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7638350 |
Fingerprint sensors using membrane switch arrays
A method of making an integrated texture sensor for sensing a texture is described. In one embodiment, the method is directed to a sensor that that is protected from external contaminating...
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7635605 |
Infrared sensor and method of producing the same
A through hole P of this infrared sensor is formed in a position opposed to an adhesive layer AD. The through hole P, the bottom part thereof and an insulating film Pi formed therein is restrained...
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7632698 |
Integrated circuit encapsulation and method therefor
A device ( 12 ) may have a pressure sensitive portion ( 17 ) which is protected from corrosion by a pressure transmitting material ( 20 ). Pressure transmitting material ( 20 ) may also be used to...
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7629657 |
Episeal pressure sensor
A method for making a pressure sensor by providing a wafer including a base silicon layer, a buried sacrificial layer, and a top silicon layer. The top silicon layer is arranged over the buried...
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7625772 |
Method for making an electromechanical component on a plane substrate
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at...
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7615834 |
Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be...
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7605015 |
Process for the singulation of integrated devices in thin semiconductor chips
A process for the fabrication of an integrated device in a semiconductor chip envisages: forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to the...
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7572660 |
Electrical through-plating of semiconductor chips
A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7572661 |
Method for manufacturing a micromechanical sensor element
Described is a method for manufacturing a micromechanical sensor element and a micromechanical sensor element manufactured in particular using such a method which has a hollow space or a cavity and...
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7569412 |
Method for manufacturing a diaphragm sensor
A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the...
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7569413 |
Method of forming thin film structure with tensile and compressed polysilicon layers
A method for forming a thin film structure, which has small tensile stress due to controlled mechanical stress, and is made to be conductive, is provided. A lower film including polysilicon thin...
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7566583 |
Method of determining adhesion quality
A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has...
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7566582 |
Systems, methods and devices relating to actuatably moveable machines
Systems, methods and devices relating to actuatably movable machines and with methods of using and manufacturing the same.
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7563634 |
Method for mounting semiconductor chips, and corresponding semiconductor chip system
A method is described for mounting semiconductor chips and a corresponding semiconductor chip system. The method may include providing a semiconductor chip having a surface that includes a...
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7563635 |
Electronic device and method of manufacturing the same
In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21 , hydrofluoric acid is injected, so as to dissolve a...
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7563692 |
Microelectromechanical system pressure sensor and method for making and using
According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be...
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7563724 |
Method of producing semiconductor pressure sensor
A method of producing a semiconductor pressure sensor, the sensor having a diaphragm to be deformed by pressure, including: a step of preparing a semiconductor substrate having front and rear...
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7560789 |
Semiconductor device
A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine...
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7550311 |
Near-field optical probe based on SOI substrate and fabrication method thereof
Provided is near-field optical probe including: a cantilever arm support portion that is formed of a lower silicon layer of a silicon-on-insulator (SOI) substrate, the cantilever arm support...
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7547568 |
Electrical conditioning of MEMS device and insulating layer thereof
A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior...
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7544531 |
Ground strap for suppressing stiction during MEMS fabrication
To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches...
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7540968 |
Micro movable device and method of making the same using wet etching
A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base...
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7537953 |
Manufacturing method of microstructure and microelectromechanical system
To reduce the number of photomasks which are used to form sacrificial layers for producing spaces of a microstructure, thereby reducing the manufacturing cost. Sacrificial layers are formed by...
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7534641 |
Method for manufacturing a micro-electro-mechanical device
A technique for manufacturing a micro-electro-mechanical (MEM) device includes a number of steps. Initially, a first wafer is provided. Next, a bonding layer is formed on a first surface of the...
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7527998 |
Method of manufacturing MEMS devices providing air gap control
Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate,...
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7514760 |
IC-compatible MEMS structure
An IC-compatible MEMS structure and a method to form such a structure are described. In an embodiment, an integrated circuit having a MEMS device is formed. The structure comprises a plurality of...
