Matches 151 - 200 out of 1163 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7169693 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same  
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and...
7169641 Semiconductor package with selective underfill and fabrication method therfor  
A method of manufacturing a semiconductor package includes providing a substrate having a plurality of contacts with solder bump contact areas that are unmasked. A plurality of underfill bumps is...
7166530 Method of forming contact pads  
In a method of forming a semiconductor structure, a substrate comprising at least one contact pad is provided. A passivation layer is formed over the substrate. A mask which does not cover a...
7166481 Method for evaluating and modifying solder attach design for integrated circuit packaging assembly  
A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad...
7163885 Method of migrating and fixing particles in a solution to bumps on a chip  
A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical...
7160820 Method of preparing oxide crystal film/substrate composite and solution for use therein  
There is provided a process for preparing a composite material of an oxide crystal film and a substrate by forming a Y123 type oxide crystal film from a solution phase on a substrate using a liquid...
7160797 Method of bumping die pads for wafer testing  
A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor...
7160796 Method for manufacturing wiring board and semiconductor device  
Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads...
7160760 Semiconductor device and a method of manufacturing the same  
A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET ( 70 ) has a connecting portion for electrically...
7159292 Recovery processing method of an electrode  
While a transfer surface 10 a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44 B on a contact sheet 44 formed on a...
7157363 Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion  
An insulating layer ( 3 ) having an opening portion ( 3 a ) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer (...
7153765 Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles  
A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder...
7153764 Method of manufacturing a semiconductor device including a bump forming process  
A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold...
7151317 Multi-chip package structure  
A multi-chip package structure comprising a first chip, a patterned lamination layer, a plurality of first bumps, a second chip and second bumps is provided. The first chip has a first active...
7151050 Method for fabricating electrical connection structure of circuit board  
A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a...
7151049 Electroplating compositions and methods  
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative,...
7151012 Redistribution layer of wafer and the fabricating method thereof  
A wafer comprises a wafer, a conductor, a first passivation layer, a second passivation layer, a redistribution layer, and a third passivation layer. The conductor is disposed on the wafer. The...
7145236 Semiconductor device having solder bumps reliably reflow solderable  
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve...
7138583 Method and apparatus for maintaining a separation between contacts  
Methods and apparatus for controlling the distance between contact pads or leads which are to be interfaced are disclosed. According to one aspect of the present invention, an electrical package...
7138326 Wafer integrated rigid support ring  
A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform...
7135758 Surface mount solder method and apparatus for decoupling capacitance and process of making  
A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed...
7135397 Method and system for packaging ball grid arrays  
According to one embodiment of the invention, a method of packaging ball grid arrays includes providing a substrate having a plurality of holes formed therein. Each hole is associated with a...
7132359 Tolerance bondwire inductors for analog circuitry  
Disclosed are wirebonding methods wherein bondwires are positioned using dynamically determined variations in die placement. Preferred methods of the invention include steps for placing a die on...
7129585 Semiconductor device and method of packaging the same  
Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some...
7129158 Printed wiring board and production method for printed wiring board  
A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit ...
7129156 Method for fabricating a silicon carbide interconnect for semiconductor components using heating  
An interconnect for semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging component contacts on the components. The interconnect...
7129111 Method for forming bump protective collars on a bumped wafer  
A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the...
7129110 Semiconductor device and method for manufacturing the same  
A method for manufacturing a semiconductor device having projection electrodes on the surface of a semiconductor substrate. This method include an electrode forming step of forming the projection...
7125789 Composite metal column for mounting semiconductor device  
An integrated circuit chip 903 , which has a plurality of pads 903 b and non-reflowable contact members 1201 to be connected by reflow attachment to external parts. Each of these contact...
7125788 Circuit device and method of manufacturing the circuit device  
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated...
7125745 Multi-chip package substrate for flip-chip and wire bonding  
A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a...
7122909 Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument  
A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an...
7122896 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component  
To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in...
7122460 Electromigration barrier layers for solder joints  
A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a...
7122459 Semiconductor wafer package and manufacturing method thereof  
A manufacturing method of a semiconductor wafer package mainly comprises the following steps. Firstly, a semiconductor wafer having a plurality of bonding pads and a passivation layer exposing the...
7122458 Method for fabricating pad redistribution layer  
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed...
7122401 Area array type semiconductor package fabrication method  
An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as...
7119030 Process for lining a surface using an organic film  
The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said...
7115496 Method for protecting the redistribution layer on wafers/chips  
The invention relates to a method for protecting the redistribution layer on wafers/chips, which preferably comprises a structure constructed from a seed layer, a layer of copper situated on the...
7112889 Semiconductor device having an alignment mark formed by the same material with a metal post  
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located...
7111771 Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same  
A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and...
7105433 Method for treating wafer surface  
The present invention provides a method for treating the wafer surface, suitable for removing residues on the wafer surface. The method includes forming a photo-sensitive material layer over the...
7105432 Method of locating conductive spheres utilizing screen and hopper of solder balls  
Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in...
7101782 Method of making a circuitized substrate  
A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder...
7101781 Integrated circuit packages without solder mask and method for the same  
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder...
7101736 Method of assembling a semiconductor component and apparatus therefor  
A method of assembling a semiconductor component includes providing a pedestal, placing a first piece on the curved pedestal, wherein the first piece comprises a semiconductor die, placing a second...
7095045 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is...
7094678 Electrostatic discharge protection of thin-film resonators  
A filter having a thin-film resonator fabricated on a semiconductor substrate and a method of making the same are disclosed. The filter has a bonding pad connected to the resonator and in contact...
7091063 Electronic assembly comprising solderable thermal interface and methods of manufacture  
To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated...
7087513 Method to produce low strength temporary solder joints  
The present invention provides a method for producing a temporary chip carrier for semiconductor chip burn-in test and speed sorting. A multi-layered substrate or card, usually comprised of one of...
Matches 151 - 200 out of 1163 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >