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7608533 |
Semiconductor die attachment for high vacuum tubes
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel...
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7605463 |
Interposer and method for producing the same and electronic device
An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring,...
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7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7601628 |
Wire and solder bond forming methods
Methods of forming wire and solder bonds are disclosed. In one embodiment, a method includes providing a structure including a wire bond metal region for the wire bond and a solder bond metal...
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7601626 |
Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device
A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer...
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7601625 |
Method for manufacturing semiconductor device having solder layer
A method for manufacturing a semiconductor device having a solder layer includes the steps of: grinding a mounting surface of a semiconductor chip; etching the mounting surface of the chip; forming...
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7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor
A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board...
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7598620 |
Copper bonding compatible bond pad structure and method
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions...
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7598164 |
Method for direct bonding of metallic conductors to a ceramic substrate
A method to provide direct bonding of wires to silicon for microelectronic and micro-electromechanical systems (MEMS). The method includes preparing a rough “pothole” during one of the many...
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7598124 |
System and method to increase die stand-off height
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7595556 |
Semiconductor device and method for manufacturing the same
Embodiments relate to a semiconductor device and a method for manufacturing the same. According to embodiments, the semiconductor device may include a semiconductor substrate formed with a metal...
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7595227 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
Methods for assembling a die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. The method includes coupling a first...
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7592246 |
Method and semiconductor device having copper interconnect for bonding
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
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7589009 |
Method for fabricating a top conductive layer in a semiconductor die and related structure
According to an exemplary embodiment, a method for fabricating a top conductive layer in a semiconductor die includes forming a through-wafer via opening through at least one interlayer dielectric...
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7589008 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a...
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7585754 |
Method of forming bonding pad opening
A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation...
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7582553 |
Method of bonding flying leads
The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps...
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7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy...
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7582551 |
Wiring substrate and wiring substrate manufacturing method
A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that...
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7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric...
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7575994 |
Semiconductor device and manufacturing method of the same
The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film...
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7573115 |
Structure and method for enhancing resistance to fracture of bonding pads
The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the...
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7572739 |
Tape removal in semiconductor structure fabrication
A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer...
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7572721 |
Method of forming a semiconductor device having an etch stop layer and related device
In one embodiment, a lower interlayer dielectric layer, and first and second landing pads penetrating the lower interlayer dielectric layer are formed on a substrate. Interconnection patterns...
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7572673 |
Wafer level package having a stress relief spacer and manufacturing method thereof
In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The...
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7569474 |
Method and apparatus for soldering modules to substrates
A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board...
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7569472 |
Method and apparatus of power ring positioning to minimize crosstalk
A method and/or an apparatus of power ring positioning to minimize crosstalk are disclosed. In one embodiment, a method includes generating an array of fingers between a power ring and a die,...
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7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate...
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7566650 |
Integrated circuit solder bumping system
An integrated circuit solder bumping system provides a substrate and forms a redistribution layer on the substrate. An insulation layer is formed on the redistribution layer. The insulation layer...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7566648 |
Method of making solder pad
A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching...
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7566647 |
Method of disposing and arranging dummy patterns
A method of disposing dummy patterns is described, which is used for increasing the pattern density of an aluminum pad layer. A substrate is provided, and an aluminum pad material layer is formed...
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7563703 |
Microelectronic interconnect device comprising localised conductive pins
A method producing conductive rods localized on conductive blocks of an electronic component.
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7560374 |
Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
A mold for forming a conductive bump, a method of fabricating the mold, and a method of forming a bump on a wafer using the mold are provided. The bump can be formed by employing various materials,...
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7560373 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby
Methods of forming a microelectronic structure are described. Those methods include applying a solder paste to a portion of a board, wherein the solder paste is not applied to a ball grid array...
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7560372 |
Process for making a semiconductor device having a roughened surface
An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid....
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7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the...
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7557029 |
Semiconductor device and fabrication process thereof
A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires...
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7554206 |
Microelectronic packages and methods therefor
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the...
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7553752 |
Method of making a wafer level integration package
A semiconductor package is made by providing a wafer having a first electrical contact pad integrated into a top surface of the wafer, forming a through-hole interconnection extending downward from...
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7553750 |
Method for fabricating electrical conductive structure of circuit board
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically...
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7550846 |
Conductive bump with a plurality of contact elements
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one...
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7547625 |
Methods for bonding and micro-electronic devices produced according to such methods
One inventive aspect is related to a method of bonding two elements. The method comprises producing on a first element a first micropattern, comprising a first metal layer. The method further...
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7547624 |
Semiconductor device and method of producing the same
A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a...
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7547623 |
Methods of forming lead free solder bumps
Methods of forming an electronic device may include forming an under bump seed metallurgy layer on an electronic substrate. A nickel layer may be formed on the under bump seed metallurgy layer so...
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7546681 |
Manufacturing method for wiring circuit substrate
A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top...
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7544599 |
Manufacturing method of solder ball disposing surface structure of package substrate
A manufacturing method of a solder ball disposing surface structure on a core board including: providing a core board with a first metal layer and an opposing metal bump-equipped second metal...
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