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7615386 Thick oxide film for wafer backside prior to metalization loop  
A method for reducing wafer backside large particle contamination, comprising: performing front end of line processing of a memory device, depositing a thick oxide on the wafer backside so that at...
7611948 Methods of forming non-volatile memory device  
A method of forming a non-volatile memory device includes forming first mask patterns, which can have relatively large distances therebetween. A distance regulating layer is formed that conformally...
7589257 Genes for enhancing nitrogen utilization efficiency in crop plants  
The invention provides isolated NUE (nitrogen utilization efficiency) nucleic acids and their encoded proteins. The present invention provides methods and compositions relating to altering nitrogen...
7533361 System and process for manufacturing custom electronics by combining traditional electronics with printable electronics  
A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated...
7528494 Accessible chip stack and process of manufacturing thereof  
A process of manufacturing a three-dimensional integrated circuit chip or wafer assembly and, more particularly, a processing of chips while arranged on a wafer prior to orienting the chips into...
7518236 Power circuit package and fabrication method  
A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with...
7512501 Defect inspecting apparatus for semiconductor wafer  
A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of...
7485571 Method of making an integrated circuit  
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
7471146 Optimized circuits for three dimensional packaging and methods of manufacture therefore  
An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second...
7457454 Detailed grey scale inspection method and apparatus  
A method for inspecting semiconductor wafers and the like is presented. The method comprises initially determining a baseline greyscale difference, such as a greyscale plot or greyscale visual...
7427517 Stacking apparatus and method for stacking integrated circuit elements  
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move...
7391117 Method for fabricating semiconductor components with conductive spring contacts  
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor...
7382363 Microencapsulated electrophoretic display with integrated driver  
A mounted display assembly comprises a flexible substrate that supports both display elements and control circuits. The display assembly generally comprises: an electrical connection formed on the...
7378287 Wafer matching methods for use in assembling micromirror array devices  
The invention provides a method for matching micromirror wafers and electrode wafers so as to form micromirror array devices while the production yield is maximized. Each micromirror wafer and/or...
7348263 Manufacturing method for electronic component, electronic component, and electronic equipment  
A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing...
7316786 Method of polishing film to be polished  
A method is provided that includes a main laminate making step of forming a plurality of main magnetic poles onto a substrate, covering each magnetic pole with a first protective film, and forming...
7314821 Method for fabricating a semiconductor interconnect having conductive spring contacts  
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor...
7282374 Method and apparatus for comparing device and non-device structures  
The present invention provides a method and apparatus for comparing device and non-device structures. The method includes determining at least one characteristic parameter associated with at least...
7258838 Solid state molecular probe device  
A solid state nanopore device including two or more materials and a method for fabricating the same. The device includes a solid state insulating membrane having an exposed surface, a conductive...
7226849 Method of producing integrated semiconductor components on a semiconductor substrate  
There is provided a method of producing multiple semiconductor components on a substrate, said method comprising the steps of: forming a predetermined relief pattern on a surface of said substrate;...
7214594 Method of making semiconductor device using a novel interconnect cladding layer  
A method and apparatus are provided an interconnect cladding layer. In one embodiment, a first sacrificial layer is deposited over a substrate and patterned. In the vias created during the...
7115512 Methods of forming semiconductor constructions  
The invention includes methods by which a fuse box of a semiconductor construction is fabricated to have a substantially uniform layer over fuses extending therein. In particular aspects, the...
7105877 Conductive line structure  
A conductive line Structure. In one embodiment of the invention, a conductive line includes at least two outer conductive portions, an inner conductive portion between the outer conductive...
7098394 Method and apparatus for powering circuitry with on-chip solar cells within a common substrate  
A system and method for providing power to a light-powered transponder. In order to create a sufficient voltage differential, two different photovoltaic elements are used. The photovoltaic elements...
7088852 Three-dimensional tomography  
Defect analysis of a semiconductor die is enhanced in a manner that makes possible the viewing of spatial manifestations of the defect from virtually any angle. According to an example embodiment...
7087444 Method for integration of microelectronic components with microfluidic devices  
A method of forming an integrated microelectronic device and a micro channel is provided. The method offers an inexpensive way of integrating devices that are usually incompatible during...
7087439 Method and apparatus for thermally assisted testing of integrated circuits  
A system and method for thermally testing integrated circuits, comprising a temperature generation device located within the IC, configured with a primary purpose of affecting a temperature at the...
