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7626247 |
Electronic package with integral electromagnetic radiation shield and methods related thereto
A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature,...
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7626167 |
Infrared sensor
A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In...
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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7615397 |
Micro-element package and manufacturing method thereof
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make...
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7608470 |
Interconnection device including one or more embedded vias and method of producing the same
“An interconnection device comprises a Systems In Package (SIP) device, or Systems in Chip (SIC) device, including one or more embedded vias extending through a base substrate. A process to...
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7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor
A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7592195 |
Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an...
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7588951 |
Method of packaging a semiconductor device and a prefabricated connector
A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the...
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7582954 |
Optical leadless leadframe package
Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first...
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7582505 |
Solid-state imaging device and method of manufacturing said solid-state imaging device
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present...
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7579583 |
Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
A size reduced solid-state imaging apparatus may be provided. The solid-state imaging apparatus may include a wiring substrate having a body having a cavity on an area which a semiconductor chip...
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7576403 |
Method of manufacturing infrared rays receiver and structure thereof
A method of manufacturing an infrared rays receiver comprises the steps of: chip attach; wire bonding; encapsulation; metal housing covering; encapsulation; pin cutting; and testing. A lead frame...
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7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial...
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7566588 |
Semiconductor device with a resin-sealed optical semiconductor element
To provide a semiconductor device 10 , which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10 A has a configuration such that in...
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7564033 |
Microstructured sensor
The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second...
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7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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7553688 |
Methods for packaging image sensitive electronic devices
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the...
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7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers...
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7547583 |
Light emitting diode package with direct leadframe heat dissipation
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has...
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7547571 |
Packaging method of a light-sensing semiconductor device and packaging structure thereof
The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer,...
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7534645 |
CMOS type image sensor module having transparent polymeric encapsulation material
A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate...
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7531845 |
Semiconductor light emitting device
A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin...
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7524696 |
Sensor including lead frame and method of forming sensor including lead frame
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
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7521279 |
Image projection at different image planes
An image projection module within a housing is operative for causing selected pixels in a raster pattern to be illuminated to produce an image at different image planes of VGA quality. A movable...
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7521271 |
Method of manufacturing a transponder
A method of manufacturing a transponder ( 1 ) where a transponder IC ( 2 ) comprising two IC contacts ( 7, 8 ) is brought into communication-capable connection, via each time one of the IC contacts...
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7520680 |
Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device
To provide a light-receiving element that is capable of high-speed operation and includes an optical element with controlled setting position, shape and size, a manufacturing method for the...
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7517712 |
Wafer-level hermetic micro-device packages
A method for manufacturing a hermetically sealed micro-device package encapsulating a micro-device. The package includes a transparent window allowing light to pass into and out of a cavity...
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7511374 |
Microelectronic imaging units having covered image sensors
Microelectronic imaging units having covered image sensors are disclosed herein. In one embodiment, the microelectronic imaging units have an image sensor, an integrated circuit, a cover located...
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7510889 |
Light emitting chip package and manufacturing method thereof
A method for manufacturing a light emitting chip package includes bonding a patterned metal plate having at least a thermal enhanced plate and many contacts around the same to a substrate and...
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7504278 |
Image sensor and method for manufacturing the same
An image sensor is disclosed where individual photo diodes of the respective unit cells separated by an element isolating layer are physically integrated into a single large scale pixel formed...
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7498678 |
Electronic assemblies and systems with filled no-flow underfill
High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The...
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7494848 |
Flip-chip packaging of a photo-sensor die on a transparent substrate
An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of...
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7485848 |
Optical device and production method thereof
An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The...
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7485489 |
Electronics circuit manufacture
A circuit with embedding components ( 13 ) is produced by placing the components ( 13 ) on a substrate ( 14 ) and applying sheets ( 15 ) of prepreg. The prepreg sheets ( 15 ) have apertures to...
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7479627 |
Semiconductor device having transparent member and manufacturing method of the same
A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving...
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7473578 |
Encapsulation for particle entrapment
A packaged micromechanical device ( 100 ) having a blocking material ( 116 ) encapsulating debris-generating regions thereof. The blocking material ( 116 ) prevents the generation of debris that...
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7470560 |
Image sensor having a charge storage region provided within an implant region
A deep implanted region of a first conductivity type located below a transistor array of a pixel sensor cell and adjacent a doped region of a second conductivity type of a photodiode of the pixel...
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7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing
In a method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing, the object of the invention is to...
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7468288 |
Die-level opto-electronic device and method of making same
The invention includes a die-level opto-electronic device with a semiconductor die and a photonic device including a conductive structure formed in the die away from the edges of the die. The...
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7465873 |
Solar cell module, method of laying solar cell modules, and apparatus for preventing solar cell modules from being blown off
In a method of laying tiles and a solar cell module on a roof, at least one waterproof member is laid between the solar cell module and one tile laid adjacent in the direction of gradient of the roof.
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7465603 |
Wafer level package structure of optical-electronic device and method for making the same
A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a...
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7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a...
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7445959 |
Sensor module and method of manufacturing same
The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.
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7425750 |
Snap lid camera module
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form...
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7422929 |
Wafer-level packaging of optoelectronic devices
In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on...
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7417309 |
Circuit device and portable device with symmetrical arrangement
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
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7416913 |
Methods of manufacturing microelectronic imaging units with discrete standoffs
Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies...
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7414661 |
CMOS image sensor using gradient index chip scale lenses
A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the...
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7410820 |
MEMS passivation with phosphonate surfactants
Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled...
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