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8183079 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device is disclosed. The method comprises: applying a sensing layer with variation in a secondary attribute according to heat, on a handle wafer;...
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8178380 |
Method for selectively establishing an electrical connection in a multi-terminal phase change device
Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified...
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8169045 |
System and method for constructing shielded seebeck temperature difference sensor
An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the sensor may be substantially surrounded...
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8143689 |
Sensor device
A sensor device for sensing air flow speed at the exterior of an aircraft, comprising a substrate having an upper side on which is mounted a diaphragm over an aperture or recess in the substrate,...
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8129214 |
Phase change memory devices having dual lower electrodes and methods of fabricating the same
A semiconductor device includes a semiconductor substrate and a lower interlayer insulating layer disposed on the substrate. An opening passing through the lower interlayer insulating layer and...
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8114695 |
Solid-state image pickup element, solid-state image pickup device and production method therefor
A method of producing a solid-state image pickup element includes forming a hole portion, forming a first-conductive type high-concentration impurity region in a bottom wall of the hole portion,...
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8105859 |
In via formed phase change memory cell with recessed pillar heater
A method for fabricating a phase change memory device including a plurality of in via phase change memory cells includes forming pillar heaters formed of a conductive material along a contact...
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8104951 |
Temperature uniformity measurements during rapid thermal processing
Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is...
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8101449 |
Process for altering thermoelectric properties of a material
A process for altering the thermoelectric properties of an electrically conductive material is provided. The process includes providing an electrically conducting material and a substrate. The...
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8103136 |
Thermo-optic devices providing thermal recirculation
Thermo-optical devices providing heater recirculation in an integrated optical device are described. The thermo-optical devices include at least one waveguide having a non-linear path length in...
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8084285 |
Forming a micro electro mechanical system
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second...
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8084284 |
Complementary metal oxide semiconductor image sensor and method for fabricating the same
A complementary metal oxide semiconductor (CMOS) device and a method for fabricating the same are provided. The CMOS image sensor includes: a first conductive type substrate including a trench; a...
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8067260 |
Fabricating sub-lithographic contacts
A small critical dimension element, such as a heater for an ovonic unified memory, may be formed within a pore by using successive sidewall spacers. The use of at least two successive spacers...
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8067259 |
Method of producing high performance photovoltaic and thermoelectric nanostructured bulk and thin films
Embodiments of the invention provide methods of forming photovoltaic or thermoelectric materials, including photovoltaic or thermoelectric films. In one embodiment, the invention provides a method...
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8053284 |
Method and package for circuit chip packaging
A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion...
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8048791 |
Method of forming a semiconductor device
Methods for forming a semiconductor device comprising a semiconductor substrate are provided. In accordance with an exemplary embodiment, a method comprises forming a channel layer overlying the...
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8044294 |
Thermoelectric materials and devices
New thermoelectric materials comprise highly [111]-oriented twinned group IV alloys on the basal plane of trigonal substrates, which exhibit a high thermoelectric figure of merit and good material...
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8030113 |
Thermoelectric 3D cooling
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D...
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8026567 |
Thermoelectric cooler for semiconductor devices with TSV
A thermoelectric structure for cooling an integrated circuit (IC) chip comprises a first type superlattice layer formed on top of the IC chip connected to a first voltage, and a second type...
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8018018 |
Temperature sensing device
The present invention relates to an integrated device, comprising a semiconductor device formed on a semiconductor substrate, a temperature sensing element formed within a semi-conductive layer...
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8018017 |
Thermo-mechanical cleavable structure
A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure...
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8003972 |
Bottom electrode geometry for phase change memory
A PCRAM cell has a gradated or layered resistivity bottom electrode with higher resistivity closer to a phase change material, to provide partial heating near the interface between the cell and the...
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7989237 |
Package structure for solid-state lighting devices and method of fabricating the same
Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity...
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7977138 |
Optical device and method of manufacturing the same
An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the...
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7973374 |
Semiconductor device and method for fabricating the same
Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a metal film spaced from a semiconductor substrate...
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7950161 |
Level posture sensing chip and its manufacturing method, level posture sensor
The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes:...
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7952015 |
Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
The invention relates to a thermoelectrically active p- or n-conductive semiconductor material constituted by a compound of the general formula (I) (PbTe)1−x(Sn2±ySb2±zTe5)x (I) with 0.0...
