Matches 1 - 50 out of 187 1 2 3 4 >


Match Document Document Title
8135485 Offset correction techniques for positioning substrates within a processing chamber  
A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of...
8129201 Stacking apparatus and method for stacking integrated circuit elements  
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move...
8076164 On-die bond wires system and method for enhancing routability of a redistribution layer  
An integrated circuit includes a first die and a second die positioned in a package. The first die has a redistribution layer formed on the die and including a plurality of relocated bond pads. The...
8071397 Semiconductor fabricating apparatus with function of determining etching processing state  
A semiconductor fabricating method including: placing the semiconductor wafer having a film thereon inside of a chamber; generating plasma; detecting a quantity of interference lights for each of...
8072045 Extendable connector and network  
Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected ends. The connector is unbundled...
8048691 Wiring forming method  
Size reduction and high integration of each of the laminated substrates are achieved, while forming an excellent wiring which electrically connects the substrates to each other. A conductive ink,...
7989226 Clocking architecture in stacked and bonded dice  
A method and apparatus for distributing clock signals throughout an integrated circuit is provided. An embodiment comprises a distribution die which contains either the clock signal distribution...
7981774 Assembly of quasicrystalline photonic heterostructures  
A method and system for assembling a quasicrystalline heterostructure. A plurality of particles is provided with desirable predetermined character. The particles are suspended in a medium, and...
7981700 Semiconductor oxidation apparatus and method of producing semiconductor element  
A semiconductor oxidation apparatus is provided with a sealable oxidation chamber defined by walls, a base provided within the oxidation chamber and configured to support a semiconductor sample, a...
7977122 Fluidic device containing 3D structures  
A micro fluidic device comprises a laminate structure, comprising a plurality of individual layers. At least one layer comprises a micro fluidic channel structure and at least on one side of said...
7960197 Method of making a solid-state imaging device  
A solid-state imaging device includes the following elements. A photoelectric conversion section is arranged in a semiconductor layer having a first surface through which light enters the...
7944047 Method and structure of expanding, upgrading, or fixing multi-chip package  
Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP...
7935549 Seminconductor device  
The present invention provides a signal transmitting/receiving method comprising: disposing a ferromagnetic film between a semiconductor device having an inductor and an external device which...
7931867 Uniform surfaces for hybrid material substrates and methods for making and using same  
Devices, systems and methods of using same where hybrid substrate materials are provided with a substantially uniform surface to provide uniformity of properties, including interaction with their...
7927892 Thermal treatment apparatus, thermal treatment method and method of manufacturing semiconductor device  
A thermal treatment apparatus having a first light source emitting a first light having light diffusion property, a reflectance measuring unit irradiating a treatment target with the light from...
7898067 Pre-molded, clip-bonded multi-die semiconductor package  
Semiconductor packages that contain multiple dies and methods for making such packages are described. The semiconductor packages contain a leadframe with multiple dies and also contain a single...
7882482 Layout schemes and apparatus for high performance DC-DC output stage  
A layout method that enables a high power switch mode voltage regulator integrated circuit to generate a large output current and achieve substantially low switching loss is disclosed. The layout...
7844857 Writing data processing control apparatus, writing method, and writing apparatus  
A writing data processing control apparatus includes an assignment part configured to assign processing of a plurality of pieces of writing data of predetermined divided writing regions, stored in...
7838342 Memory device and method  
During first portion of a first read cycle determining that a first input of a sense amplifier is to receive information based upon a state of a storage cell during a first portion of a read cycle,...
7838333 Electronic device package and method of manufacturing the same  
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic...
7834424 Extendable connector and network  
Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected ends. The connector is unbundled...
7811931 Semiconductor device having a modified dielectric film  
A semiconductor device has a plurality of interconnect layers each including a plurality of interconnect lines. The semiconductor device includes a dielectric film (HDP film) formed by means of...
7810702 Solder standoffs for injection molding of solder  
A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS....
7763496 Stacked semiconductor memory device and control method thereof  
A stacked semiconductor memory device includes an interface chip and a plurality of core chips, in which the interface chip and the plurality of core chips are stacked. The core chips are mutually...
7759705 Semiconductor devices fabricated with different processing options  
A semiconductor device, wherein: a first fabricating option provides a plurality of user configurations to configure the device functionality; and a second fabricating option hard-wires a said...
7741231 Techniques for providing decoupling capacitance  
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mole vias...
7722434 Apparatus for measurement of parameters in process equipment  
Some problems related to processing workpieces are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting data...
7723852 Stacked semiconductor package and method of making same  
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an...
7723130 Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof  
A tooling method for fabricating semiconductor devices includes identifying two adjacent device lines having a device-to-device spacing width in an active region of a substrate, performing an...
7718511 Processing method for wafer  
A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is...
7707713 Component-embedded circuit board fabrication method  
A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of...
7687298 Microelectromechanical device with integrated conductive shield  
A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate...
7666690 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack  
Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective...
7655481 Method for manufacturing industrial products and combination of masks for manufacturing the same  
A method for manufacturing an industrial product encompasses: forming a intermediate product pattern, which implements a part of a intermediate product of the industrial product by a sequence of...
7640647 Method of assembling a packaged high frequency circuit module  
Projecting elongate stub walls are provided on the planar surfaces of a substrate at positions where bonding of the substrate to a clamping lid or base is to be carried out. On firing of the...
7632707 Electronic device package and method of manufacturing the same  
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic...
7629182 Space and process efficient MRAM and method  
Methods and apparatus are provided for magnetoresistive random access memory (MRAM) bits (52, 52′) combined with associated drive or sense transistors (53, 141) to form an integrated MRAM array. T...
7615386 Thick oxide film for wafer backside prior to metalization loop  
A method for reducing wafer backside large particle contamination, comprising: performing front end of line processing of a memory device, depositing a thick oxide on the wafer backside so that at...
7611948 Methods of forming non-volatile memory device  
A method of forming a non-volatile memory device includes forming first mask patterns, which can have relatively large distances therebetween. A distance regulating layer is formed that conformally...
7589257 Genes for enhancing nitrogen utilization efficiency in crop plants  
The invention provides isolated NUE (nitrogen utilization efficiency) nucleic acids and their encoded proteins. The present invention provides methods and compositions relating to altering nitrogen...
7533361 System and process for manufacturing custom electronics by combining traditional electronics with printable electronics  
A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated...
7528494 Accessible chip stack and process of manufacturing thereof  
A process of manufacturing a three-dimensional integrated circuit chip or wafer assembly and, more particularly, a processing of chips while arranged on a wafer prior to orienting the chips into...
7518236 Power circuit package and fabrication method  
A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with...
7512501 Defect inspecting apparatus for semiconductor wafer  
A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of...
7485571 Method of making an integrated circuit  
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
7471146 Optimized circuits for three dimensional packaging and methods of manufacture therefore  
An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second...
7457454 Detailed grey scale inspection method and apparatus  
A method for inspecting semiconductor wafers and the like is presented. The method comprises initially determining a baseline greyscale difference, such as a greyscale plot or greyscale visual...
7427517 Stacking apparatus and method for stacking integrated circuit elements  
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move...
7391117 Method for fabricating semiconductor components with conductive spring contacts  
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor...
7382363 Microencapsulated electrophoretic display with integrated driver  
A mounted display assembly comprises a flexible substrate that supports both display elements and control circuits. The display assembly generally comprises: an electrical connection formed on the...
Matches 1 - 50 out of 187 1 2 3 4 >