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7514285 |
Isolation scheme for reducing film stress in a MEMS device
A method of electrically isolating a MEMS device is provided. In one example, a piezo-resistive pressure sensor having an exposed silicon region undergoes a Local Oxidation of Silicon (LOCOS)...
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7514287 |
Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device
A method for reducing dimension of an MEMS device. A single crystalline substrate having a diaphragm is provided. A first-step anisotropic dry etching process is performed to form an opening...
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7510889 |
Light emitting chip package and manufacturing method thereof
A method for manufacturing a light emitting chip package includes bonding a patterned metal plate having at least a thermal enhanced plate and many contacts around the same to a substrate and...
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7504276 |
Micro device having micro system structure and method for method for manufacturing the same
A micro device having a micro system structure includes a protection film disposed on the micro system structure for protecting from a particle. The protection film includes a first protection film...
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7504275 |
Layout design and fabrication of SDA micro motor for low driving voltage and high lifetime application
Provided is a new design and fabrication of scratch drive actuator (SDA) micro rotary motor with low driving voltage and high lifetime characteristics. To substantially reduce the driving voltage...
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7493822 |
Small gauge pressure sensor using wafer bonding and electrochemical etch stopping
A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the...
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7495302 |
Micromechanical component having a diaphragm
A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a...
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7494839 |
Method for manufacturing a membrane sensor
A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is...
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7493819 |
Micromechanical pressure sensor system
A micromechanical pressure sensor includes a substrate having a front side and a back side, the front side facing a medium and the back side being situated on the opposite side of the substrate. A...
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7491569 |
Method for manufacturing a patterned bottom electrode in a piezoelectric device
A method for manufacturing a patterned bottom electrode in a piezoelectric device comprises the steps of providing a basic material and producing a layer structure of a conductive material on the...
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7489004 |
Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness
A micro-electro-mechanical variable capacitor has a first and a second electrode, and a dielectric region arranged on the first electrode. An intermediate electrode is arranged on the dielectric...
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7485485 |
Method and apparatus for making a MEMS scanner
Devices are formed on a semiconductor wafer in an interdigitated relationship and are released by deep reactive ion etching. MEMS scanners are formed without a surrounding frame. Mounting pads...
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7485571 |
Method of making an integrated circuit
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
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7482194 |
Electronic component having micro-electrical mechanical system
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second...
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7479232 |
Method for producing a semiconductor component and a semiconductor component produced according to the method
A method is for producing a semiconductor component, e.g., a multilayer semiconductor element, e.g., a micromechanical component, e.g., a pressure sensor, having a semiconductor substrate, e.g.,...
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7476561 |
Method of making microminiature moving device
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46 , a movable comb electrode 49 , etc.) displaceable in parallel to...
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7473572 |
Micromechanical sensors and methods of manufacturing same
A micromechanical sensor and, in particular, a silicon microphone, includes a movable membrane and a counter element in which perforation openings are formed, opposite to the movable membrane via a...
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7464459 |
Method of forming a MEMS actuator and relay with vertical actuation
A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms a...
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7462919 |
Microelectromechanical component and method for the production thereof
A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip,...
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7459329 |
Method of fabricating silicon-based MEMS devices
A method of fabricating a silicon-based microstructure is disclosed, which involves depositing electrically conductive amorphous silicon doped with first and second dopants to produce a structure...
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7456041 |
Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
A method of manufacturing a MEMS structure including forming a porous layer having a predetermined thickness on the top surface of a substrate over an area where a cavity is to be formed; forming...
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7456043 |
Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereof
A substrate is provided and a plurality of trenches are formed in the front surface of the substrate. Then, a thermal oxide layer is formed on inner walls of the trenches and the front surface of...
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7452741 |
Process for manufacturing an apparatus that protects features during the removal of sacrificial materials
The present invention provides a process for manufacturing an apparatus. The process, in one embodiment, includes providing a micro-electro-mechanical system (MEMS) device, the...
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