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9041223 Bump-on-trace (BOT) structures  
A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The...
9041215 Single mask package apparatus and method  
Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed...
9040381 Packages with passive devices and methods of forming the same  
A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the...
9029196 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask  
A semiconductor device has a semiconductor die with a die bump pad. A substrate has a conductive trace with an interconnect site. A conductive bump material is deposited on the interconnect site...
9029199 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device includes: preparing a semiconductor wafer including a plurality of semiconductor chips arranged in the shape of a matrix, the semiconductor wafer...
9029203 Method of fabricating semiconductor package  
This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in...
9029183 Method and apparatus for image sensor packaging  
Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be...
9030010 Packaging devices and methods  
Packaging devices and packaging methods are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming a plurality of through-substrate vias (TSVs) in an...
9029266 Semiconductor device manufacturing method  
According to one embodiment, a semiconductor device manufacturing method includes depositing a silicon film above a semiconductor substrate, forming an insulating film which includes silicon oxide...
9024438 Self-aligning conductive bump structure and method of making the same  
A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first...
9024440 Flip-chip package structure and method for an integrated switching power supply  
Disclosed are flip-chip package structures and methods for an integrated switching power supply. In one embodiment, a flip-chip package structure can include: (i) a die with an integrated...
9023727 Method of manufacturing semiconductor packaging  
The present disclosure is related to a method of providing a die structure for semiconductor packaging. The method includes providing a substrate with a bonding pad; forming a patterned mask layer...
9024441 Bump structure and electronic packaging solder joint structure and fabricating method thereof  
A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the...
9018041 Package for semiconductor device including guide rings and manufacturing method of the same  
An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first...
9010618 Magnetic attachment structure  
The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a...
9010617 Solder joint reflow process for reducing packaging failure rate  
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder...
9006891 Method of making a semiconductor device having a post-passivation interconnect structure  
A method of making a semiconductor device includes forming a passivation layer overlying a semiconductor substrate, the semiconductor substrate having a first region and a second region, wherein...
9006887 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby  
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste...
9006096 Processes and structures for IC fabrication  
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the...
9006097 Cu pillar bump with electrolytic metal sidewall protection  
A method of forming a bump structure includes providing a semiconductor substrate and forming an under-bump-metallurgy (UBM) layer on the semiconductor substrate. The method further includes...
9000588 Method for self-assembly of substrates and devices obtained thereof  
A method for defining regions with different surface liquid tension properties on a substrate is disclosed. The method includes: providing a substrate with a main surface having a first surface...
8994156 Semiconductor device packages with solder joint enhancement elements  
Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements...
8993431 Method of fabricating bump structure  
A method for fabricating bump structure forms an under-bump metallurgy (UBM) layer in an opening of an encapsulating layer, and then forms a bump layer on the UBM layer within the opening of the...
8994171 Method and apparatus for a conductive pillar structure  
A method and apparatus for a conductive pillar structure is provided. A device may be provided, which may include a substrate, a first passivation layer formed over the substrate, a conductive...
8994175 Method of manufacturing semiconductor device and semiconductor device  
To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening...
8994173 Solder bump connection and method of making  
A layer of material can protect a surface of a passivation layer against damage during a final via plug process. The protective layer can be a conductive bump limiting metallurgy (BLM) base layer...
8987130 Reactive bonding of a flip chip package  
An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by...
8987901 Component built-in wiring board and manufacturing method of component built-in wiring board  
Disclosed is a component built-in wiring board including: a first insulating layer on a second one having laminated at least two insulating layers; a semiconductor chip buried in the second...
8987014 Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test  
A semiconductor wafer contains a plurality of semiconductor die. A plurality of interconnect bump pads is formed over the semiconductor die. A plurality of sacrificial bump pads is formed in...
8987866 Semiconductor device, method of manufacturing semiconductor device, and antenna switch module  
Disclosed is a semiconductor device having a radio frequency switch. Also disclosed are an antenna switch module and a method of manufacturing the semiconductor device. The semiconductor device...
8987898 Semiconductor wafer with reduced thickness variation and method for fabricating same  
According to one embodiment, a semiconductor wafer comprises a plurality of solder bumps for providing device contacts formed over a functional region of the semiconductor wafer, and one or more...
8987131 Formation of through-silicon via (TSV) in silicon substrate  
To form a through-silicon via (TSV) in a silicon substrate without using plating equipment or using sputtering equipment or small metal particles, and form an interlayer connection by stacking a...
8980743 Method for applying a final metal layer for wafer level packaging and associated device  
A wafer level semiconductor device and manufacturing method including providing a semiconductor device wafer substrate having a backside, applying to the backside a conductive metallization layer,...
8981576 Structure and method for bump to landing trace ratio  
The present disclosure provides an integrated circuit. The integrated circuit includes an interconnect structure formed on a substrate; a landing metal trace formed on the interconnect structure...
8975739 Package structure and method for manufacturing thereof  
The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation...
8969176 Laminated transferable interconnect for microelectronic package  
A package for a plurality of semiconductor devices having: an electrical interconnect structure, comprising: an electrical interconnect structure; and an active device structure, comprising the...
8969191 Mechanisms for forming package structure  
Embodiments of mechanisms for forming a package structure are provided. A method for forming a package structure includes providing a semiconductor die and forming a first bump structure and a...
8969192 Low stress substrate and formation method  
A bumped substrate is optimized to be flat post reflow. By producing the bumped substrate to be flat post reflow, device reliability is assured. More particularly, the transistor shift associated...
8970012 Semiconductor device, fabrication process, and electronic device  
A semiconductor device is provided, including a semiconductor substrate that includes a semiconductor; an electrode layer formed above a first surface side inside the semiconductor substrate; a...
8962471 Bump, method for forming the bump, and method for mounting substrate having the bump thereon  
A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a...
8963342 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types  
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging...
8962470 Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus  
A semiconductor substrate is secured by suction to a rear face of a supporting face of a substrate supporting table. In this event, the thickness of the semiconductor substrate is made fixed by...
8951840 FCOC (Flip Chip On Chip) package and manufacturing method thereof  
A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched...
8946079 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof  
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least...
8946891 Mushroom shaped bump on repassivation  
Systems, methods and/or techniques for mushroom shaped bump on repassivation are described. A method of forming a chip scale package may include applying a first photoresist layer over a...
8946913 Short and low loop wire bonding  
A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second...
8945993 Method of manufacturing a ball grid array substrate or a semiconductor chip package  
A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively;...
8946072 No-flow underfill for package with interposer frame  
Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package,...
8940586 Mechanism for MEMS bump side wall angle improvement  
The present disclosure relates to a bump processing method and/or resulting MEMS-CMOS structure, in which one or more anti-stiction bumps are formed within a substrate prior to the formation of a...
8939346 Methods and systems involving soldering  
A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder...