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7517806 |
Integrated circuit having pairs of parallel complementary FinFETs
A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which...
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7517746 |
Metal oxide semiconductor transistor with Y shape metal gate and fabricating method thereof
A method of manufacturing a metal oxide semiconductor transistor having a metal gate is provided. The method firstly includes a step of providing a substrate. A dummy gate is formed on the...
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7507651 |
Method for fabricating semiconductor device with bulb shaped recess gate pattern
A method for fabricating a semiconductor device with a bulb shaped recess gate pattern includes selectively etching a first portion of a substrate to form a first recess; forming a spacer on...
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7507619 |
Semiconductor device and method for manufacturing semiconductor device
Provided are a semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes: a gate electrode formed of polysilicon on a substrate with a gate...
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7498223 |
Semiconductor devices having improved field plates
A field effect transistor device and method, such device having source and drain electrodes in ohmic contact a semiconductor. A gate electrode-field plate structure is disposed between the source...
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7498246 |
Method of manufacturing a semiconductor device having a stepped gate structure
Disclosed herein are a method of manufacturing a semiconductor device, which can prevent a stepped gate from leaning and increase the channel length of the device, thus contributing to an increase...
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7491589 |
Back gate FinFET SRAM
A compact semiconductor structure having back gate(s) for controlling threshold voltages and associated method of formation is disclosed. Fabrication of the semiconductor structure starts with a...
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7488684 |
Organic aluminum precursor and method of forming a metal wire using the same
An organic aluminum precursor includes aluminum as a central metal, and borohydride and trimethylamine as ligands. In a method of forming an aluminum layer or wire, the organic aluminum presursor...
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7488656 |
Removal of charged defects from metal oxide-gate stacks
The present invention provides a method for removing charged defects from a material stack including a high k gate dielectric and a metal contact such that the final gate stack, which is useful in...
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7479459 |
Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
A semiconductor device manufacturing method and a semiconductor device manufacturing apparatus which enable to detect an etching end-point with high accuracy are provided. In etching of a lower...
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7473623 |
Providing stress uniformity in a semiconductor device
A method includes forming a plurality of functional features on a semiconductor layer in a first region. A non-functional feature corresponding to the functional feature is formed adjacent at least...
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7473626 |
Control of poly-Si depletion in CMOS via gas phase doping
A method to control the poly-Si depletion effect in CMOS structures utilizing a gas phase doping process which is capable of providing a high concentration of dopant atoms at the gate...
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7465618 |
Semiconductor device and method for fabricating the same
A semiconductor device includes: a semiconductor substrate; a gate insulating film formed on the semiconductor substrate and made of a high-dielectric-constant material composed of a plurality of...
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7456068 |
Forming ultra-shallow junctions
A method to form an ultra-shallow junction is described. In one embodiment, a replacement gate process is utilized to enable the overlap of a gate electrode over the regions of a semiconductor...
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7456058 |
Stressed MOS device and methods for its fabrication
Stressed MOS devices and methods for their fabrication are provided. The stressed MOS device comprises a T-shaped gate electrode formed of a material having a first Young's modulus. The T-shaped...
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7449402 |
Method of fabricating semiconductor device
Provided is a method of fabricating a semiconductor device, the method including: forming an insulating layer on a single crystal substrate; etching the insulating layer in a predetermined pattern...
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7446050 |
Etching and plasma treatment process to improve a gate profile
A method for improving a polysilicon gate electrode profile to avoid preferential RIE etching in a polysilicon gate electrode etching process including carrying out a multi-step etching process...
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7442632 |
Semiconductor device n-channel type MOS transistor with gate electrode layer featuring small average polycrystalline silicon grain size
In a semiconductor device including a semiconductor substrate, and an n-channel type MOS transistor produced in the semiconductor substrate, the n-channel type MOS transistor includes a gate...
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7435671 |
Trilayer resist scheme for gate etching applications
A trilayer resist (TLR) patterning scheme is provided to enable gate conductors, particularly polySi gate conductors, with critical dimensions (CDs) of less than 40 nm and minimal LER and LWR. In...
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7432206 |
Self-aligned manufacturing method, and manufacturing method for thin film fuse phase change ram
A method for manufacturing a self aligned narrow structure over a wider structure based on mask trimming. A method for manufacturing a memory device comprises forming an electrode layer on a...
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7432144 |
Method for forming a transistor for reducing a channel length
A method of forming a transistor including: forming a gate oxide layer pattern and gate polysilicon layer pattern on a silicon substrate; forming a low energy ion implantation region aligned with...
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7429524 |
Transistor design self-aligned to contact
The present invention provides a method of manufacturing a transistor device, a transistor device, and a method for manufacturing an integrated circuit. In one aspect, the method of manufacturing a...
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7422969 |
Multi-step process for patterning a metal gate electrode
The present invention provides a method for patterning a metal gate electrode and a method for manufacturing an integrated circuit including the same. The method for patterning the metal gate...
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7416931 |
Methods for fabricating a stress enhanced MOS circuit
Methods are provided for fabricating a stress enhanced MOS circuit. One method comprises the steps of depositing a stressed material overlying a semiconductor substrate and patterning the stressed...
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7416949 |
Fabrication of transistors with a fully silicided gate electrode and channel strain
Manufacturing a semiconductor device by forming first and second gates including patterning a silicon-containing layer on a substrate. Etched simultaneously the patterned silicon-containing layer...
