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RE40983 |
Method to plate C4 to copper stud
A method for plating a second metal directly to a first metal without utilizing a mask. A semiconductor substrate is provided including at least one metal feature and at least one insulating layer...
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7615407 |
Methods and systems for packaging integrated circuits with integrated passive components
A method is described for packaging integrated circuit dice such that each package includes a die with an integrated passive component mounted to the active surface of the die.
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7611041 |
Semiconductor device, manufacturing method and apparatus for the same
A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is...
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7601627 |
Method for reduction of soft error rates in integrated circuits
A method for reduction of soft error rates in integrated circuits. The method including: providing a test device, the test device comprising: a semiconductor substrate; and a stack of one or more...
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7598620 |
Copper bonding compatible bond pad structure and method
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions...
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7598164 |
Method for direct bonding of metallic conductors to a ceramic substrate
A method to provide direct bonding of wires to silicon for microelectronic and micro-electromechanical systems (MEMS). The method includes preparing a rough “pothole” during one of the many...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7595556 |
Semiconductor device and method for manufacturing the same
Embodiments relate to a semiconductor device and a method for manufacturing the same. According to embodiments, the semiconductor device may include a semiconductor substrate formed with a metal...
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7595223 |
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic...
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7592246 |
Method and semiconductor device having copper interconnect for bonding
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
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7589010 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
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7585759 |
Technique for efficiently patterning an underbump metallization layer using a dry etch process
By patterning the underbump metallization layer stack on the basis of a dry etch process, significant advantages may be achieved compared to conventional techniques involving a highly complex wet...
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7575994 |
Semiconductor device and manufacturing method of the same
The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film...
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7572726 |
Method of forming a bond pad on an I/C chip and resulting structure
A method of forming wire bonds in (I/C) chips comprising: providing an I/C chip having a conductive pad for a wire bond with at least one layer of dielectric material overlying the pad; forming an...
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7563703 |
Microelectronic interconnect device comprising localised conductive pins
A method producing conductive rods localized on conductive blocks of an electronic component.
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7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the...
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7553753 |
Method of forming crack arrest features in embedded device build-up package and package thereof
A method of forming an embedded device build-up package ( 10 ) includes forming a first plurality of features ( 22 ) over a packaging substrate ( 12,16,18 ), wherein the first plurality of features...
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7553750 |
Method for fabricating electrical conductive structure of circuit board
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically...
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7550846 |
Conductive bump with a plurality of contact elements
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one...
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7550375 |
Method for forming metal bumps
A method for forming metal bumps is disclosed. Steps of the method include supplying a substrate containing a plurality of pads; forming a first photoresist layer on the substrate, herein the first...
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7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7547976 |
Electrode pad arrangement with open side for waste removal
A pad structure 100 includes an electrode pad (a first electrically conducting film 104 and a second electrically conducting film 110 ) and an insulating film provided over a peripheral region...
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7547625 |
Methods for bonding and micro-electronic devices produced according to such methods
One inventive aspect is related to a method of bonding two elements. The method comprises producing on a first element a first micropattern, comprising a first metal layer. The method further...
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7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same
A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer...
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7545038 |
Bumping process and bump structure
A bumping process comprises forming a passivation layer having a planarized surface covering a pad on a substrate, forming a hole penetrating through the passivation layer to expose a contact...
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7541275 |
Method for manufacturing an interconnect
The present invention provides an interconnect for use in an integrated circuit, a method for manufacturing the interconnect, and a method for manufacturing an integrated circuit including the...
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7538435 |
Wafer structure and bumping process
A wafer structure including a semiconductor substrate, elastic elements, under bump metallurgic (UBM) layers and bumps is provided. The semiconductor substrate has an active surface, and it...
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7538430 |
Semiconductor device and a method of manufacturing the same
A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is...
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7538022 |
Method of manufacturing electronic circuit device
The method of manufacturing an electronic circuit device according to an embodiment of the present invention includes preparing an interconnect substrate 10 including an interconnect 14 and an...
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7538019 |
Forming compliant contact pads for semiconductor packages
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes...
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7531442 |
Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
Different ways to reduce or eliminate the IMC cracking issues in wire bonded parts, including: changing to more compressive dielectric films for top, R1, and R2; changing the top passivation film...
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7528062 |
Integrated matching network and method for manufacturing integrated matching networks
An integrated matching network and method for manufacturing an integrated matching network are provided. The method includes forming ( 405 ) a first die on a substrate, forming ( 410 ) a second die...
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7528061 |
Systems and methods for solder bonding
Systems and methods for solder bonding that employ an equilibrium solidification process in which the solder is solidified by dissolving and alloying metals that raise the melting point temperature...
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7521811 |
Substrate for packaging semiconductor chip and method for manufacturing the same
A substrate for packaging a semiconductor chip includes a dielectric layer, a plurality of conductive circuits and bonding pads formed on the dielectric layer, a metal thin deposition layer formed...
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7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a...
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7517789 |
Solder bumps in flip-chip technologies
A solder bump structure and method for forming the same. The structure includes (a) a dielectric layer including a dielectric layer top surface (b) an electrically conductive bond pad on and in...
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7514352 |
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
The present invention provides a semiconductor device capable of suppressing an increase in electrical resistance of a narrow interconnect, while keeping reliability of a wide interconnect from...
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7514351 |
Solder ball mounting method and solder ball mounting substrate manufacturing method
A solder resist having first opening portions on positions corresponding to electrodes and a second opening portion on a mask providing position is formed on the substrate. A flux mask whose...
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7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same
The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a...
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7508039 |
Carbon nanotube (CNT) multiplexers, circuits, and actuators
Carbon nanotube (CNT) based devices include an actuator/switch that includes one or more fixed CNTs and a moveable CNT that can be urged toward or into contact with a selected fixed CNT with a...
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7498251 |
Redistribution circuit structure
A method of manufacturing a redistribution circuit structure is provided. First, a substrate is provided. The substrate has a plurality of pads and a passivation layer. The passivation layer has a...
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7498196 |
Structure and manufacturing method of chip scale package
A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite...
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7488675 |
Method for fabricating IC board without ring structure
A method for fabricating an IC board without a ring structure is provided. In the method, after the completion of the core board (including the core through hole), the second pattern photoresist...
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7485564 |
Undercut-free BLM process for Pb-free and Pb-reduced C4
A system and method for eliminating undercut when forming a C4 solder bump for BLM (Ball Limiting Metallurgy) and improving the C4 pitch. In the process, a barrier layer metal stack is deposited...
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7485562 |
Method of making multichip wafer level packages and computing systems incorporating same
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained...
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7482259 |
Chip structure and process for forming the same
A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate....
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7482200 |
Process for fabricating chip package structure
A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active...
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7468316 |
Low fabrication cost, fine pitch and high reliability solder bump
A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the...
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7465654 |
Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
A method for fabricating multiple metal layers includes the following steps. An electronic component is provided with multiple contact points. A first metal layer is deposited over said electronic...
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7465653 |
Reliable metal bumps on top of I/O pads after removal of test probe marks
In accordance with the objectives of the invention a new method is provided for the creation of metal bumps over surfaces of I/O pads. Contact pads are provided over the surface of a layer of...
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