Matches 1 - 50 out of 195 1 2 3 4 >
Match Document Document Title
7595540 Semiconductor device and method of manufacturing the same  
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
7591913 Thermoelectric properties by high temperature annealing  
The present invention generally provides methods of improving thermoelectric properties of alloys by subjecting them to one or more high temperature annealing steps, performed at temperatures at...
7585693 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method  
Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die...
7585692 Thin film layer, heating electrode, phase change memory including thin film layer and methods for forming the same  
A thin film layer, a heating electrode, a phase change memory including the thin film layer, and methods for forming the same. The method of forming the thin film layer by atomic layer deposition...
7572662 Method of fabricating phase change RAM including a fullerene layer  
A method of fabricating a phase change RAM (PRAM) having a fullerene layer is provided. The method of fabricating the PRAM may include forming a bottom electrode, forming an interlayer dielectric...
7569420 Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer  
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting...
7541219 Integrated metallic contact probe storage device  
A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end...
7531739 Build-in-place method of manufacturing thermoelectric modules  
A method of manufacturing a thermoelectric module is provided. The method includes mounting a thermoelectric material to a substrate such that a portion of the thermoelectric material covers a...
7521281 Methods of forming phase-changeable memory devices  
Phase-changeable memory devices include non-volatile memory cells. Each of these non-volatile memory cells may include a phase-changeable diode on a semiconductor substrate and a phase-changeable...
7510895 Inferential temperature control system  
A system manages the temperature of thermoplastic material by initiating a default heating cycle in response to a sensor failure. The system may thus continue to heat the thermoplastic material...
7510883 Magnetic tunnel junction temperature sensors and methods  
Techniques of sensing a temperature of a heat source disposed in a substrate of an integrated circuit are provided. According to one exemplary method, a Magnetic Tunnel Junction (“MTJ”)...
7501307 Method of fabricating semiconductor memory device  
In a semiconductor memory device and a method of fabricating the same, a semiconductor memory device having a transistor and a data storing portion includes a heating portion interposed between the...
7489021 Lead frame with included passive devices  
An semiconductor device package ( 10 ) includes a semiconductor device (die) ( 12 ) and passive devices ( 14 ) electrically connected to a common lead frame ( 17 ). The lead frame ( 17 ) is formed...
7473578 Encapsulation for particle entrapment  
A packaged micromechanical device ( 100 ) having a blocking material ( 116 ) encapsulating debris-generating regions thereof. The blocking material ( 116 ) prevents the generation of debris that...
7471184 Robust MEMS actuator for relays  
An apparatus comprising a microelectromechanical system (MEMS) device. The MEMS device includes a substrate having an anchoring pad thereon and a structural element. The structural element has a...
7462921 Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film  
A vanadium oxide film is formed on an interlayer insulating layer, and a silicon oxide film and a silicon nitride film are formed on the vanadium oxide film in this order. With a resist pattern...
7432123 Methods of manufacturing high temperature thermistors  
A method of manufacturing high temperature thermistors. A polycrystalline thermistor body is formed from a material selected from a list consisting of bulk polycrystalline Si with intrinsic...
7425750 Snap lid camera module  
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form...
7413920 Double-sided etching method using embedded alignment mark  
A double-sided etching method using an embedded alignment mark includes: preparing a substrate having first and second alignment marks embedded in an intermediate portion thereof; etching an upper...
7405457 High temperature thermistors  
A high temperature NTC thermistor includes a polycrystalline thermistor body, selected from a list consisting of polycrystalline Si with intrinsic conductivity and polycrystalline Ge with intrinsic...
7399997 Semiconductor laser device and fabrication method thereof  
A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor...
7382034 Optoelectronic component having a conductive contact structure  
The invention relates to an optoelectronic component for converting electromagnetic radiation into an intensity-dependent photoelectric current. The component includes one substrate which is formed...
7376852 Method for controlling power change for a semiconductor module  
The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor...
7354786 Sensor element with trenched cavity  
A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity....
7351602 Process for producing a thin film with MEMS probe circuits  
A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the...
7349762 Systems and methods for thermal management  
Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces...
7309830 Nanostructured bulk thermoelectric material  
A thermoelectric material comprises two or more components, at least one of which is a thermoelectric material. The first component is nanostructured, for example as an electrically conducting...
