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7615474 Method for manufacturing semiconductor device with reduced damage to metal wiring layer  
A method for manufacturing a semiconductor device includes (a) forming a conductive film on a first surface having an electrode of a semiconductor substrate having an integrated circuit formed...
7608531 Semiconductor device, electronic device, and method of manufacturing semiconductor device  
To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a...
7605066 Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components  
A method realizes an electric connection between a nanometric circuit and standard electronic components. The method includes: providing, above a semiconductor substrate, a seed having a notched...
7595143 Photoresist composition and method of manufacturing a thin-film transistor substrate using the same  
A photoresist composition includes about 10 to about 70% by weight of a binder resin including a phenol-based polymer, about 0.5 to about 10% by weight of a photo-acid generator, about 1 to about...
7579208 Image sensor having self-aligned and overlapped photodiode and method of making same  
An image sensing device includes a gate dielectric layer formed on a substrate and a transfer gate formed on the gate dielectric layer. A masking layer is formed on the transfer gate, the masking...
7576012 Atomic layer deposition methods  
A first precursor gas is flowed to the substrate within the chamber effective to form a first monolayer on the substrate. A second precursor gas different in composition from the first precursor...
7572717 Method of manufacturing semiconductor device  
According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method including forming on a semiconductor substrate an insulating film...
7569469 Dielectric nanostructure and method for its manufacture  
The present invention relates to dielectric nanostructures useful in semiconductor devices and other electronic devices and methods for manufacturing the dielectric nanostructures. The...
7566643 Liquid phase deposition of contacts in programmable resistance and switching devices  
A programmable resistance, chalcogenide, switching or phase-change material device includes a substrate with a plurality of stacked layers including a conducting bottom composite electrode layer,...
7563717 Method for fabricating a semiconductor device  
The method includes chemical-mechanical polishing to planarize an insulating interlayer deposited on a lower pattern. The insulating interlayer is polished using a surfactant. The...
7563696 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method  
A semiconductor device manufacturing apparatus which uses a thermal CVD reaction to deposit a film onto a substrate has a ring with an electrode terminal that makes contact with either the...
7560366 Nanowire horizontal growth and substrate removal  
The present invention provides processes for producing horizontal nanowires that are separate and oriented and allow for processing directly on a substrate material. The nanowires grow horizontally...
7560297 Active matrix substrate, manufacturing method thereof, electro-optical device, and electronic apparatus  
A method for manufacturing an active matrix substrate, comprises forming a first conductive layer across a first wiring line forming area and a second wiring line forming area on a substrate...
7553754 Electronic device, method of manufacture of the same, and sputtering target  
In an electronic device comprising a first electrodes consisting of a metal oxide and a second electrode consisting of an aluminum alloy film directly contacted and electrically connected to the...
7553702 Integrating a heat spreader with an interface material having reduced void size  
An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow...
7553341 High power density supercapacitors with carbon nanotube electrodes  
One embodiment of the present invention provides a process for fabricating an electrode for a capacitor using carbon nanotubes (CNTs), wherein the electrode comprises a metal substrate and a layer...
7547623 Methods of forming lead free solder bumps  
Methods of forming an electronic device may include forming an under bump seed metallurgy layer on an electronic substrate. A nickel layer may be formed on the under bump seed metallurgy layer so...
7547621 LPCVD gate hard mask  
A gate hard mask is deposited on a gate structure using low pressure chemical vapor deposition (LPCVD). By doing so, the wet etch removal ratio (WERR) of the gate hard mask relative to the...
7547620 Film pattern producing method, and producing method for electronic device, electron-emitting device and electron source substrate utilizing the same  
A method for producing a film pattern comprises a step of forming a resin film on a substrate surface; a step of incorporating into the resin film a constituent of a conductive film or a...
7547567 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus  
A method of forming a film pattern by disposing functional liquid on a substrate includes: forming banks on the substrate; disposing the functional liquid in regions partitioned by the banks; and...
7544625 Silicon oxide thin-films with embedded nanocrystalline silicon  
A method is provided for forming a silicon oxide (SiOx) thin-film with embedded nanocrystalline silicon (Si). The method deposits SiOx, where x is in the range of 1 to 2, overlying a substrate,...
7544612 Method and structure for reducing the effect of vertical steps in patterned layers in semiconductor structures  
According to an exemplary embodiment, a method for fabricating a multilayer semiconductor structure includes forming first and second patterned segments, where a first patterned segment sidewall is...
7538016 Signal and/or ground planes with double buried insulator layers and fabrication process  
The present invention describes a method including the steps of providing a single crystal semiconductor substrate, forming a layer of rare earth silicide on a surface of the semiconductor...
