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6642079 |
Process of fabricating flip chip interconnection structure
In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder...
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6638793 |
Methodology to pack standard staggered bond input-output buffer into linear input-output buffer
A new method is provided that allows placing or stacking staggered bond I/O buffers into linear bond I/O buffers. The bond pads are linearly arranged, the interface between the staggered bond pad...
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6639314 |
Solder bump structure and a method of forming the same
A solder bump structure and a method for forming the same are disclosed. Over a contact pad a first and a second metal film are deposited, wherein the second metal film is patterned prior to the...
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6638847 |
Method of forming lead-free bump interconnections
A method of forming solder bumps on a chip or wafer for flip-chip applications comprises the steps of providing a chip or wafer having a plurality of metal bonds pads which provide electrical...
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6636313 |
Method of measuring photoresist and bump misalignment
A method including the acts of providing a semiconductor device having a plurality of misalignment ruler markers formed therein for measuring removable layer opening misalignment in the X and Y...
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6635510 |
Method of making a parylene coating for soldermask
A method for making an HDI circuit including backside connections uses parylene as a protective coating. The method includes the steps of: procuring an insulating substrate including an active chip...
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6630372 |
Method for routing die interconnections using intermediate connection elements secured to the die face
A semiconductor device, such as an integrated circuit die, includes a plurality of bond pads on an active surface thereof electrically connected to internal circuitry of the semiconductor device,...
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6624058 |
Semiconductor device and method for producing the same
There is provided a semiconductor device in which substantially no deformation of a bonded wire occurs, and a method for producing the semiconductor device. A wiring pattern of a wiring substrate...
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6624059 |
Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond
A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the...
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6620720 |
Interconnections to copper IC's
The specification describes a process for forming a barrier layer on copper metallization in semiconductor integrated circuits. The barrier layer is effective for both wire bond and solder bump...
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6620721 |
Method of forming a self-aligning pad
A method of forming a bonding pad on a substrate is provided. A first dielectric layer and at least one first conductive layer are included on the substrate. A second conductive layer is formed on...
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6617236 |
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
By adopting an electrolytic plating method in forming the bump, the drawbacks of the conventional electrolytic plating method should be avoided. For example, the necessity of adopting a lead wiring...
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6617195 |
Method of reflowing organic packages using no-clean flux
A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate;...
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6617694 |
Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device
The positions of first terminals of a first semiconductor chip have a plane symmetrical relationship with the positions of second terminals of a second semiconductor chip. First buffer circuits of...
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6617674 |
Semiconductor package and method of preparing same
A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone...
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6617234 |
Method of forming metal fuse and bonding pad
A method of forming metal fuses and bonding pads. A conductive layer is formed in a substrate. A dielectric layer is formed over the substrate. The dielectric layer has an opening that exposes a...
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6612025 |
Method for creating a connection within a multilayer circuit board assembly
A method for forming connections within a multi-layer electronic circuit board 10 . The method includes forming an aperture within the circuit board and selectively coating the interior surface of...
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6610590 |
Method of manufacturing a laser impression on a low thermal conductivity layer of a semiconductor device
A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be...
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6608377 |
Wafer level package including ground metal layer
A semiconductor chip package includes a ground metal layer disposed in close proximity to a signal layer for carrying electrical input and output signals to and from the chip. The ground metal...
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6608372 |
Surface mountable chip type semiconductor device and manufacturing method
A surface mountable chip type semiconductor device comprises: first and second conductive land areas which are formed on an insulating substrate and which are electrically coupled with each other;...
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6605522 |
Method of manufacturing a semiconductor device having a protruding bump electrode
A present semiconductor device includes a plurality of bump electrodes formed over a semiconductor substrate to allow signals to be input and output to and from a semiconductor element. After the...
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6605523 |
Manufacturing method for semiconductor device
A semiconductor device and a manufacturing method thereof are provided, wherein both bumps of a semiconductor chip and leads on a tape substrate can be accurately connected at the time of...
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6602776 |
Method and system for providing a polysilicon stringer monitor
A system and method detecting the presence of polysilicon stringers on a memory array using a polysilicon stringer monitor. The polysilicon stringer monitor includes a continuous type-2 layer of...
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6602778 |
Apparatus and methods for coupling conductive leads of semiconductor assemblies
A method and apparatus for electrically coupling bond pads on the surface of a microelectronic device. The apparatus can include a microelectronic device having at least two bond pads with a...
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6602775 |
Method to improve reliability for flip-chip device for limiting pad design
A method of fabricating a solder bump including the following steps. A UBM over a substrate.having an exposed pad portion is provided. The UBM being in electrical contact with the pad portion. A...
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6602733 |
Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding
A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages. The method for fabricating an...