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7919767 |
Semiconductor memory device and fabrication method thereof
A semiconductor memory device comprises a heater electrode, a phase change portion, a heat insulation portion and an upper electrode. The phase change portion comprises a concave portion and a...
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7915516 |
Thermoelectric power generator with built-in temperature adjustment
In one embodiment, an operating condition of a thermoelectric module is monitored. It is determined when the monitored operating condition exceeds a desired range. Upon determining the monitored...
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7910909 |
Non-volatile memory device and method of fabricating the same
Provided are a non-volatile memory device that may be configured in a stacked structure and may be more easily highly integrated, and a method of fabricating the non-volatile memory device. At...
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7897429 |
Organic hybrid planar-nanocrystalline bulk heterojunctions
A photosensitive optoelectronic device having an improved hybrid planar bulk heterojunction includes a plurality of photoconductive materials disposed between the anode and the cathode. The...
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7888155 |
Phase-change memory element and method for fabricating the same
A phase-change memory element is provided. The phase-change memory element includes: a first electrode formed on a substrate; a first dielectric layer, with an opening, formed on the first...
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7883919 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns,...
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7875790 |
Method of preparing a thermoelectric material, method of forming a thermoelectric device, and method of fabricating a thermoelectric module
A method of preparing a thermoelectric material includes the following steps. A thermoelectric raw material can be filled into a cavity of a first mold so that the thermoelectric raw material...
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7875484 |
Monolithic IC and MEMS microfabrication process
Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and...
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7871848 |
Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same
Provided are a semiconductor power module package and a method of fabricating the same. The semiconductor power module package includes a substrate, semiconductor chips arranged on a top surface of...
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7867804 |
Semiconductor device and method for fabricating the same
A semiconductor device that includes a phase change material for protecting the device from failure caused by overheating. The semiconductor device is adapted to detect a rapid increase in current...
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7851876 |
Micro electro mechanical system
Embodiments of a micro electro mechanical system are disclosed.
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7838759 |
Methods of forming thermoelectric devices including electrically insulating matrices between conductive traces
A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of...
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7833816 |
Forming a thin film thermoelectric cooler and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type...
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7820467 |
Imaging device and method that cancels voltage signal noise based on pre-saturated charges and supersaturated charges
A solid-state imaging device, a line sensor and an optical sensor for enhancing a wide dynamic range while keeping high sensitivity with a high S/N ratio, and a method of operating a solid-state...
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7808022 |
Cross talk reduction
A method and apparatus for reducing cross-talk between pixels in a semiconductor based image sensor. The apparatus includes neighboring pixels separated by a homojunction barrier to reduce...
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RE41801 |
Thin-film thermoelectric device and fabrication method of same
A termoelectric thermoelectric device and method for manufacturing the thermoelectric device. The thermoelectric thermoelectric device includes at least one deposited film of a thermoelectric...
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7803647 |
Optical transmission improvement on multi-dielectric structure in advance CMOS imager
The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a sensor element disposed in a semiconductor substrate; an inter-level dielectric (ILD)...
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7800879 |
On-chip sensor array for temperature management in integrated circuits
Embodiments of the invention provide methods and apparatus for managing temperature in integrated circuits. In accordance with an aspect of the invention, an integrated circuit comprises a...
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7800195 |
Semiconductor apparatus having temperature sensing diode
A semiconductor apparatus is provided. The semiconductor apparatus includes a semiconductor substrate and a temperature sensing diode that is disposed on a surface part of the semiconductor...
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7786469 |
Thermal sensor with a silicon/germanium superlattice structure
A silicon/germanium (SiGe) superlattice thermal sensor is provided with a corresponding fabrication method. The method forms an active CMOS device in a first Si substrate, and a SiGe superlattice...
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7759152 |
MEMS thermal actuator and method of manufacture
A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered...
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7754516 |
Fabricating sub-lithographic contacts
A small critical dimension element, such as a heater for an ovonic unified memory, may be formed within a pore by using successive sidewall spacers. The use of at least two successive spacers...
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7754517 |
Method for manufacturing infrared detecting device
A semiconductor layer is prepared in which a silicon substrate, a BOX layer and an SOI layer are laminated in this order. A silicon diode section used as an infrared detection portion is formed in...
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