7524764 Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus  
A method of forming a film pattern by disposing a functional liquid on a substrate, includes: forming banks on the substrate; disposing the functional liquid in areas partitioned by the banks; and...
7524746 High-refractive index materials comprising semiconductor nanocrystal compositions, methods of making same, and applications therefor  
A high-refractive index material that includes semiconductor nanocrystal compositions. The high-refractive index material has at least one semiconductor nanocrystal composition incorporated in a...
7521350 Manufacturing method of a semiconductor device  
A manufacturing method of a semiconductor device comprises: providing a first insulating film whose relative dielectric constant is at most a predetermined value above a substrate; providing a...
7521292 Stretchable form of single crystal silicon for high performance electronics on rubber substrates  
The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise...
7517778 Structure of high performance combo chip and processing method  
A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the...
7514367 Method for manufacturing a narrow structure on an integrated circuit  
A method of manufacturing for providing a narrow line, such as a phase change bridge, on a substrate having a top surface, includes first forming a layer of first material on the substrate. Then, a...
7514038 Sensor substrate and method of fabricating same  
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for...
7510893 Method of manufacturing a display device using droplet emitting means  
In a wiring manufacturing process which uses conventional photolithography, most of resist and wiring material, or process gas which is necessary at the time of plasma processing, etc. is wasted....
7494907 Nanoscale electronic devices and fabrication methods  
The invention relates to a method of forming a conducting nanowire between two contacts on a substrate surface wherein a plurality of nanoparticles is deposited on the substrate in the region...
7491634 Methods for forming roughened surfaces and applications thereof  
Methods of forming a roughened metal surface on a substrate are provided, along with structures comprising such roughened surfaces. In preferred embodiments roughened surfaces are formed by...
7488656 Removal of charged defects from metal oxide-gate stacks  
The present invention provides a method for removing charged defects from a material stack including a high k gate dielectric and a metal contact such that the final gate stack, which is useful in...
7485556 Forming metal silicide on silicon-containing features of a substrate  
A metal silicide layer is formed on silicon-containing features of a substrate in a chamber. A metal film is sputter deposited on the substrate and a portion of the sputter deposited metal film is...
7482727 Composite material with conductive nanowires  
A composite material exhibiting at least one of a negative effective permittivity and a negative effective permeability for incident radiation at an operating wavelength is described. The composite...
7476603 Printing conductive patterns using LEP  
A method of printing an electrode component is disclosed. The method can include steps of electrostatically printing a polymer onto a substrate, where at least a portion of the printing occurs...
7462927 Pattern film forming method and pattern film forming apparatus  
A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a...
7456087 Semiconductor device and method of fabricating the same  
A semiconductor device is provided. The semiconductor device comprises a substrate, a gate structure, a spacer, a first poly-SiGe layer being boron-doped and a second poly-SiGe layer being...
7456046 Method to create flexible connections for integrated circuits  
A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor...
7452794 Manufacturing method of a thin film semiconductor device  
A substrate processing apparatus includes a plurality of evacuable treatment chambers connected to one another via an evacuable common chamber, and the common chamber is provided with means for...
7435680 Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure  
A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal...
7429402 Ruthenium as an underlayer for tungsten film deposition  
In one embodiment, a method for depositing a tungsten-containing film on a substrate is provided which includes depositing a barrier layer on the substrate, such as a titanium or tantalum...
7425499 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects  
Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the...
7414313 Polymeric conductor donor and transfer method  
The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component...
7407828 CMOS image sensor and manufacturing method thereof  
A gate insulation layer with a high dielectric constant for a CMOS image sensor formed by a damascene process. A silicide layer on a gate electrode layer is formed in both a pixel region and a...
7402507 Semiconductor package fabrication  
A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a...
7402506 Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby  
A thin film transistor comprises a zinc-oxide-containing semiconductor material. Such transistors can further comprise spaced apart first and second contact means or electrodes in contact with said...
7399669 Semiconductor devices and methods for fabricating the same including forming an amorphous region in an interface between a device isolation layer and a source/drain diffusion layer  
Semiconductor devices and methods for fabricating the same are disclosed in which an amorphous layer is formed in an interface between a device isolation layer and a source or drain region to...
7399649 Semiconductor light-emitting device and fabrication method thereof  
An underlying layer ALY of GaN is formed on a sapphire substrate SSB; a transfer layer TLY of GaN with a bump and dip shaped surface is formed on the underlying layer ALY; a light absorption layer...
Matches 1 - 50 out of 376 1 2 3 4 5 6 7 8 >