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6713881 |
Semiconductor device and method of manufacturing same
Object: To provide sufficient connection strength between the bonding pads and conductor wires in a wire bonding method. Means for Solution: The bonding pads 20 upon a semiconductor chip 18 ...
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6713376 |
Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board
In a method of manufacturing a contact element, provision is made of a laminated body which has an insulating film, an electrically conductive layer stacked on the insulating film, and bump holes...
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6710460 |
Semiconductor devices and methods for manufacturing the same
In a method for manufacturing a semiconductor device in which wiring layers are formed by a damascene method, certain embodiments relate to a manufacturing method and a semiconductor device, in...
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6709964 |
Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints
A semiconductor device package includes an integrated circuit chip having a plurality of chip pads thereon, and a plurality of ball pads rerouted from the chip pads, and a substrate including a...
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6708871 |
Method for forming solder connections on a circuitized substrate
A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as...
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6709965 |
Aluminum-copper bond pad design and method of fabrication
A process for forming a bond pad structure to be used to accommodate a subsequent wire bond, has been developed. The process features defining a bond pad opening in a composite insulator stack,...
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6709963 |
Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps
A method and an apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor chip by jet printing a flux pattern, which is substantially...
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6706556 |
Making interconnections to a non-flat surface
A non-planar surface may be surface mounted to another surface using solder balls that may be modified to generate a planar surface for receiving the second surface. In one embodiment, the solder...
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6706554 |
Conductor posts, construction for and method of fabricating semiconductor integrated circuit chips using the conductor post, and method of probing semiconductor integrated circuit chips
A first IC chip having an electrode pad to which a re-wiring layer is not connected and a second IC chip having an electrode pad to which the re-wiring layer is connected are electrically connected...
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6706621 |
Wafer integrated rigid support ring
A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform...
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6706564 |
Method for fabricating semiconductor package and semiconductor package
A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a...
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6706961 |
Photovoltaic device and process for the production thereof
A photovoltaic device having a first electrode comprising a metallic wire, a second electrode connected to the first electrode, and a joint portion composed of conductive particles and a resin. The...
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6706622 |
Bonding pad interface
A method for providing under bump metallization on a substrate. Trenches are formed in the substrate, and a layer of first electrically conductive material is formed over the substrate. The layer...
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6706557 |
Method of fabricating stacked die configurations utilizing redistribution bond pads
A stacked semiconductor package including a plurality of stacked semiconductor devices on a substrate, and a method of forming the same. The semiconductor devices are stacked in an active...
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6703299 |
Underfill process for flip-chip device
The present invention relates to a method of packaging a microelectronic device that, in one embodiment, uses a vacuum-assisted underfill process. One embodiment of the method uses a curing process...
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6699780 |
Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip with upper and lower surfaces, wherein the upper surface includes a conductive pad,...
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6699732 |
Pitch compensation in flip-chip packaging
A flip-chip package and packaging method use a substrate having bond pad spacing that matches terminal spacing on a chip at an elevated temperature, such as the temperature of the chip during...
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6699736 |
Electrical coupling of a stiffener to a chip carrier
A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface....
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6696356 |
Method of making a bump on a substrate without ribbon residue
A method of forming a bump on a substrate such as a semiconductor wafer or flip chip without producing metal ribbon residue. The method includes the step of providing a semiconductor device having...
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6696357 |
Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film
Peeling between a bonding pad and an insulating film which underlies the bonding pad is to be prevented. A laminate film constituted mainly by W which is higher in mechanical strength than a wiring...
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6689634 |
Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability
A modeling technique for selectively depopulating solder balls ( 12 ) (and their respective solder ball pads ( 34 ), vias ( 32 ) and traces or lines ( 30 )) from a conventional foot print of a ball...
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6689680 |
Semiconductor device and method of formation
In accordance with one embodiment of the present invention, a semiconductor device underbump metallurgy ( 414 ) is formed over a semiconductor bond pad ( 128 ), wherein the underbump metallurgy (...
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6689678 |
Process for fabricating ball grid array package for enhanced stress tolerance
The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow...
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6689679 |
Semiconductor device having bumps
A method of forming a bump, including: a first step of bonding a ball-shaped tip portion of a conductive wire to an electrode by a first tool so that a portion of the tip portion, positioned around...
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6686665 |
Solder pad structure for low temperature co-fired ceramic package and method for making the same
A package for semiconductor devices, and methods for making the same are provided. The package includes a low temperature co-fired ceramic body that has a plurality of conductive interconnect...