7015057 Method of manufacturing a drive circuit of active matrix device  
A data holding control signal for each data line is supplied to a plurality of source followers that are connected together in parallel. The parallel-connected source followers are a combination of...
6988017 Adaptive sampling method for improved control in semiconductor manufacturing  
A method is provided, the method comprising sampling at least one parameter characteristic of processing performed on a workpiece in at least one processing step, and modeling the at least one...
6967109 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units  
A method and apparatus for measuring a potential difference for plasma processing with a plasma processing apparatus that processes a sample by introducing a gas into a vacuum chamber and generates...
6955926 Method of fabricating data tracks for use in a magnetic shift register memory device  
A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. Vias of approximately 10...
6909993 Method for diagnosing failure of a manufacturing apparatus and a failure diagnosis system  
A method for diagnosing failure of a manufacturing apparatus, includes: measuring time series data of characteristics of a reference apparatus which conducts same processes as the manufacturing...
6902998 Methods of manufacturing semiconductor devices having storage nodes  
A semiconductor device is manufactured by forming a first insulating layer on a semiconductor substrate. First contact pads and second contact pads are formed that penetrate through the first...
6892157 On-die automatic selection of manipulated clock pulse  
A circuit and method to automatically identify and manipulate a pulse in each of a sequence of clocking signals for an integrated circuit includes a clock manipulation circuit to manipulation the...
6882058 Organic acid containing compositions and methods for use thereof  
In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux...
6881659 Methods of forming self-aligned contact structures in semiconductor integrated circuit devices  
Methods of forming integrated circuit devices (e.g., memory devices) include the use of preferred self-aligned contact hole fabrication steps. These steps improve process reliability by reducing...
6872581 Measuring back-side voltage of an integrated circuit  
Methods for integrated circuit diagnosis, characterization or modification using a charged particle beam. In one implementation, the bulk silicon substrate of an integrated circuit is thinned to...
6861269 Electric-circuit fabricating method and system, and electric-circuit fabricating program  
A method of fabricating an electric circuit, including first and second working processes of performing respective first and second working operations on a circuit substrate, where3in the first...
6858162 Single molecule realization of the switch and doide combination  
Diodes and switches are combined in a single molecular species. Thus, the single molecular species is capable of performing more than one function. A single molecular species having both diode and...
6855568 Apparatus and methods for monitoring self-aligned contact arrays using voltage contrast inspection  
Disclosed are methods and apparatus for detecting defects in a partially fabricated semiconductor device with self-aligned contacts. The self-aligned contacts are formed from a first layer with a...
6855566 Optical semiconductor module and method of producing the same  
An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 ...
6835578 Test structure for differentiating the line and via contribution in stress migration  
A method of measuring the stress migration of vias, and a the structure, the method comprising the following steps. A metal line having a middle and opposing first and second ends is formed. First...
6821793 Optical excitation/detection device and method for making same using discrete photoemitter devices  
The disclosure is directed toward an optical excitation/detection device that includes an arrayed plurality of photodetectors and discrete photoemitters, as well as a method for making such a...
6806106 Bond wire tuning of RF power transistors and amplifiers  
A method for manufacturing a power transistor circuit includes securing a die to a substrate, the die comprising a transistor having an input terminal and an output terminal. One or more...
6799133 Test mode control circuit for reconfiguring a device pin of an integrated circuit chip  
A test mode control circuit for reconfiguring a device pin of an integrated circuit chip which is initially configured in a test mode includes an input register for applying trim/configuring data...
6798003 Reliable adhesion layer interface structure for polymer memory electrode and method of making same  
A polymer memory device includes two organic adhesion layers that facilitate an integral package comprising a lower and an upper electrode and the ferroelectric polymer memory structure. The...
6787459 Method for fabricating a semiconductor device  
There is provided a method of fabricating a semiconductor device whereby fine patterns are formed with high dimensional accuracy by means of multiple exposures, using a phase shift mask and a trim...
6783862 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures  
A structure useful for electrical interconnection comprises a substrate; a plurality of porous dielectric layers disposed on the substrate; an etch stop layer disposed between a first of the...
6770493 Integrated circuit package capable of operating in multiple orientations  
An integrated circuit design is provided capable of operating in multiple insertion orientations. In particular, the inventive circuit design includes an integrated circuit package having a...
6733624 Apparatus for holding an object to be processed  
An apparatus for holding an object to be processed, according to this invention is mounted in a plasma processing apparatus and includes a convex-shaped holder main body, first dielectric film, and...
Matches 1 - 50 out of 153 1 2 3 4 >