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6599767 |
Method of avoiding bonding pad oxidation in manufacturing an OLED device
A method is disclosed for avoiding oxidation of a bonding pad served as an electrical connection to devices mounted on a transparent insulating substrate of a thin-film transistor applied to an...
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6596620 |
BGA substrate via structure
Typically, primary electrical connection between a semiconductor chip and an external solder ball contact on a Ball Grid or Chip Scale Package is by way of a via extending through a dielectric...
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6596619 |
Method for fabricating an under bump metallization structure
An under bump metallurgy (UBM) structure is described. Two UBM mask processes are utilized. First, a top layer of copper (Cu) and/or a middle layer of nickel-vanadium (NiV) or chrome-copper (CrCu)...
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6596618 |
Increased solder-bump height for improved flip-chip bonding and reliability
The present invention provides a method of forming solder bumps on a semiconductor chip, for flip-chip bonding, having increased height to improve the solder joint reliability of the flip-chip...
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6593222 |
Method to improve the reliability of thermosonic gold to aluminum wire bonds
A method for manufacturing an integrated circuit improves the reliability of thermosonic bonds formed to attach a gold bond wire to an aluminum interconnect pad by reducing corrosion of the...
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6593220 |
Elastomer plating mask sealed wafer level package method
A new method is provided for the creation of a solder mask for solder bump formation. A passivation layer is deposited on the semiconductor surface in the surface of which a contact pad has been...
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6590283 |
Method for hermetic leadless device interconnect using a submount
In accordance with the invention, a semiconductor device having an electrical input/output contact surface is hermetically sealed and provided with connections via a submount such as a two-level...
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6589859 |
Method of manufacturing an electronic power component, and an electronic power component obtained thereby
In the method, the following are placed in succession on a substrate: at least one conductive layer and at least one semiconductor power circuit, and metal connection tabs are fitted to the face of...
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6586270 |
Process for producing a photovoltaic element
A process for producing a stable photovoltaic element having an electrode structure comprising a collecting electrode and a metal bus bar which are connected to have an improved connection between...
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6586322 |
Method of making a bump on a substrate using multiple photoresist layers
A method of forming a bump on a substrate such as a semiconductor wafer or flip chip. The method includes the step of providing a semiconductor device having a contact pad and an upper passivation...
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6586278 |
Method for mounting electronic component and structure having mounted thereon an electronic component
A method for mounting an electronic component on a substrate is shown, which involves positioning an electronic component 1 on wiring electrodes 5 of a substrate 4 via bumps 3 , application...
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6583040 |
Method of making a pillar in a laminated structure for a semiconductor chip assembly
A method of making a semiconductor chip assembly includes providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a...
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6583039 |
Method of forming a bump on a copper pad
A method of forming a bump overlying the copper based contact pad to prevent oxidation of the copper based contact pad. A passivation blanket is deposited over a semiconductor device having a...
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6582983 |
Method and wafer for maintaining ultra clean bonding pads on a wafer
The present invention teaches a sawn wafer with ultra clean bonding pads on die which enhance the strength of wire bond and results in higher yield and improved reliability of packaged...
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6579734 |
Wire bonding method
A semiconductor device is provided which is obtained by wire bonding without any drop in wire bonding characteristics. A bonding pad is prepared on which a wire bonding region and a test region...
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6579744 |
Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
The present invention includes electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive. In one...
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6576541 |
Method and structure for producing bumps on an IC package substrate
A method for producing bumps on an IC package substrate. The method first deposits a medium layer on a protective layer of the IC package substrate, which has good adherence ability to both the...
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6576540 |
Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads
The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with...
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6576560 |
Method for avoiding the fluorination of the metal contact of the semiconductor device
First of all, a semiconductor substrate having a metal contact thereon is provided. Then a protecting layer is formed on the semiconductor substrate and the metal contact. Afterward, an etching...
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6576839 |
Bond-ply structure for interconnection of circuit layer pairs with conductive inks
A unique bond-ply structure and associated processes for processing of the bond-ply structure and for joining together circuit layer pairs which makes it possible to create a bond-ply having raised...
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6573606 |
Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect
In the invention an electrically isolated copper interconnect structural interface is provided involving a single, about 50-300 A thick, alloy capping layer, that controls diffusion and...
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6573170 |
Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device
A semiconductor integrated circuit device including a plurality of holes in an interlayer insulating film beneath a bonding pad wherein a plug is buried in the respective holes and is made of the...
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6574087 |
Electronic device and manufacture thereof
Electrode layers ( 1, 2 ) are arranged on both sides of a dielectric layer ( 3 ) facing each other so as to configure a capacitor. Lead electrodes ( 4, 5 ) are formed in the electrode layers ( 1, 2...
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6569755 |
Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same
According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having...
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