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7405109 |
Method of fabricating the routing of electrical signals
A method for manufacturing a layered structure for routing electrical signals comprising the steps of providing a layout for the layered structure having an insulating layer with at least one...
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7402511 |
Configuration for testing the bonding positions of conductive drops and test method for using the same
Configuration for testing the bonding positions of conductive drops and test method by using the same is disclosed. In the invention, a special configured contact pad for setting a conductive drop...
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7399694 |
Semiconductor device and a manufacturing method of the same
By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually...
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7399695 |
Integrated die bumping process
An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing...
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7399704 |
Fabrication method of a semiconductor device using liquid repellent film
In the case where a contact hole is formed by a conventional process of the semiconductor device fabrication, a resist is required to be formed almost entirely over a substrate in order to form the...
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7396754 |
Method of making wafer level ball grid array
A manufacturing technique that involves embedding one or more semiconductor die into a support substrate and forming conductive traces that lead from die contact pads to redistributed contact pads...
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7394028 |
Flexible circuit substrate for flip-chip-on-flex applications
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
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7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by...
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7393772 |
Wirebond structure and method to connect to a microelectronic die
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the...
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7390733 |
Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode
To enhance bonding accuracy of a bump electrode, while coping with narrowing pitch of the bump electrodes, a protruding electrode, whose leading end is sharpened, is provided to a semiconductor...
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7390732 |
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and...
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7388288 |
Flip chip metallization method and devices
Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a...
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7387910 |
Method of bonding solder pads of flip-chip package
Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation...
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7385231 |
Porous thin-film-deposition substrate, electron emitting element, methods of producing them, and switching element and display element
A method of producing a porous thin-film-deposition substrate, which has the steps of: placing onto a substrate that has an electrostatic charge on its surface, fine particles with a surface...
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7381634 |
Integrated circuit system for bonding
An integrated circuit system provides a precursor for an integrated wire bond and flip chip structure. The precursor has a plurality of contact pads thereon. A layer of titanium is deposited on the...
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7381636 |
Planar bond pad design and method of making the same
Techniques for an integrated circuit device with planar bond pads are provided. A metal layer region is formed on a substrate. The integrated circuit device also includes a passivation layer that...
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7381635 |
Method and structure for reduction of soft error rates in integrated circuits
A structure and a method for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a...
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7382005 |
Circuit component with bump formed over chip
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...
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7378296 |
Print mask and method of manufacturing electronic components using the same
A print mask is used to form bumps on barrier metal layers of a wafer. The mask comprises a plurality of elongated perforations disposed in a linear arrangement such that paste can be applied to an...
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7378616 |
Heating apparatus and method for semiconductor devices
A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the...
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7376852 |
Method for controlling power change for a semiconductor module
The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor...
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7374958 |
Light emitting semiconductor bonding structure and method of manufacturing the same
A light emitting semiconductor bonding structure includes a structure formed by bonding a substrate onto a light emitting semiconductor. The substrate is a structure containing electric circuits....
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7371675 |
Method and apparatus for bonding a wire
A method and apparatus for bonding a wire and a wire bond device formed by the same are disclosed. The method includes providing a carrier with at least a first pad, providing a semiconductor chip...
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7371674 |
Nanostructure-based package interconnect
An embodiment of the present invention is an interconnect technique. A nanostructure bump is formed on a die. The nanostructure bump has a template defining nano-sized openings and metallic...
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7371658 |
Trench isolation structure and a method of manufacture therefor
The present invention provides a trench isolation structure, a method of manufacture therefor and a method for manufacturing an integrated circuit including the same. The trench isolation structure...
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7371673 |
Method and apparatus for attaching an IC package to a PCB assembly
A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At...
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7364943 |
Method of bonding a microelectronic die to a substrate and arrangement to carry out method
A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a...
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7364941 |
Circuit device manufacturing method
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto...
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7364999 |
Method for interconnecting semiconductor components with substrates and contact means
A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a...
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7361988 |
Apparatuses and methods to route line to line
Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a...
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7358174 |
Methods of forming solder bumps on exposed metal pads
A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second...
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7358173 |
Bumping process of light emitting diode
A bumping process for a light emitting diode (LED) chip is provided. Firstly, a LED chip with a plurality of electrodes is provided, then a pattern plate having a plurality of openings is disposed...
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7358177 |
Fabrication method of under bump metallurgy structure
A fabrication method of under bump metallurgy (UBM) structure is provided. A blocking layer is applied over a surface of a semiconductor element formed with at least one bond pad and a passivation...
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7358175 |
Serial thermal processor arrangement
A serial thermal processing arrangement for treating a wafer of semiconductor material, the steps including: loading the wafer into a chamber at an initial station and purging the chamber with...
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7351649 |
Recording head unit and method of producing the same
A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which...
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7348214 |
Integrated circuit package with improved power signal connection
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of...
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7348671 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
A method for forming electrical interconnects having different diameters and filler materials through a semiconductor wafer comprises forming first and second openings through a semiconductor,...
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7344971 |
Manufacturing method of semiconductor device
A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate;...
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7341894 |
Semiconductor, electrooptic apparatus and electronic apparatus
In a semiconductor device made by forming functional elements on a first substrate, transferring the element chip onto a second substrate, and connecting first pads on the element chip to second...
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7338889 |
Method of improving copper interconnects of semiconductor devices for bonding
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a...
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7335582 |
Component
Semiconductor component, having a first chip arranged on a second chip, in which the first and second chips in each case have, on one of their main areas, first and second metalizations,...
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7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film...
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7335536 |
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip with metallization...
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7332423 |
Soldering a die to a substrate
One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member...
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7331737 |
Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a...
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7329598 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode...
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7329563 |
Method for fabrication of wafer level package incorporating dual compliant layers
A method is provided for forming wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads. The wafer level package includes a plurality of metal cap...
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7326636 |
Method and circuit structure employing a photo-imaged solder mask
In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the...
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7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire
An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads...
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7326635 |
Method and apparatus for stripping photo-resist
A method for stripping a photo-resist includes the steps of: (a) wet stripping a photo-resist off from a substrate; and (b) rinsing the substrate under high-speed conveyance using an aqua knife. A...
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