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7611933 |
Process for manufacturing a thin-film transistor (TFT) device and TFT device manufactured by the process
A process for manufacturing a thin-film transistor device includes forming a dielectric insulation layer on a substrate, forming an amorphous silicon layer on the dielectric insulation layer,...
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7605069 |
Method for fabricating semiconductor device with gate
A method for fabricating a semiconductor device with a gate is provided. The method includes: forming a gate insulation layer over a substrate; sequentially forming a polysilicon layer, a silicide...
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7605068 |
Semiconductor device having a silicide layer and manufacturing method thereof
Provided is a semiconductor device and a manufacturing method thereof. The method includes the steps of: forming a thin film transistor including a substrate having a semiconductor layer and...
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7601623 |
Method of manufacturing a semiconductor device with a gate electrode having a laminate structure
A semiconductor device includes a semiconductor substrate having a semiconductor layer, a gate electrode, a source region, a drain region, an element separation insulating film layer and a wiring....
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7601577 |
Work function control of metals
Forming metal gate transistors that have different work functions is disclosed. In one example, a first metal, which is a ‘mid gap’ metal, is manipulated in first and second regions by second...
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7595245 |
Semiconductor device having a gate electrode material feature located adjacent a gate width side of its gate electrode and a method of manufacture therefor
The present invention provides a semiconductor device, a method of manufacture therefore and an integrated circuit including the same. The semiconductor device ( 300 ), without limitation, may...
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7592674 |
Semiconductor device with silicide-containing gate electrode and method of fabricating the same
There is provided a semiconductor device which is capable of solving a problem of threshold control in CMOS transistor, accompanied with combination of a gate insulating film having a high...
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7585756 |
Semiconductor device and method of manufacturing the same
A MOS transistor includes a substrate, source/drain regions formed at portions of the substrate, and a channel region formed between the source/drain regions. The MOS transistor further includes a...
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7579231 |
Semiconductor device and method of manufacturing the same
Disclosed is a method of manufacturing a semiconductor device, comprising forming a metal compound film directly or indirectly on a semiconductor substrate, forming a metal-containing insulating...
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7572722 |
Method of fabricating nickel silicide
A semiconductor device having nickel silicide and a method for fabricating nickel silicide. A semiconductor substrate having a plurality of doped regions is provided. Subsequently, a nickel layer...
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7572719 |
Semiconductor device and manufacturing method thereof
A method of manufacturing a semiconductor device is provided. The method includes: sequentially forming an oxide layer and a nitride layer on a substrate having a gate insulating layer and a gate...
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7572692 |
Complementary transistors having different source and drain extension spacing controlled by different spacer sizes
Disclosed is a method of forming an integrated circuit structure having first-type transistors, such as P-type field effect transistors (PFETs) and complementary second-type transistors, such as...
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7569483 |
Methods of forming metal silicide layers by annealing metal layers using inert heat transferring gases established in a convection apparatus
Methods of forming metal silicide layers include a convection-based annealing step to convert a metal layer into a metal silicide layer. These methods may include forming a silicon layer on a...
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7569467 |
Semiconductor device and manufacturing method thereof
A semiconductor device has a multi-layer wiring in which resistance against migration of the semiconductor device is raised to improve the yield. Semiconductor device 100 includes a first...
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7569466 |
Dual metal gate self-aligned integration
A semiconductor structure including at least one n-type field effect transistor (nFET) and at least one p-type field effect transistor (pFET) that both include a metal gate having nFET behavior and...
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7566644 |
Method for forming gate electrode of semiconductor device
A method for forming a gate electrode of a semiconductor device is provided wherein a hard mask layer which is a nitride film is deposited and subjected to an additional surface deposition process...
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7563700 |
Method for improving self-aligned silicide extendibility with spacer recess using an aggregated spacer recess etch (ASRE) integration
A method is provided for making a silicided gate ( 209 ). In accordance with the method, a semiconductor structure ( 201 ) is provided which comprises a semiconductor substrate ( 202 ), a gate (...
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7560349 |
Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same
A semiconductor device and/or gate structure having a composite dielectric layer and methods of manufacturing the same is provided. In the semiconductor device, gate structure, and methods...
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7557025 |
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method
A method of etching a dielectric layer by a conductive mask includes providing the dielectric layer on a substrate, forming a pattern conductive mask on the dielectric layer, the pattern conductive...
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7550373 |
Method of forming a salicide layer for a semiconductor device
Methods of fabricating semiconductor devices are disclosed. An illustrated example method protects spacers and active areas by performing impurity ion implantation on an oxide layer prior to...
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7544597 |
Method of forming a semiconductor device including an ohmic layer
In an ohmic layer and methods of forming the ohmic layer, a gate structure including the ohmic layer and a metal wiring having the ohmic layer, the ohmic layer is formed using tungsten silicide...
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7544595 |
Forming a semiconductor device having a metal electrode and structure thereof
A method for forming a semiconductor device includes forming a gate dielectric over a substrate, forming a metal electrode over the gate dielectric, forming a first sacrificial layer which includes...
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7544575 |
Dual metal silicide scheme using a dual spacer process
A semiconductor process and apparatus provide a polysilicon structure ( 10 ) and source/drain regions ( 12, 14 ) formed adjacent thereto in which a dual silicide scheme is used to form first...
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7544553 |
Integration scheme for fully silicided gate
To form a semiconductor device, a silicon (e.g., polysilicon) gate layer is formed over a gate dielectric and a sacrificial layer (preferably titanium nitride) is formed over the silicon gate...
