on a corrugated-sheet building material includes: shaping a base board in a manner that the base board thus shaped takes on a...
8877552 Method and apparatus for manufacturing electronic integrated circuit chip  
A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the...
8878116 Method of manufacturing solid-state imaging element, solid-state imaging element and electronic apparatus  
A method of manufacturing a solid-state imaging element includes: manufacturing an element chip in which photoelectric conversion units are arranged on a main surface side; preparing a base...
8877540 Solar cell module and manufacturing method of solar cell module  
A solar cell module includes a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface...
8871553 Photovoltaic device  
A moisture trapping filler composition may include a filler material combined with a desiccant material.
8865487 Large area hermetic encapsulation of an optoelectronic device using vacuum lamination  
Apparatus for accurately picking and placing one or more optoelectronic devices for vacuum lamination of materials in a way that minimizes stress to the materials.
8859391 Semiconductor device, method for manufacturing semiconductor device, method for laminating semiconductor wafers, and electronic device  
A method for manufacturing a semiconductor device including: forming a wiring layer on a surface side of a first semiconductor wafer; forming a buried film so as to fill in a level difference on...
8859885 Method for manufacturing photovoltaic cells with multiple junctions and multiple electrodes  
A photovoltaic device and method of manufacture of a photovoltaic device including an assembly of at least two photovoltaic cells; and a lamination material inserted between each photovoltaic...
8853732 Optoelectronic component  
The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a...
8852986 Integrated circuit package system employing resilient member mold system technology  
An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess...
8846444 Semiconductor package and method for manufacturing the same  
A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an...
8847243 Semiconductor package comprising an optical semiconductor device  
A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate....
RE45163 Multilayer composite films and articles prepared therefrom  
The present invention is an optically transparent laminate film comprising: at least three layers of film, wherein at least two of the at least three layers comprise ionomeric films, and wherein...