|
Match
|
Document |
Document Title |
|
|
7402511 |
Configuration for testing the bonding positions of conductive drops and test method for using the same
Configuration for testing the bonding positions of conductive drops and test method by using the same is disclosed. In the invention, a special configured contact pad for setting a conductive drop...
|
|
|
7402510 |
Etchant and method for forming bumps
A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in...
|
|
|
7402509 |
Method of forming self-passivating interconnects and resulting devices
A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The...
|
|
|
7402508 |
Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
The invention provides a bump structure whose mounting position, shape, and size are favorably controlled and to a method of manufacturing the same. The bump structure of the invention can be...
|
|
|
7396752 |
Method and apparatus for reducing cold joint defects in flip chip products
An electronic device is disclosed with solder bumps treated to improve coplanarity and reduce the effects of poor solder bump surface quality, and a method of constructing same. An electronic...
|
|
|
7394028 |
Flexible circuit substrate for flip-chip-on-flex applications
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
|
|
|
7393773 |
Method and apparatus for producing co-planar bonding pads on a substrate
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of...
|
|
|
7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by...
|
|
|
7391105 |
Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
A unit semiconductor chip and stacked semiconductor package and method of manufacturing with center bonding pads and at least one circuit layer to reduce the length of bonding. The unit...
|
|
|
7390732 |
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and...
|
|
|
7387910 |
Method of bonding solder pads of flip-chip package
Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation...
|
|
|
7381634 |
Integrated circuit system for bonding
An integrated circuit system provides a precursor for an integrated wire bond and flip chip structure. The precursor has a plurality of contact pads thereon. A layer of titanium is deposited on the...
|
|
|
7378298 |
Method of making stacked die package
A method of making a stacked die package ( 39 ) includes placing a first flip chip die ( 16 ) on a base carrier ( 12 ) and electrically connecting the first flip chip die ( 16 ) to the base carrier...
|
|
|
7378297 |
Methods of bonding two semiconductor devices
A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second...
|
|
|
7378296 |
Print mask and method of manufacturing electronic components using the same
A print mask is used to form bumps on barrier metal layers of a wafer. The mask comprises a plurality of elongated perforations disposed in a linear arrangement such that paste can be applied to an...
|
|
|
7375429 |
Integrated circuit component and mounting method thereof
Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching...
|
|
|
7375021 |
Method and structure for eliminating aluminum terminal pad material in semiconductor devices
A method for far back end of line (FBEOL) semiconductor device formation includes forming a terminal copper pad in an upper level of a semiconductor wafer, forming an insulating stack over the...
|
|
|
7375020 |
Method of forming bumps
The present invention provides a method of forming a plurality of bumps over a wafer. The wafer has a plurality of contact pads and a passivation layer thereon and the passivation layer exposes the...
|
|
|
7375007 |
Method of manufacturing a semiconductor device
To provide a penetration electrode having high quality. A method of manufacturing a semiconductor device includes the following steps: (a) forming a concave part from a first face of a...
|
|
|
7371675 |
Method and apparatus for bonding a wire
A method and apparatus for bonding a wire and a wire bond device formed by the same are disclosed. The method includes providing a carrier with at least a first pad, providing a semiconductor chip...
|
|
|
7371618 |
Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
Provided are a method of manufacturing wafer-level chip-size packages and a molding apparatus suitable for practicing the method whereby a semiconductor wafer having a plurality of semiconductor...
|
|
|
7368375 |
Electronic component with compliant elevations having electrical contact areas and method for producing it
An electronic component includes compliant elevations having electrical contact areas for contact-connecting the component to an electronic circuit. The compliant elevations are arranged on a...
|
|
|
7368374 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
|
|
|
7364998 |
Method for forming high reliability bump structure
Methods for forming a bump on a semiconductor substrate, the substrate having a contact pad thereon, is provided. In one embodiment, the method comprises depositing a passivation layer over the...
|
|
|
7358177 |
Fabrication method of under bump metallurgy structure
A fabrication method of under bump metallurgy (UBM) structure is provided. A blocking layer is applied over a surface of a semiconductor element formed with at least one bond pad and a passivation...
|
|
|
7358176 |
Screen printing method of forming conductive bumps
A screen printing method of conductive material is applied to a wafer with a conductive surface thereon. A dielectric layer on the wafer exposes the conductive surface to a first opening. A mask...
|
|
|
7358173 |
Bumping process of light emitting diode
A bumping process for a light emitting diode (LED) chip is provided. Firstly, a LED chip with a plurality of electrodes is provided, then a pattern plate having a plurality of openings is disposed...
|
|
|
7355285 |
Structure of mounting electronic component
The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit...
|
|
|
7355274 |
Semiconductor package, manufacturing method thereof and IC chip
A package may include a lower unit package and an upper unit package. Each of the unit packages may include a circuit substrate having a lower surface and an upper surface. Wire bonding pads may be...
|
|
|
7354797 |
Method for producing a plurality of electronic devices
An electronic device has external contact elements projecting from at least one external contact side of a plastic housing. The external contact elements have an internal section and an external...
|
|
|
7351649 |
Recording head unit and method of producing the same
A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which...
|
|
|
7350684 |
Apparatus and method for forming bump
A preheat device ( 160 ) is provided to execute, before forming bumps ( 16 ) to electrode parts ( 15 ), a pre-formation temperature control for bonding promotion to promote bonding between the...
|
|
|
7348271 |
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the...
|
|
|
7348270 |
Techniques for forming interconnects
A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on...
|
|
|
7348269 |
Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The...
|
|
|
7348262 |
Method for fabricating module of semiconductor chip
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump;...
|
|
|
7344971 |
Manufacturing method of semiconductor device
A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate;...
|
|
|
7344970 |
Plating method
Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in...
|
|
|
7344061 |
Multi-functional solder and articles made therewith, such as microelectronic components
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation...
|
|
|
7341934 |
Method for fabricating conductive bump of circuit board
A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure...
|
|
|
7339262 |
Tape circuit substrate and semiconductor apparatus employing the same
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a...
|
|
|
7338891 |
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
A semiconductor chip for flip chip bonding, a mounting structure for the semiconductor chip, and methods for forming a semiconductor chip for flip chip bonding and for fabricating a printed circuit...
|
|
|
7338890 |
Low fabrication cost, high performance, high reliability chip scale package
The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an...
|
|
|
7338889 |
Method of improving copper interconnects of semiconductor devices for bonding
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
|
|
|
7338842 |
Process for exposing solder bumps on an underfill coated semiconductor
A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant...
|
|
|
RE40112 |
Semiconductor package and method for fabricating the same
Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed....
|
|
|
7336816 |
Method and apparatus for measuring shape of bumps
The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to...
|
|
|
7335582 |
Component
Semiconductor component, having a first chip arranged on a second chip, in which the first and second chips in each case have, on one of their main areas, first and second metalizations,...
|
|
|
7332821 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
|
|
|
7332423 |
Soldering a die to a substrate
One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member...
|