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7541650 |
Gate electrode structures
Gate electrode structures used in field effect transistors and integrated circuits and methods of manufacture are disclosed. Improved work function and threshold modulation are provided by the...
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7541269 |
Method of forming tungsten polymetal gate having low resistance
A tungsten polymetal gate is made by forming a gate insulation layer and a polysilicon layer on a semiconductor substrate; depositing a barrier layer on the polysilicon layer; depositing a tungsten...
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7538001 |
Transistor gate forming methods and integrated circuits
A transistor gate forming method includes forming a first and a second transistor gate. Each of the two gates includes a lower metal layer and an upper metal layer. The lower metal layer of the...
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7537998 |
Method for forming salicide in semiconductor device
Forming salicide in a semiconductor device includes the steps of: forming a first and a second gate oxide film and in a non-salicide region and a salicide region, the first gate oxide film being...
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7537981 |
Silicon on insulator device and method of manufacturing the same
An isolated semiconductor device and method for producing the isolated semiconductor device in which the device includes a silicon-on-insulator (SOI) device formed on a substrate. A dielectric film...
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7537943 |
Method of manufacturing a semiconductor integrated circuit device
A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection...
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7534711 |
System and method for direct etching
System and method for direct etching. According to an embodiment, the present invention provides a method for manufacturing an integrated circuit device. The method includes a step for providing a...
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7534706 |
Recessed poly extension T-gate
A method is provided for making a silicided gate in a semiconductor device. In accordance with the method, a gate ( 213 ) is provided which comprises a first portion ( 214 ) and a second portion (...
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7528029 |
Stressor integration and method thereof
A method is provided for making a semiconductor device. In accordance with the method, a substrate ( 203 ) is provided which has first ( 205 ) and second ( 207 ) gate structures thereon. A first...
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7521346 |
Method of forming HfSiN metal for n-FET applications
A compound metal comprising HfSiN which is a n-type metal having a workfunction of about 4.0 to about 4.5, preferably about 4.3, eV which is thermally stable on a gate stack comprising a high k...
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7517780 |
Method for eliminating polycide voids through nitrogen implantation
A method of manufacturing a semiconductor device includes providing a first layer over a wafer substrate, providing a polysilicon layer over the first layer, implanting nitrogen ions into the...
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7510956 |
MOS device with multi-layer gate stack
Methods and apparatus are provided for semiconductor devices. The apparatus comprises a substrate having therein a source region and a drain region separated by a channel region extending to a...
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7507611 |
Thin film transistor and method for manufacturing the same
A method for manufacturing a thin film transistor includes forming a gate oxide film on a substrate, forming a first nitride layer on the gate oxide film, forming a polysilicon layer on the first...
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7504329 |
Method of forming a Yb-doped Ni full silicidation low work function gate electrode for n-MOSFET
Low work function metals for use as gate electrode in nMOS devices are provided. The low work function metals include alloys of lanthanide(s), metal and semiconductor. In particular, an alloy of...
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7501334 |
Semiconductor devices having a pocket line and methods of fabricating the same
In one embodiment, a semiconductor device comprises an active region isolated by a device isolation layer placed in a semiconductor substrate having a main surface. A molding hole is placed in the...
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7501333 |
Work function adjustment on fully silicided (FUSI) gate
A fully silicided gate with a selectable work function includes; a gate dielectric over the substrate; and a first metal silicide layer over the gate dielectric, and a second metal silicide layer...
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7498264 |
Method to obtain fully silicided poly gate
The present invention provides a method of fabricating a microelectronics device. In one aspect, the method comprises forming a spacer material 160 over gate electrodes 150 that are, in turn,...
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7494877 |
Methods of forming semiconductor devices including Fin structures
A method of forming a semiconductor device may include forming a fin structure extending from a substrate. The fin structure may include first and second source/drain regions and a channel region...
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7494864 |
Method for production of semiconductor device
A method for production of a semiconductor device including the steps of: forming a gate insulating film, a polysilicon film and a first insulating film on a silicon substrate; patterning the first...
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7494859 |
Semiconductor device having metal gate patterns and related method of manufacture
A semiconductor device comprising a semiconductor substrate having a first impurity region and a second impurity region, a first gate pattern formed on the first impurity region, and a second gate...
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7491635 |
Method for forming a fully silicided gate and devices obtained thereof
A method for manufacturing a MOSFET device with a fully silicided (FUSI) gate is described. This method may be used to prevent formation of shorts between the FUSI gate and a contact to a source...
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7491634 |
Methods for forming roughened surfaces and applications thereof
Methods of forming a roughened metal surface on a substrate are provided, along with structures comprising such roughened surfaces. In preferred embodiments roughened surfaces are formed by...
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7491589 |
Back gate FinFET SRAM
A compact semiconductor structure having back gate(s) for controlling threshold voltages and associated method of formation is disclosed. Fabrication of the semiconductor structure starts with a...
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7485579 |
Method of manufacturing a semiconductor device
In performing an anisotropic etching process after a taper etching process of a gate conductive layer of a two-layer or three-layer laminated structure, a portion that is not etched is left at an...
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7485558 |
Method of manufacturing semiconductor device
In a method of manufacturing a semiconductor device, a preliminary metal silicide layer is selectively formed on a substrate having a transistor, the transistor having source/drain regions. A...
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7473627 |
Semiconducting device having a structure to improve contact processing margin, and method of fabricating the same
A method for fabricating a semiconductor device includes forming a first insulating pattern, a first conductive pattern, and a second conductive pattern on a semiconductor substrate; forming a...
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