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6678950 |
Method for forming a bonding pad on a substrate
A bonding pad for an integrated circuit, having a conductive base layer. The conductive base layer has slots formed in it, where the slots extend completely through the conductive base layer. An...
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6677228 |
Reinforced aluminum copper bonding pad
A method of forming a bond pad structure reinforced with insulator spacers located on the sides of the bond pad structure has been developed. The method features formation of an aluminum based bond...
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6677227 |
Method of forming patterned metalization on patterned semiconductor wafers
A metalization process forms metal contacts having defined profiles for contact between microelectromechanical (MEMS) devices or chemical sensors with semiconductor devices. Gold contacts may be...
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6673656 |
Semiconductor chip package and manufacturing method thereof
This invention provides a method for manufacturing a semiconductor chip package which mainly utilizes a substrate having a organic surface protection thereon to package a central-pad chip. In the...
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6670214 |
Insulated bonding wire for microelectronic packaging
A method for insulating a bonding wire that includes the steps of attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire...
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6670264 |
Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin...
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6667558 |
Module and method of making same
A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the...
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6667559 |
Ball grid array module and method of manufacturing same
A ball grid array module is provided. In particular, the ball grid array module includes a substrate with two layers of insulation positioned thereon. At least one cavity having a side wall and a...
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6664176 |
Method of making pad-rerouting for integrated circuit chips
A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, printing a conductive...
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6664175 |
Method of forming ruthenium interconnect for an integrated circuit
A multi-layered metal bond pad for a semiconductor die having a conductive metal layer and an overlying ruthenium electrode layer. The ruthenium electrode layer protects the conductive metal from...
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6664127 |
Method of manufacturing multi-layer printed wiring board
In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having...
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6664130 |
Methods of fabricating carrier substrates and semiconductor devices
A micromachined insulative carrier substrate preferably formed of silicon and a multi-chip module formed from the micromachined substrate. The micromachined substrate is fabricated by forming mesas...
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6662351 |
Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern
A wiring editing method for a semiconductor package of this invention includes the steps of assuming virtual circular arcs R 1 to R 4 in consideration of a clearance around a predetermined via ...
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6660624 |
Method for reducing fluorine induced defects on a bonding pad surface
A method for reducing a fluorine contamination level on a semiconductor wafer process surface including providing a semiconductor wafer surface having a process surface including an uppermost...
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6656827 |
Electrical performance enhanced wafer level chip scale package with ground
A method including providing a first substrate having a first bond pad and a second bond pad; forming a subassembly comprising securing a second substrate to the first substrate with a ground layer...
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6656826 |
Semiconductor device with fuse to be blown with energy beam and method of manufacturing the semiconductor device
A semiconductor device has a fuse to be blown with an energy beam. The semiconductor device has copper wiring levels formed on a semiconductor substrate on which semiconductor elements are formed,...
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6657311 |
Heat dissipating flip-chip ball grid array
A heat dissipating flip-chip Ball Grid Array (BGA) ( 10 ) including a substrate ( 12 ), a die ( 14 ), a first set of solder balls ( 16 ) coupling the die with the substrate, a thermal compound ( 20...
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6652688 |
Process for producing semiconductor wafer with adhesive film
A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a...
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6651323 |
Method for making a printed wire board having a heat-sinking solder pad
A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed...
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6650020 |
Resin-sealed semiconductor device
The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their...
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6649507 |
Dual layer photoresist method for fabricating a mushroom bumping plating structure
A method of forming a bump structure, comprising the following steps. A structure having an exposed first conductive structure is provided. A first photoresist layer is formed over the structure...
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6649506 |
Method of fabricating vias in solder pads of a ball grid array (BGA) substrate
Disclosed is a method for fabricating vias in solder pads of a ball grid array (BGA) substrate. The substrate is drilled to form the plural vias, and then the interior surfaces of said vias are...
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6642079 |
Process of fabricating flip chip interconnection structure
In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder...
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6638793 |
Methodology to pack standard staggered bond input-output buffer into linear input-output buffer
A new method is provided that allows placing or stacking staggered bond I/O buffers into linear bond I/O buffers. The bond pads are linearly arranged, the interface between the staggered bond pad...
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6639314 |
Solder bump structure and a method of forming the same
A solder bump structure and a method for forming the same are disclosed. Over a contact pad a first and a second metal film are deposited, wherein the second metal film is patterned prior to the...
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