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7638349 |
Substrate preparation method for a MEMS fabrication process
Provided is a substrate preparation method for a micro-electromechanical system (MEMS) fabrication process. The method includes the step of depositing at least four metal layers interspersed with...
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7629195 |
Method of making light emitting diodes (LEDs) with improved light extraction by roughening
Methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer...
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7629194 |
Metal contact RF MEMS single pole double throw latching switch
Apparatus for a micro-electro-mechanical switch that provides single pole, double throw switching action. The switch has two input lines and two output lines. The switch has a seesaw cantilever arm...
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7625767 |
Methods of making spintronic devices with constrained spintronic dopant
A method is for making a spintronic device and may include forming at least one superlattice and at least one electrical contact coupled thereto, with the at least one superlattice including a...
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7625772 |
Method for making an electromechanical component on a plane substrate
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at...
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7625773 |
Anti-stiction technique for electromechanical systems and electromechanical device employing same
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion...
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7622780 |
Seek-scan probe (SSP) including see-saw scan probe with redundant tip
An apparatus comprising a substrate having a probe suspension formed thereon, a see-saw probe coupled to the probe suspension, the see-saw probe including first and second ends, with a tip...
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7622783 |
MEMS thermal actuator and method of manufacture
A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered...
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7615395 |
Method for containing a device and a corresponding device
A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element...
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7615834 |
Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be...
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7605014 |
Method of fabricating resistive probe having self-aligned metal shield
A method of fabricating a resistive probe having a self-aligned metal shield. The method includes sequentially forming a first insulating layer, a metal shield, and a second insulating layer on a...
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7601551 |
Method for manufacturing optical device
A method for manufacturing an optical device having an optical block, through which a light is transmitted, is provided. The method includes steps of: forming a plurality of silicon oxide members,...
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7598107 |
Semi-sacrificial mold for diamond structures
A patterned structure forms a portion of the mold for a diamond molded structure but is separable from the mold by the same processes that release the diamond part. The mold portion may itself be a...
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7597819 |
Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films
Etchant solutions comprising a redox buffer can be used during the release etch step to reduce damage to the structural layers of a MEMS device that has noble material films. A preferred redox...
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7592204 |
Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical...
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7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7572660 |
Electrical through-plating of semiconductor chips
A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7569411 |
Metal MEMS devices and methods of making same
Metal MEMS structures are fabricated from metal substrates, preferably titanium, utilizing micromachining processes with a new deep etching procedure to provide released microelectromechanical...
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7563635 |
Electronic device and method of manufacturing the same
In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21 , hydrofluoric acid is injected, so as to dissolve a...
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7560789 |
Semiconductor device
A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine...
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7556978 |
Piezoelectric MEMS switches and methods of making
MEMS piezoelectric switches 100 that provide advantages of compact structure ease of fabrication in a single unit, and that are free of high temperature-induced morphological changes of the...
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7550311 |
Near-field optical probe based on SOI substrate and fabrication method thereof
Provided is near-field optical probe including: a cantilever arm support portion that is formed of a lower silicon layer of a silicon-on-insulator (SOI) substrate, the cantilever arm support...
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7540192 |
Physical quantity sensor having optical part and method for manufacturing the same
A method for manufacturing a physical quantity sensor having a movable portion, a support portion and an optical part is provided. The method includes steps of: etching a silicon substrate so that...
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7541214 |
Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
The present invention is related to a method for manufacturing micro-electro-mechanical systems (MEMS) having movable and stationary suspended structures formed from mono-crystalline silicon wafer...
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7540968 |
Micro movable device and method of making the same using wet etching
A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base...
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7541219 |
Integrated metallic contact probe storage device
A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end...
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7537952 |
Method of manufacturing MEMS device package
A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being...
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7534640 |
Support structure for MEMS device and methods therefor
A microelectromechanical systems device having support structures formed of sacrificial material that is selectively diffused with a dopant material or formed of a selectively oxidized metal...
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7527998 |
Method of manufacturing MEMS devices providing air gap control
Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate,...
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7527997 |
MEMS structure with anodically bonded silicon-on-insulator substrate
A silicon-on-insulator (SOI) substrate is anodically bonded to a glass substrate in a MEMS structure with or without electrically bypassing the insulator layer by electrically comprising the...
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7514286 |
Method for forming individual semi-conductor devices
A method that forms individual semiconductor devices from a semiconductor substrate including a first face having a first region in which micro-mechanical elements are formed and a second region...
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7514283 |
Method of fabricating electromechanical device having a controlled atmosphere
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that...
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7510894 |
Post-logic isolation of silicon regions for an integrated sensor
In producing an integrated sensor, regions of silicon between compensating electronics and a sensor are electrically isolated, while the sensor is delineating and released. The described process...
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7504275 |
Layout design and fabrication of SDA micro motor for low driving voltage and high lifetime application
Provided is a new design and fabrication of scratch drive actuator (SDA) micro rotary motor with low driving voltage and high lifetime characteristics. To substantially reduce the driving voltage...
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7501302 |
Electromagnetic micro-generator and method for manufacturing the same
A micro-generator includes an integrated circuit (IC) wafer. A micro-electro mechanical system (MEMS) wafer, with a movable micromechanical element, is bonded to the IC wafer. A plurality of first...
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7489004 |
Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness
A micro-electro-mechanical variable capacitor has a first and a second electrode, and a dielectric region arranged on the first electrode. An intermediate electrode is arranged on the dielectric...
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7488614 |
Providing a charge dissipation structure for an electrostatically driven device
In one embodiment, an electrode is disposed on a surface of a first portion of the dielectric, with the first portion and the electrode forming an electrode region of the device. A...
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7485485 |
Method and apparatus for making a MEMS scanner
Devices are formed on a semiconductor wafer in an interdigitated relationship and are released by deep reactive ion etching. MEMS scanners are formed without a surrounding frame. Mounting pads...
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7482194 |
Electronic component having micro-electrical mechanical system
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second...
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7476948 |
Microminiature moving device and method of making the same
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46, a movable comb electrode 49, etc.) displaceable in parallel to...
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7476561 |
Method of making microminiature moving device
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46 , a movable comb electrode 49 , etc.) displaceable in parallel to...
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7473587 |
High-quality SGOI by oxidation near the alloy melting temperature
A method of forming a low-defect, substantially relaxed SiGe-on-insulator substrate material is provided. The method includes first forming a Ge-containing layer on a surface of a first single...
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7470557 |
Self-aligned coating on released MEMS
A method of making a semiconductor device including the steps of fabricating at least one component on a substrate and coating the component with a first self-aligned polymer film.
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7465599 |
Method for manufacturing physical quantity sensor
A physical quantity sensor includes: a semiconductor substrate; a cavity disposed in the substrate and extending in a horizontal direction of the substrate; a groove disposed on the substrate and...
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7465601 |
Method of forming suspended structure
A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front...
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7464459 |
Method of forming a MEMS actuator and relay with vertical actuation
A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms a...
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7462918 |
Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate
A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically...
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7459325 |
MEMS passivation with transition metals
Organic surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirrors. The binding of these surfactants to the surface is improved by first associating with the...
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7459329 |
Method of fabricating silicon-based MEMS devices
A method of fabricating a silicon-based microstructure is disclosed, which involves depositing electrically conductive amorphous silicon doped with first and second dopants to produce a structure...
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