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6569752 |
Semiconductor element and fabricating method thereof
The present semiconductor element comprises a semiconductor substrate, a wiring pad formed thereon, a layer of barrier metal formed thereon, an intermetallic compound Ag 3 Sn formed thereon, and a...
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6569712 |
Structure of a ball-grid array package substrate and processes for producing thereof
An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting...
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6569754 |
Method for making a module including a microplatform
A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the...
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6569762 |
Three dimensional IC package module
In the present invention a high performance package is described where semiconductor chips are stacked together in a pancake like fashion with inter chip communications facilitated by chip to chip...
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6569758 |
Sub-milliohm on-chip interconnection
A method to form a very low resistivity interconnection in the manufacture of an integrated circuit device is achieved. A bottom conductive layer is formed overlying a substrate. The bottom...
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6566239 |
Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
A method of manufacturing a semiconductor device is provided. The method includes the steps of forming a wiring layer on an underlying metal film formed on a substrate, the wiring layer being...
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6563225 |
Product using Zn-Al alloy solder
There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a...
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6562663 |
Microelectronic assembly with die support and method
A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality...
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6562654 |
Tented plated through-holes and method for fabrication thereof
A process for tenting through-holes comprises providing a circuitized substrate having a plurality of plated through-holes, wherein the plated through-holes are tented with a polyimide material.
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6559527 |
Process for forming cone shaped solder for chip interconnection
A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the...
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6559042 |
Process for forming fusible links
A process for forming fusible links in an integrated circuit includes forming the fusible link in the last metallization layer. The process can be employed in the fabrication of integrated circuits...
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6555459 |
Method of manufacturing a semiconductor device
A metal post used with a chip size package and barrier metal formed on the metal post are omitted. After a second opening where a wiring layer is exposed is made, a second seed layer is formed and...
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6555296 |
Fine pitch wafer bumping process
A fine pitch wafer bumping process comprises: providing a wafer that has a plurality of contact pads exposed by a passivation layer formed on the surface of the wafer, wherein an under bump metal...
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6551916 |
Bond-pad with pad edge strengthening structure
A bond pad structure for use in wire bonding application during the packaging operation of semiconductor devices which contains a bond frame structure for holding the bond pad in place to prevent...
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6551918 |
Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment
A method of fabricating a semiconductor device including: a first step of bonding a conductive wire to any one of a plurality of electrodes of a semiconductor chip; a second step of tearing off the...
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6552436 |
Semiconductor device having a ball grid array and method therefor
A semiconductor device ( 50 ) includes a semiconductor die ( 52 ) having electronic circuitry that is connected to a substrate ( 54 ). The substrate ( 54 ) is used to interface the semiconductor...
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6551917 |
Method of locating conductive spheres utilizing screen and hopper of solder balls
Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres...
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6548392 |
Methods of a high density flip chip memory arrays
A low alpha emissivity-induced error solder bump, flip-chip integrated circuit device. The device includes a semiconductor die having an active surface and a bond pad array disposed about the...
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6548326 |
Semiconductor device and process of producing same
A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection...
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6544880 |
Method of improving copper interconnects of semiconductor devices for bonding
An improved wire bond with the pond pads of semiconductor devices and the lead fingers of lead frames or an improved conductor lead of a TAB tape bond with the bond pad of a semiconductor device....
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6544878 |
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
Within both a method for fabricating a microelectronic fabrication, and the microelectronic fabrication fabricated employing the method, there is first provided a substrate. Within the method,...
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6544813 |
Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip and a conductive metal, wherein the chip includes a conductive pad and the conductive metal includes...
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6541301 |
Low RF loss direct die attach process and apparatus
A method for electronically connecting a semiconductor device comprising a substrate having a backside surface and a top surface on which is formed active elements, to an electronic circuit board...
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6541366 |
Method for improving a solder bump adhesion bond to a UBM contact layer
A method for improving an adhesion bond between a solder material and an under bump metallization (UBM) layer including providing at least two UBM layers overlying a chip bonding pad including an...
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6541364 |
Bump forming method and bump forming apparatus
A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10 a on one surface of an object to be processed 10 to mount thereon...
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6541365 |
Insulating interposer between two electronic components and process thereof
The present invention relates generally to a new structure and a method for reducing the cost of producing known good die (KGD). More particularly, the invention encompasses a structure and a...
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6537854 |
Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductive elements on a substrate and devices formed by such method are disclosed. In the method, multi-layered bumps...
