Matches 1 - 50 out of 81 1 2 >
Match Document Document Title
7393771 Method for mounting an electronic part on a substrate using a liquid containing metal particles  
An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an...
7384862 Method for fabricating semiconductor device and display device  
It is an object of the present invention to alleviate unevenness due to an opening for making a contact with the lower layer even when the opening has a large diameter (1 μm or more). Thus, it is...
7361590 Semiconductor device and manufacturing method thereof  
A method of manufacturing a semiconductor device includes: preparing a semiconductor element having a first metal layer made of first metal on a surface thereof, and a metal substrate made of...
7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device  
Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor...
7358110 Image sensor having inner lens  
An image sensor includes an inner lens to enable incident light to reach a condensing lens, so that the incident light may further reach photodiodes. Light loss can be reduced and photosensitivity...
7348266 Method and apparatus for a metallic dry-filling process  
An iPVD system is programmed to deposit uniform material, such as a metallic material, into high aspect ratio nano-sized features on semiconductor substrates using a process that enhances the...
7326358 Plasma processing method and apparatus, and storage medium  
A plasma processing method performs a plasma processing on a substrate mounted on a mounting table installed in an airtight processing chamber, the mounting table having a smaller size than the...
7265043 Methods for making microwave circuits  
Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on...
7135394 Conductive layers and fabrication methods thereof  
Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed...
7084053 Unidirectionally conductive materials for interconnection  
A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie...
7074722 Method for fabricating semiconductor device with fine pattern  
The present invention relates to a method for fabricating a semiconductor device with a fine pattern. The method includes the steps of: (a) forming a semiconductor substrate structure including a...
7026231 Method of producing organic semiconductor device including step of applying oxidizing agent solution to monomer layer to obtain polymer layer  
There is provided a method of producing an organic semiconductor device by which an organic semiconductor device having an optional configuration can easily be produced. A method of producing an...
6989324 Fabrication method for arranging ultra-fine particles  
A method and resultant device, in which metal nanoparticles are self-assembled into two-dimensional lattices. A periodic hole pattern (wells) is fabricated on a photoresist substrate, the wells...
6982191 Methods relating to forming interconnects and resulting assemblies  
Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component...
6974723 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials  
A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive...
6972256 Method and apparatus for forming thin film of metal  
The present invention relates to a method of and an apparatus for forming a thin metal film of copper, silver, or the like on a surface of a semiconductor or another substrate. A method of forming...
6939744 Use of palladium in IC manufacturing with conductive polymer bump  
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a...
6911385 Interface layer for the fabrication of electronic devices  
The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is...
6897137 Process for fabricating ultra-low contact resistances in GaN-based devices  
A process for fabricating ohmic contacts in a field-effect transistor includes the steps of: thinning a semiconductor layer forming recessed portions in the semiconductor layer; depositing ohmic...
6893896 Method for making multilayer thin-film electronics  
Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance...
6881604 Method for manufacturing nanostructured thin film electrodes  
A method for a binder-free manufacturing a nanostructured porous film, e.g. for use in solar cells, includes the steps of preparing a suspension of semi-conducting nanometer-sized particles in a...
6878305 Attaching components to a printed circuit card  
Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board,...
6864147 Protective coating for electrolytic capacitors  
A solid electrolytic capacitor that comprises an anode that contains a valve-action metal (e.g., tantalum, niobium, and the like) and a dielectric film overlying the anode is provided. The...
6849953 Microelectronic assemblies with composite conductive elements  
A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect...
6848178 Enhancement of current-carrying capacity of a multilayer circuit board  
A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating...
6818155 Attaching components to a printed circuit card  
Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board,...
6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure  
A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4 , which becomes reactive after electric continuity through a conductive particle 3 appeared in...
6796025 Method for mounting electronic part and paste material  
In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the...
6787908 Pad metallization over active circuitry  
Metal bond pads are formed over active circuitry in a semiconductor chip in a reliable and cost effective manner. According to an example embodiment of the present invention, a metal bond pad is...
6780765 Integrated circuit trenched features and method of producing same  
A metal processing method is provided for growing a polycrystalline film by preferably chemical vapor deposition (CVD) from a suitable precursor gas or gases on a substrate which has been coated...
6774036 Integrated circuit trenched features and method of producing same  
The formation of microelectronic structures in trenches and vias of an integrated circuit wafer are described using nanocrystal solutions. A nanocrystal solution is applied to flood the wafer...
6723494 Conductor pattern and electronic component having the same  
A conductor pattern is constructed to prevent corners from peeling and raising off a substrate. The conductor pattern has a spiral configuration and includes straight lines and corners connected to...
6699767 Manufacture of solid state capacitors  
The present invention concerns the field of solid state capacitors and relates particularly to massed production methods for manufacturing solid state capacitors. According to one aspect of the...
6693353 Semiconductor package and method for producing heat-radiating substrate for it  
A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu—Mo composite as prepared by impregnating from 30 to 40% by mass...
6673709 Formation of an aluminide coating, incorporating a reactive element, on a metal substrate  
The reactive element is introduced to the surface of the metal substrate in the form of an oxide powder and the aluminide-type coating is then formed.
6670264 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby  
A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin...
6667229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip  
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a conductive trace and an insulative base, wherein the chip...
6645844 Methods for high density direct connect LOC assembly  
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die...
6620645 Making and connecting bus bars on solar cells  
A method for fabricating multi-cell solar devices using thermal spray deposition techniques to spray metal powder directly on solar cells and on the backing upon which solar cells are assembled, to...
6620345 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure  
A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in...
6569752 Semiconductor element and fabricating method thereof  
The present semiconductor element comprises a semiconductor substrate, a wiring pad formed thereon, a layer of barrier metal formed thereon, an intermetallic compound Ag 3 Sn formed thereon, and a...
6555296 Fine pitch wafer bumping process  
A fine pitch wafer bumping process comprises: providing a wafer that has a plurality of contact pads exposed by a passivation layer formed on the surface of the wafer, wherein an under bump metal...
6458630 Antifuse for use with low k dielectric foam insulators  
A fusible link for a semiconductor device comprises an insulating substrate and a conductive line pair on the surface of the insulating substrate, with the conductive line pair having spaced ends....
6400024 Method of providing a vertical interconnect between thin film microelectronic devices  
A simple and reliable method of providing a vertical interconnect between thin-film microelectronic devices is provided. In said method, a tool tip is used to make a notch in a vertical...
6399475 Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops  
Process for producing electrical connections on the surface of a semiconductor package containing an integrated-circuit chip and having metal electrical-connection regions on the surface of the...
6379745 Low temperature method and compositions for producing electrical conductors  
A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (TOM). These compositions can be applied by any convenient printing process to...
6372616 Method of manufacturing an electrical interconnection of a semiconductor device using an erosion protecting plug in a contact hole of interlayer dielectric layer  
A method of manufacturing an electrical interconnection of a semiconductor device produces an erosion protecting plug in a contact hole to protect a selected portion of an interlayer dielectric...
6359337 Composite electrical contact structure and method for manufacturing the same  
An improved wear resistant bump contact is produced by the inclusion of small particles of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of...
6350669 Method of bonding ball grid array package to circuit board without causing package collapse  
A method is proposed for bonding a BGA (Ball Grid Array) package to a circuit board without causing the collapsing of the BGA package against the circuit board. The proposed method is characterized...
6339024 Reinforced integrated circuits  
A method of manufacturing integrated circuits wherein a conductive structure in a topmost semiconductive layer of an integrated circuit is provided having a thickness greater than or equal to 1.5...
Matches 1 - 50 out of 81 1 2 >