|
Match
|
Document |
Document Title |
|
|
7572721 |
Method of forming a semiconductor device having an etch stop layer and related device
In one embodiment, a lower interlayer dielectric layer, and first and second landing pads penetrating the lower interlayer dielectric layer are formed on a substrate. Interconnection patterns...
|
|
|
7569474 |
Method and apparatus for soldering modules to substrates
A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board...
|
|
|
7569472 |
Method and apparatus of power ring positioning to minimize crosstalk
A method and/or an apparatus of power ring positioning to minimize crosstalk are disclosed. In one embodiment, a method includes generating an array of fingers between a power ring and a die,...
|
|
|
7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate...
|
|
|
7566648 |
Method of making solder pad
A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching...
|
|
|
7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
|
|
|
7566650 |
Integrated circuit solder bumping system
An integrated circuit solder bumping system provides a substrate and forms a redistribution layer on the substrate. An insulation layer is formed on the redistribution layer. The insulation layer...
|
|
|
7566647 |
Method of disposing and arranging dummy patterns
A method of disposing dummy patterns is described, which is used for increasing the pattern density of an aluminum pad layer. A substrate is provided, and an aluminum pad material layer is formed...
|
|
|
7563703 |
Microelectronic interconnect device comprising localised conductive pins
A method producing conductive rods localized on conductive blocks of an electronic component.
|
|
|
7560374 |
Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
A mold for forming a conductive bump, a method of fabricating the mold, and a method of forming a bump on a wafer using the mold are provided. The bump can be formed by employing various materials,...
|
|
|
7560373 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby
Methods of forming a microelectronic structure are described. Those methods include applying a solder paste to a portion of a board, wherein the solder paste is not applied to a ball grid array...
|
|
|
7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the...
|
|
|
7560372 |
Process for making a semiconductor device having a roughened surface
An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid....
|
|
|
7557029 |
Semiconductor device and fabrication process thereof
A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires...
|
|
|
7553752 |
Method of making a wafer level integration package
A semiconductor package is made by providing a wafer having a first electrical contact pad integrated into a top surface of the wafer, forming a through-hole interconnection extending downward from...
|
|
|
7553750 |
Method for fabricating electrical conductive structure of circuit board
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically...
|
|
|
7554206 |
Microelectronic packages and methods therefor
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the...
|
|
|
7550846 |
Conductive bump with a plurality of contact elements
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one...
|
|
|
7546681 |
Manufacturing method for wiring circuit substrate
A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top...
|
|
|
7547625 |
Methods for bonding and micro-electronic devices produced according to such methods
One inventive aspect is related to a method of bonding two elements. The method comprises producing on a first element a first micropattern, comprising a first metal layer. The method further...
|
|
|
7547624 |
Semiconductor device and method of producing the same
A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a...
|
|
|
7547623 |
Methods of forming lead free solder bumps
Methods of forming an electronic device may include forming an under bump seed metallurgy layer on an electronic substrate. A nickel layer may be formed on the under bump seed metallurgy layer so...
|
|
|
7544598 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device, including: providing a semiconductor substrate which has a plurality of electrodes and in which a depression is formed on a side on which the...
|
|
|
7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that...
|
|
|
7544599 |
Manufacturing method of solder ball disposing surface structure of package substrate
A manufacturing method of a solder ball disposing surface structure on a core board including: providing a core board with a first metal layer and an opposing metal bump-equipped second metal...
|
|
|
7541272 |
Damascene patterning of barrier layer metal for C4 solder bumps
A system and method for forming a novel C4 solder bump for BLM (Ball Limiting Metallurgy) includes a novel damascene technique is implemented to eliminate the Cu undercut problem and improve the C4...
|
|
|
7538009 |
Method for fabricating STI gap fill oxide layer in semiconductor devices
A method for fabricating an STI gap fill oxide layer in a semiconductor device is provided. The method can include: forming a shallow trench for forming an STI on a semiconductor substrate; forming...