7306967 Method of forming high temperature thermistors  
A method of manufacturing high temperature thermistors from an ingot. The high temperature thermistors can be comprised of germanium or silicon. The high temperature thermistors have at least one...
7282384 Thermoelectric transducing material thin film, sensor device, and its manufacturing method  
The present invention provides an SiGe-based thin film, a method for manufacturing this thin film, and applications of this thin film. The present invention relates to a method for producing, by...
7276277 Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component  
A micromechanical component and a method of producing same are described; the component has a supporting body, in particular a silicon body, and a membrane which is connected to the supporting body...
7268008 Method for manufacturing pressure sensor  
A method for manufacturing a pressure sensor includes the steps of: preparing a semiconductor substrate; forming an insulation film on the substrate; forming a first metal film on the insulation...
7233000 Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology  
This invention provides a miniaturized silicon thermal flow sensor with improved characteristics, based on the use of two series of integrated thermocouples ( 6, 7 ) on each side of a heater ( 4 ),...
7229694 Micromechanical component and method for producing an anti-adhesive layer on a micromechanical component  
A micromechanical component includes an anti-adhesive layer, formed from at least one fluorine-containing silane, applied to at least parts of its surface for reducing surface forces. To increase...
7205231 Method for in-situ uniformity optimization in a rapid thermal processing system  
The present invention is directed to a method for thermally processing a substrate in a thermal processing system. The method provides an amount of heat to the substrate and obtains information...
7195946 Process for fabricating a semiconductor device having a suspended micro-system and resultant device  
A method is provided for fabricating a semiconductor device that includes a suspended micro-system. According to the method, a silicon porous layer is formed above a silicon substrate, and the...
7166796 Method for producing a device for direct thermoelectric energy conversion  
In devices used for the direct conversion of heat into electricity, or vice versa, known in the art as thermoelectric power generators, thermoelectric refrigerators and thermoelectric heat pumps,...
7115437 Micromachined device having electrically isolated components and a method for making the same  
A micromachined structure having electrically isolated components is formed by thermomigrating a dopant through a substrate to form a doped region within the substrate. The doped region separates...
7112862 Light emitting and/or detecting device and method of manufacturing the same  
A light emitting and detecting device and a method of manufacturing the same are provided. The method includes forming an insulating layer on a substrate doped with an n-type dopant or a p-type...
7087451 Microfabricated hot wire vacuum sensor  
A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be...
7081677 Thermoelectric module  
A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of...
7078259 Method for integrating thermistor  
A structure and method are provided for forming a thermistor. Isolation structures are formed in a substrate including at least an upper layer of a single crystal semiconductor. A layer of salicide...
7075129 Image sensor with reduced p-well conductivity  
An image sensor includes a substrate of the first conductivity type; a channel of the first conductivity type that spans at least a portion of the substrate; a well of the second conductivity type...
7071008 Multi-resistive state material that uses dopants  
A multi-resistive state material that uses dopants is provided. A multi-resistive state material can be used in a memory cell to store information. However, a multi-resistive state material may not...
7067733 Thermoelectric material having crystal grains well oriented in certain direction and process for producing the same  
Thermoelectric material is produced through a process sequence including a liquid quenching, a primary solidification such as a hot pressing or extrusion and an upset forging; although the C-planes...
RE39143 Method for making a wafer-pair having sealed chambers  
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited...
7009268 Wheatstone bridge scheme for sensor  
A Wheatstone bridge circuit for a sensor has: first and second sensor elements which respond to a stimulus generated when the sensor is exposed to a sample to be measured, the first and second...
6995028 Method of manufacturing thermal type flow sensing elements  
A method of manufacturing thermal type flow sensing elements is provided which improves workability and reliability without increasing manufacturing costs. Each flow sensing element comprises two...
6984543 Method of producing laminated PTC thermistor  
A method of producing a laminated PTC thermistor involves alternately laminating electroconductive pastes to form internal electrodes and ceramic green sheets to form semiconductor ceramic layers...
6972199 Method of making a cutting instrument having integrated sensors  
A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor...
6963119 Integrated optical transducer assembly  
An integrated optical transducer assembly includes a substrate and an optoelectronic array attached to the substrate. The optoelectronic array further includes a plurality of individual subunits...
Matches 1 - 50 out of 195 1 2 3 4 >