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7416967 |
Semiconductor device, and method for manufacturing the same
According to an aspect of the invention, a semiconductor device comprises: a N-channel MIS transistor comprising; a p-type semiconductor layer; a first gate insulation layer formed on the p-type...
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7413955 |
Transistor for memory device and method for manufacturing the same
Disclosed is a transistor for a memory device realizing both a step-gated asymmetry transistor and a fin transistor in a cell and a method for manufacturing the same. The transistor has an active...
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7410855 |
Semiconductor device
A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode...
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7405161 |
Method for fabricating a semiconductor device
Method for fabricating a semiconductor device in which a by-product of etching is deposited on a photoresist film for using as a mask. The method for fabricating a semiconductor device includes the...
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7399664 |
Formation of spacers for FinFETs (Field Effect Transistors)
A structure and a method for forming the same. The structure includes (a) a substrate, (b) a semiconductor fin region on top of the substrate, (c) a gate dielectric region on side walls of the...
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7397095 |
Semiconductor device having a dual gate electrode and methods of forming the same
A semiconductor device having a dual gate electrode and a method of forming the same are provided. The semiconductor device includes a substrate including first and second regions. A first gate...
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7396748 |
Semiconductor device includes gate insulating film having a high dielectric constant
A semiconductor device comprising a semiconductor substrate and a MOSFET provided on the semiconductor substrate, the MOSFET including a gate insulating film and a gate electrode provided on the...
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7393768 |
Etching of structures with high topography
The present invention relates to a method for the patterning of a stack of layers on a surface with high topography. A method of the present invention can be used for gate patterning for multiple...
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7391089 |
Semiconductor device and method of manufacturing the same
A semiconductor device which includes a field effect transistor having a gate electrode on the upper side of a semiconductor substrate, with a gate insulation film therebetween, wherein at least...
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7384823 |
Method for manufacturing a semiconductor device having a stabilized contact resistance
Disclosed is a method for forming a storage node contact of a semiconductor device. In such a method, there is provided a substrate formed with gates and source/drain regions. A landing plug poly...
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7378323 |
Silicide process utilizing pre-amorphization implant and second spacer
A gate electrode is formed on a substrate with a gate insulating layer therebetween. A liner is then deposited on sidewalls of the gate electrode. Source/drain extensions are implanted into the...
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7375015 |
Manufacturing method which prevents abnormal gate oxidation
A method for manufacturing a gate electrode structure for preventing abnormal oxidation of a refractory metal due to an oxidation process, includes forming an insulating film on a surface of a...
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7371669 |
Method of forming a gate of a semiconductor device
In a method for forming a gate in a semiconductor device, a first preliminary gate structure is formed on a substrate. The first preliminary gate structure includes a gate oxide layer, a...
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7368336 |
Organic insulator, organic thin film transistor array panel including organic insulator, and manufacturing method therefor
An insulating film according to an embodiment of the present invention has Chemical Formula 1
wherein the Rs are equal to or different from each other, m is an integer, the Rs have...
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7344948 |
Methods of forming transistors
The invention encompasses a method of incorporating nitrogen into a silicon-oxide-containing layer. The silicon-oxide-containing layer is exposed to a nitrogen-containing plasma to introduce...
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7344966 |
Manufacturing method for a power device having an auto-aligned double thickness gate layer and corresponding device
A manufacturing method for a power device integrated on a semiconductor substrate with double thickness of a gate dielectric layer is described, which comprises the following steps: forming first...
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7344965 |
Method of etching dual pre-doped polysilicon gate stacks using carbon-containing gaseous additions
A method for making dual pre-doped gate stacks used in semiconductor applications such as complementary metal oxide semiconductor (CMOS) devices and metal oxide semiconductor field effect...
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7341956 |
Disposable hard mask for forming bit lines
A method includes forming a group of disposable hard mask structures on a semiconductor device that includes a group of memory cells. The method further includes using the disposable hard mask...
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7335544 |
Method of making MOSFET device with localized stressor
A metal-oxide-semiconductor field-effect transistors (MOSFET) having localized stressors is provided. In accordance with embodiments of the present invention, a transistor comprises a high-stress...
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7326634 |
Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
A method of a bulk tri-gate transistor having stained enhanced mobility and its method of fabrication. The present invention is a nonplanar transistor having a strained enhanced mobility and its...
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7320931 |
Interfacial layer for use with high k dielectric materials
Methods and apparatus are provided for depositing a layer of pure germanium can on a silicon substrate. This germanium layer is very thin, on the order of about 14 Å, and is less than the...
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7319255 |
Semiconductor device including a metal gate electrode formed in a trench and method of forming thereof
A semiconductor device including a transistor and a method of forming thereof are provided. The semiconductor device comprises a metal gate electrode. A lower portion of the metal gate electrode...
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7312140 |
Film forming method
A technique is provided that is capable of employing raw materials having no halogen, which has a high possibility of exerting a bad influence upon semiconductor elements, thereby to easily form...
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7307009 |
Phosphoric acid free process for polysilicon gate definition
A method of defining a patterned, conductive gate structure for a MOSFET device on a semiconductor substrate includes forming a conductive layer over the semiconductor substrate and forming a...
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7303996 |
High-K gate dielectric stack plasma treatment to adjust threshold voltage characteristics
A method for treating a gate structure comprising a high-K gate dielectric stack to improve electric performance characteristics including providing a gate dielectric layer stack including a binary...
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