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7329598 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode...
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7329563 |
Method for fabrication of wafer level package incorporating dual compliant layers
A method is provided for forming wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads. The wafer level package includes a plurality of metal cap...
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7326636 |
Method and circuit structure employing a photo-imaged solder mask
In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the...
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7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire
An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads...
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7326635 |
Method and apparatus for stripping photo-resist
A method for stripping a photo-resist includes the steps of: (a) wet stripping a photo-resist off from a substrate; and (b) rinsing the substrate under high-speed conveyance using an aqua knife. A...
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7323405 |
Fine pitch low cost flip chip substrate
A method of forming a package is disclosed, which includes steps of forming a substrate, a solder masker, and a first aperture through the solder mask. The substrate has a surface on which metal...
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7323360 |
Electronic assemblies with filled no-flow underfill
High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The...
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7321140 |
Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier
A nickel silicon alloy barrier layer formed between a metal bonding pad on an integrated circuit and a tin-based solder ball, for example, a lead-free solder. The nickel silicon alloy contains at...
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7320933 |
Double bumping of flexible substrate for first and second level interconnects
An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive...
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7316971 |
Wire bond pads
A wire bond pad and method of fabricating the wire bond pad. The method including: providing a substrate; forming an electrically conductive layer on a top surface of the substrate; patterning the...
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7314817 |
Microelectronic device interconnects
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate...
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7314819 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that...
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7314818 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump....
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7314816 |
Masking layer in substrate cavity
A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package...
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7312142 |
Method for making cable with a conductive bump array, and method for connecting the cable to a task object
A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive...
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7312143 |
Wafer level chip scale package having a gap and method for manufacturing the same
A wafer level chip scale package may have a gap provided between a solder bump and a bump land. The gap may be filled with a gas. A method of manufacturing a wafer level chip scale package may...
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7312533 |
Electronic component with flexible contacting pads and method for producing the electronic component
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the...
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7312164 |
Selective passivation of exposed silicon
A method for applying a passivation layer selectively on an exposed silicon surface includes use of a liquid phase solution supersaturated in silicon dioxide. The application is conducted at...
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7309647 |
Method of mounting an electroless nickel immersion gold flip chip package
A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex...
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7304394 |
Semiconductor device and method for manufacturing same
A wiring pattern is provided on an insulating tape. Part of the wiring pattern is a connection section. An insulating resin is provided so that the connection section is coated with the insulating...
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7303941 |
Methods and apparatus for providing a power signal to an area array package
An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit...
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7300865 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a...
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7300863 |
Circuit chip connector and method of connecting a circuit chip
An interposer and a method of manufacturing a flexible radio frequency (RF) type device having an IC and thin film circuits, such as an antenna. The device is made by using an easy-to-insert...
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7300857 |
Through-wafer interconnects for photoimager and memory wafers
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such...
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7300864 |
Method for forming solder bump structure
A solder bump structure may be formed using a dual exposure technique of a photoresist, which may be a positive photoresist. The positive photoresist may be coated on an IC chip. First openings may...
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7294565 |
Method of fabricating a wire bond pad with Ni/Au metallization
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is...
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7295445 |
Holder for surface mount device during reflow
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one...
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7291548 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface....
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7291547 |
Filter device and method for fabricating filter devices
A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another...
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7288471 |
Bumping electronic components using transfer substrates
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic...
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7285486 |
Ball transferring method and apparatus
Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with...
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7285863 |
Pad structures including insulating layers having a tapered surface
Embodiments include a semiconductor device comprising: a pad formed on an insulating layer and having an electric connection region with external components; and a protective insulating layer which...
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7282431 |
Single chip and stack-type chip semiconductor package and method of manufacturing the same
A semiconductor package comprises a substrate having connection pads disposed thereon, a semiconductor chip attached to the substrate such that an active surface of the semiconductor chip faces the...
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7279366 |
Method for assembling semiconductor die packages with standard ball grid array footprint
Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of...
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7279356 |
Depopulation of a ball grid array to allow via placement
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid...
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7279357 |
Method for fabricating a chip-scale-packaging (CSP) having an inductor
A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a...
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7276435 |
Die level metal density gradient for improved flip chip package reliability
An integrated circuit has metal bumps on the top surface that create a potentially destructive stress on the underlying layers when the metal bumps are formed. Ensuring a minimum metal...
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7276436 |
Manufacturing method for electronic component module and electromagnetically readable data carrier
A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an...
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7276399 |
Method of designing a module-based flip chip substrate design
Methods and apparatus are provided for designing the electrical interconnects of a substrate. Modules are used to design sections of the electrical interconnects. Multiple modules may be...
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7276803 |
Semiconductor component and method for fabricating
Semiconductor components having a semiconductor body which includes a semiconductor base surface have to be sealed with a molding compound in order to protect against moisture or heat. Mechanical...
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7274097 |
Semiconductor package including redistribution pattern and method of manufacturing the same
A semiconductor device package includes a substrate, first and second chip pads spaced apart over a surface of the substrate, and an insulating layer located over the surface of the substrate. The...
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7273805 |
Redistribution layer with microstrips
A semiconductor device includes a completed semiconductor chip and a dielectric layer overlying the completed semiconductor chip. A redistribution layer overlies the completed semiconductor chip...
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7273803 |
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
A ball-limiting metallurgy includes a substrate, a barrier layer formed over the substrate, an adhesion layer formed over the barrier layer, a first solderable layer formed over the adhesion layer,...
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7273804 |
Internally reinforced bond pads
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric...
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7271482 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a...
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7271485 |
Systems and methods for distributing I/O in a semiconductor device
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a...
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7271086 |
Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes...
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7267861 |
Solder joints for copper metallization having reduced interfacial voids
A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction,...
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7265044 |
Method for forming bump on electrode pad with use of double-layered film
A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and...
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7265046 |
Method of making a solder ball
A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4 , which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount...
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