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6537850 |
Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
A semiconductor component includes a substrate, bonding pads on the substrate, and terminal contacts bonded to the bonding pads. Exemplary components include semiconductor packages, semiconductor...
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6534391 |
Semiconductor package having substrate with laser-formed aperture through solder mask layer
A semiconductor package and a method and a substrate for making the package are disclosed. The substrate of an exemplary package includes metal circuit patterns covered by a layer of an insulative...
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6531664 |
Surface mount devices with solder
A method for controlling the shape and height of solder connections of a surface mount circuit device, such as a flip chip, by way of controlling the manner and extent to which solder is able to...
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6531384 |
Method of forming a bond pad and structure thereof
A bond pad is formed by first providing a planarized combination of copper and silicon oxide features in a bond pad region. The silicon oxide features are etched back to provide a plurality...
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6528407 |
Process for producing electrical-connections on a semiconductor package, and semiconductor package
Process for producing electrical-connections on a semiconductor package containing an integrated-circuit chip and with an external protective layer having apertures that least partly expose metal...
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6528343 |
Semiconductor device its manufacturing method and electronic device
Disclosed herein is a semiconductor device, which comprises a semiconductor chip including, over one main surface thereof, first wirings, protective films formed so as to cover other portions...
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6528349 |
Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability
Compliant wafer level packages 10 and methods for monolithically fabricating the same. A monolithically fabricated compliant wafer level package 10 having a compliant layer 14 and a compliant...
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6524892 |
Method of fabricating multilayer flexible wiring boards
A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring,...
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6525275 |
Multilayer printed circuit boards
Multilayer printed circuit board includes a core substrate, multilayer wiring layer formed on the core substrate by alternately laminating interlaminar insulating layer and conductor circuit, and a...
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6524943 |
Method of forming metal bumps
Metal bumps are formed by using a bump material containing a metal material which melts only partially at a first temperature and melts entirely at a second temperature higher than the first...
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6524942 |
Bond pad structure and its method of fabricating
A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The...
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6521530 |
Composite interposer and method for producing a composite interposer
A composite interposer for providing power and signal connections between an integrated circuit chip or chips and a substrate. The interposer includes a signal core formed from a conductive...
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6521480 |
Method for making a semiconductor chip package
A method for making a semiconductor chip package. At least one compliant pad is provided on a surface of a substrate and a chip unit is attached to the at least one compliant pad. The at least one...
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6521521 |
Bonding pad structure and method for fabricating the same
A bonding pad structure. A substrate having a first surface and a second surface is provided. A metal bonding pad and a bonding region are respectively located on the first surface and the second...
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6518160 |
Method of manufacturing connection components using a plasma patterned mask
A connection component is made by providing an assembly comprising a base layer of a dielectric material, a metal layer overlying the base layer, and a top layer of a plasma-etchable material...
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6518161 |
Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die
A method for creating a die that has some bond pads that are compatible with wire bonding and others that are compatible with solder bonding. A layer of copper is disposed over aluminum bond pads...
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6514845 |
Solder ball contact and method
The invention is a method for attaching an electronic component ( 40 ) having Ball Grid Array contacts ( 36 ) to a circuit board contact array ( 31 ) to prevent the solder balls ( 36 ) of the Ball...
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6509256 |
Methods of forming electrically conductive interconnections and electrically interconnected substrates
Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided...
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6509207 |
Soldering method and apparatus for a chip and electronic devices
A soldering method for attaching a chip and electronic devices to a chip carrier has a lengthening reflowing time when attaching the electronic devices. Because the pins of the electronic device...
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6509646 |
Apparatus for reducing an electrical noise inside a ball grid array package
An apparatus for reducing an electrical noise inside a ball grid array package is disclosed. The apparatus mainly comprises a substrate, a plurality of solder balls and a plurality of...
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6507122 |
Pre-bond encapsulation of area array terminated chip and wafer scale packages
An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the...
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6506672 |
Re-metallized aluminum bond pad, and method for making the same
A electroless plating method re-metallizes aluminum bond pads so that the re-metallized bond pads include layers of aluminum, zinc, nickel, and gold. The re-metallized bond pads are wire-bondable...
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6503820 |
Die pad crack absorption system and method for integrated circuit chip fabrication
The die pad crack absorption integrated circuit chip fabrication system and method of the present invention minimizes the spread of cracks between layers of an integrated circuit chip. During an...
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