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8183078 |
Device with integrated circuit and encapsulated N/MEMS and method for production
A method for producing a device including at least one integrated circuit and at least one N/MEMS. The method produces the N/MEMS in at least one upper layer arranged at least above a first section...
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8173513 |
Method for manufacturing a semiconductor pressure sensor
Method for manufacturing a semiconductor pressure sensor, wherein, in a silicon substrate, trenches are dug and delimit walls; a closing layer is epitaxially grown, that closes the trenches at the...
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8173472 |
Semiconductor sensor and manufacturing method of sensor body for semiconductor sensor
A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an...
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8174082 |
Micromechanical component having multiple caverns, and manufacturing method
A micromechanical component having at least two caverns is provided, the caverns being delimited by the micromechanical component and a cap, and the caverns having different internal atmospheric...
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8173471 |
Method for fabricating micro-electro-mechanical system (MEMS) device
A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side,...
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8169042 |
Integrated microphone
A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that...
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8163586 |
Method of producing a suspended membrane device
A method for producing a device with at least one suspended membrane, including the following steps: Producing a trench through a first sacrificial layer and a second layer deposited on the first...
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8165324 |
Micromechanical component and method for its production
A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a...
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8148235 |
Methods of manufacturing semiconductor devices
Methods of forming air gaps between interconnects of integrated circuits and structures thereof are disclosed. A first insulating material is deposited over a workpiece, and a second insulating...
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8143689 |
Sensor device
A sensor device for sensing air flow speed at the exterior of an aircraft, comprising a substrate having an upper side on which is mounted a diaphragm over an aperture or recess in the substrate,...
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8142669 |
Electromechanical element, electric circuit device and production method of those
An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical...
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8138006 |
Method for producing a micromechanical component having a trench structure for backside contact
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate....
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8129803 |
Micromachined microphone and multisensor and method for producing same
A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various...
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8129802 |
Integrated micro electro-mechanical system and manufacturing method thereof
In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate,...
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8131006 |
MEMS device with surface having a low roughness exponent
A MEMS microphone has a backplate and a movable diaphragm that together form a variable capacitance. The backplate has a backplate surface and, in a corresponding manner, the diaphragm has a...
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8129805 |
Microelectromechanical system (MEMS) device and methods for fabricating the same
A method of fabricating a microelectromechanical system (MEMS) device includes providing a semiconductor substrate having a semiconductor layer and an interconnect structure. A passivation layer...
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8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
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8124436 |
MEMS switch capping and passivation method
A MEMS switch with a platinum-series contact is capped through a process that also passivates the contact by controlling, over time, the amount of oxygen in the environment, pressures and...
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8123963 |
Method for producing a semiconductor component and a semiconductor component produced according to the method
A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a...
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8117919 |
Micro-electro-mechanical system device
The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a substrate with at least one opening; and a membrane supported on the substrate, the membrane including...
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8119426 |
Method of manufacturing an ultrasonic transducer semiconductor device
A manufacturing yield of a semiconductor device (capacitive micromachined ultrasonic transducer) is increased. A plurality of first chips 1 in which a plurality of cells each having functions of...
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8114700 |
Method of fabricating an ultra-small condenser microphone
In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet....
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8109149 |
Contact stress sensor
A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element...
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8104354 |
Capacitive sensor and manufacturing method thereof
A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of...
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8097926 |
Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The...
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8093088 |
Manufacturing method of micro-electro-mechanical device
A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of...
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8088692 |
Method for fabricating a multilayer microstructure with balancing residual stress capability
A method for fabricating a multilayer microstructure with balancing residual stress capability includes forming a multilayer microstructure on a silicon substrate and conducting a step of isotropic...
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8084285 |
Forming a micro electro mechanical system
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second...
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8076739 |
Micromechanical component and method for producing a micromechanical component
A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside...
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8071413 |
Micro-electro-mechanical system (MEMS) sensor and method for making same
The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended...
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8071412 |
Method of fabricating micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8072036 |
Micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8067811 |
MEMS device, MEMS device module and acoustic transducer
A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap...
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8053267 |
Three-dimensional force input control device and fabrication
The present invention provides three-dimensional force input control devices for use in sensing vector forces and converting them into electronic signals for processing, and methods of fabricating...
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8043880 |
Microelectronic device
One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and...
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8045733 |
Silicon microphone with enhanced impact proof structure using bonding wires
A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and...
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8039944 |
Electrical connection device and assembly method thereof
An electrical connection device and assembly method thereof includes a substrate with a plurality of contacting portions arranged on a surface thereof; a chip module having a plurality of terminals...
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8039911 |
MEMS sensor
The MEMS sensor according to the present invention includes a diaphragm. In the diaphragm, an angle formed by two straight lines connecting supporting portions and the center of a main portion with...
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8033091 |
Quantum tunnelling transducer device
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state...
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8035176 |
MEMS package and packaging method thereof
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate,...
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8026120 |
Method of manufacturing MEMS device
A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to...
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8026121 |
Method for producing electronic components and pressure sensor
A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is...
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8018301 |
Micro-electro-mechanical transducer having a surface plate
A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a...
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8012785 |
Method of fabricating an integrated CMOS-MEMS device
An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate....
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8008105 |
Methods for fabricating micro-electro-mechanical devices
A method for fabricating a micro-electro-mechanical device (such as a cMUT) is disclosed. The method combines a substrate, a middle spring layer and a top plate using wafer bonding technology or...
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8008738 |
Integrated differential pressure sensor
An integrated differential pressure sensor includes, in a monolithic body of semiconductor material, a first face and a second face, a cavity extending at a distance from the first face and...
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8003422 |
Micro-electro-mechanical system device and method for making same
According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order;...
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7998776 |
Methods for manufacturing MEMS sensor and thin film thereof with improved etching process
A method for manufacturing a MEMS sensor and a thin film thereof includes steps of etching a top surface of a single-crystal silicon wafer in combination of a deposition process, an isotropic DRIE...
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7998777 |
Method for fabricating a sensor
A method for fabricating a sensor is disclosed that in one embodiment bonds a first device wafer to an etched second device wafer to create a suspended structure, the flexure of which is determined...
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7993949 |
Heterogeneous substrate including a sacrificial layer, and a method of fabricating it
The invention relates to a method of making a component from a heterogeneous substrate comprising first and second portions in at least one monocrystalline material, and a sacrificial layer...
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