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8183078 |
Device with integrated circuit and encapsulated N/MEMS and method for production
A method for producing a device including at least one integrated circuit and at least one N/MEMS. The method produces the N/MEMS in at least one upper layer arranged at least above a first section...
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8173471 |
Method for fabricating micro-electro-mechanical system (MEMS) device
A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side,...
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8168457 |
Shaped articles comprising semiconductor nanocrystals and methods of making and using same
A shaped article comprising a plurality of semiconductor nanocrystals. Devices incorporating shaped articles are also provided. Methods of manufacturing shaped articles by various molding processes...
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8168461 |
Micro-electro-mechanical device and method of manufacturing the same
The present invention improves mechanical strength of a micro-electro-mechanical device (MEMS) having a movable portion to improve reliability. In a micro-electro-mechanical device (MEMS) having a...
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8164180 |
Functional element package and fabrication method therefor
A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to...
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8163585 |
Method for manufacturing a sensor element, and sensor element
A method for manufacturing a capped sensor element by providing a substrate with a sensor structure, the sensor structure being produced in the substrate using a sacrificial material, applying a...
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8163584 |
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure
The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure.
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8158448 |
Resonator and methods of making resonators
A resonator and method of making a resonator are provided. A particular method includes etching a silicon substrate to form a resonator structure. The resonator structure includes at least one...
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8148793 |
Three dimensional integrated passive device and method of fabrication
An integrated passive device (20) includes a first wafer (22), a first integrated device (28) formed on a first surface (24) of the wafer (22), and a second integrated device (30) formed on a...
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8143576 |
Radiant energy imager using null switching
In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of...
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8142669 |
Electromechanical element, electric circuit device and production method of those
An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical...
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8143082 |
Wafer bonding of micro-electro mechanical systems to active circuitry
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
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8138007 |
MEMS device with stress isolation and method of fabrication
A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26)...
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8138006 |
Method for producing a micromechanical component having a trench structure for backside contact
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate....
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8138495 |
Film stress management for MEMS through selective relaxation
An apparatus comprising a microelectromechanical system. The microelectromechanical system includes a crystalline structural element having dislocations therein. For at least about 60 percent of...
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8138008 |
Forming an oxide MEMS beam
Solutions for forming a semiconductor including an oxide MEMS beam are disclosed. In one embodiment, a method of forming a beam within a sealed cavity includes: depositing a lower insulator layer...
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8129803 |
Micromachined microphone and multisensor and method for producing same
A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various...
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8129805 |
Microelectromechanical system (MEMS) device and methods for fabricating the same
A method of fabricating a microelectromechanical system (MEMS) device includes providing a semiconductor substrate having a semiconductor layer and an interconnect structure. A passivation layer...
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8124435 |
Method for manufacturing a microelectromechanical component, and a microelectromechanical component
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical...
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8119432 |
Method and apparatus for MEMS oscillator
A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator...
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8114699 |
Integration manufacturing process for MEMS device
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a...
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8115240 |
CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining
A process for fabricating a monocrystalline silicon micromechanical element integrated with a CMOS circuit element within the CMOS technology, wherein a domain of second conducting property is...
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8114698 |
High light extraction efficiency nitride based light emitting diode by surface roughening
A III-nitride light emitting diode (LED) and method of fabricating the same, wherein at least one surface of a semipolar or nonpolar plane of a III-nitride layer of the LED is textured, thereby...
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8101976 |
Device selection circuitry constructed with nanotube ribbon technology
A memory system having electromechanical memory cells and decoders is disclosed. A decoder circuit selects at least one of the memory cells of an array of such cells. Each cell in the array is a...
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8097483 |
Manufacturing a MEMS element having cantilever and cavity on a substrate
Method for manufacturing a capacitor on a substrate, the capacitor including a first electrode (5) and a second electrode (12; 25), the first and second electrodes being separated by a cavity (16;...
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8096048 |
Method for fabricating MEMS structure
A method for fabricating a MEMS is described as follows. A substrate is provided, including a circuit region and a MEMS region separated from each other. A first metal interconnection structure is...
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8093087 |
Method for fabricating MEMS device
Method for fabricating MEMS device has a first surface and a second surface and having a MEMS region and an IC region. A MEMS structure is formed over the first surface. A structural dielectric...
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8093080 |
Optical device having light sensor employing horizontal electrical field
The device includes an optical waveguide on a base. The waveguide is configured to guide a light signal through a light-transmitting medium. A light sensor is also positioned on the base. The light...
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8084285 |
Forming a micro electro mechanical system
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second...
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8076738 |
Integrally fabricated micromachine and logic elements
Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing...
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8076169 |
Method of fabricating an electromechanical device including at least one active element
The invention relates to a method of fabricating an electromechanical device including an active element, wherein the method comprises the following steps: a) making a monocrystalline first stop...
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8071413 |
Micro-electro-mechanical system (MEMS) sensor and method for making same
The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended...
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8067812 |
Acceleration sensor and method of producing the same
An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around...
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8065919 |
MEMS device and method for fabricating the same
A MEMS device includes: a substrate having a through hole; a first film provided on a top surface of the substrate with a bottom surface of the first film exposed in the through hole; a second film...
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8063458 |
Micromechanical component, method for fabrication and use
A micromechanical component that can be produced in an integrated thin-film method is disclosed, which component can be produced and patterned on the surface of a substrate as multilayer...
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8057857 |
Phase separation in patterned structures
Novel phase-separation behavior by a mixture, including binary mixture, of patterning compounds, including alkanethiols, when deposited onto a surface, including a gold surface, using micro and...
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8053265 |
Mitigation of high stress areas in vertically offset structures
Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion...
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8053266 |
Piezo-diode cantilever MEMS fabrication method
A piezo thin-film diode (piezo-diode) cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method deposits thin-films overlying a substrate. The...
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8048686 |
Production of a device comprising magnetic structures formed on one and the same substrate and having respective different magnetization orientations
The invention relates to a method for producing a device comprising magnetic blocks magnetized in different directions, comprising steps of: a) forming, in a stack of one or more layers of at least...
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8043882 |
Method of making microminiature moving device
A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the...
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8039912 |
Systems and methods for reduced stress anchors
Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor...
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8034641 |
Method for inspection of defects on a substrate
A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by...
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8033091 |
Quantum tunnelling transducer device
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state...
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8035176 |
MEMS package and packaging method thereof
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate,...
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8030111 |
Integration manufacturing process for MEMS device
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a...
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8030112 |
Method for fabricating MEMS device
A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on...
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8026120 |
Method of manufacturing MEMS device
A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to...
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8021906 |
Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith
Disclosed are methods and microsystems for vertically through-plating (6) cover plates (5) for microsystem components (2, 2a) by means of a conductive solder glass (8). Said methods and...
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8022491 |
High aspect ratio all SiGe capacitively coupled MEMS devices
A method that includes forming an opening between at least one first electrode and a second electrode by forming a recess in a first electrode layer, the recess having sidewalls that correspond to...
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8018077 |
Electromechanical system having a controlled atmosphere, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that...
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