|
|
|
7538022 |
Method of manufacturing electronic circuit device
The method of manufacturing an electronic circuit device according to an embodiment of the present invention includes preparing an interconnect substrate 10 including an interconnect 14 and an...
|
|
|
7538021 |
Removing dry film resist residues using hydrolyzable membranes
A technique to remove dry film resist residues during solder bump formation. A resist assembly is formed on a metal pad on a substrate. The resist assembly includes a solder resist (SR) layer, a...
|
|
|
7538020 |
Chip packaging process
A bumping process including the following steps is provided. A main body with a plurality of contacts thereon is provided. A protective layer with a plurality of first openings is formed on the...
|
|
|
7538019 |
Forming compliant contact pads for semiconductor packages
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes...
|
|
|
7538430 |
Semiconductor device and a method of manufacturing the same
A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is...
|
|
|
7538435 |
Wafer structure and bumping process
A wafer structure including a semiconductor substrate, elastic elements, under bump metallurgic (UBM) layers and bumps is provided. The semiconductor substrate has an active surface, and it...
|
|
|
7535114 |
Integrated circuit devices including compliant material under bond pads and methods of fabrication
An integrated circuit device includes a die having an interconnect structure formed over a surface thereof. A volume of compliant material located within the interconnect structure underlies one or...
|
|
|
7534715 |
Methods including fluxless chip attach processes
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal...
|
|
|
7531441 |
Method of manufacturing semiconductor device
Of three chips ( 2 A), ( 2 B), and ( 2 C) mounted on a main surface of a package substrate ( 1 ) in a multi-chip module (MCM), a chip ( 2 A) with a DRAM formed thereon and a chip ( 2 B) with a...
|
|
|
7531426 |
Approach to high temperature wafer processing
At temperatures near, and above, 385° C., gold can diffuse into silicon and into some contact materials. Gold, however, is an excellent material because it is corrosion resistant, electrically...
|
|
|
7530164 |
Wafer-level underfill process making use of sacrificial contact pad protective material
A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material...
|
|
|
7528069 |
Fine pitch interconnect and method of making
Fine pitch contacts are achieved by using traces that extend to the contacts without requiring capture pads at the contact pads. Capture pads are desirably avoided because they have a diameter...
|
|
|
7528011 |
Semiconductor device and manufacturing method thereof
In a manufacturing method of a semiconductor device, a substrate and a plurality of semiconductor chips stacked on the substrate are connected to each other by a ball bonding method adopting a...
|
|
|
7528061 |
Systems and methods for solder bonding
Systems and methods for solder bonding that employ an equilibrium solidification process in which the solder is solidified by dissolving and alloying metals that raise the melting point temperature...
|
|
|
7524754 |
Interconnect shunt used for current distribution and reliability redundancy
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution...
|
|
|
7520049 |
Method for manufacturing a planar resistance heating element
Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance...
|
|
|
7517778 |
Structure of high performance combo chip and processing method
A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the...
|
|
|
7517786 |
Methods of forming wire bonds for semiconductor constructions
The invention includes a semiconductor construction having a wire bonding region associated with a metal-containing layer, and having radiation-imageable material over the metal-containing layer....
|
|
|
7517788 |
System, apparatus, and method for advanced solder bumping
According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask...
|
|
|
7517785 |
Electronic interconnects and methods of making same
A method for making an interconnect is provided. The method includes depositing a conductive layer on a substrate, depositing a protective layer on the conductive layer, patterning the protective...
|
|
|
7517787 |
C4 joint reliability
In one embodiment, the invention provides a method comprising fabricating a die bump on a die, the die bump being shaped and dimensioned to at least reduce the flow of solder material used, to...
|
|
|
7517725 |
System and method for separating and packaging integrated circuits
A method of separating an IC. The method includes dicing a semiconductor wafer. The semiconductor wafer includes multiple ICs. The diced wafer is secured to a stretchable substrate. The stretchable...
|
|
|
7514786 |
Semiconductor chip electrical connection structure
A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a...
|