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8178936 |
Double-side mountable MEMS package
The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting...
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8178379 |
Integrated circuit, resistivity changing memory device, memory module, and method of fabricating an integrated circuit
According to one embodiment of the present invention, a memory device includes a composite structure including a resistivity changing layer and an electrode layer being arranged on or above the...
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8173470 |
Three-axis accelerometers and fabrication methods
Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from...
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8173471 |
Method for fabricating micro-electro-mechanical system (MEMS) device
A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side,...
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8169082 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor...
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8168885 |
Low modulus solar cell encapsulant sheets with enhanced stability and adhesion
The present invention provides a pre-formed bi-layer thermoplastic film or sheet comprising a first surface layer made of acid copolymers, or ionomers, or combinations thereof and a second surface...
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8168461 |
Micro-electro-mechanical device and method of manufacturing the same
The present invention improves mechanical strength of a micro-electro-mechanical device (MEMS) having a movable portion to improve reliability. In a micro-electro-mechanical device (MEMS) having a...
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8164180 |
Functional element package and fabrication method therefor
A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to...
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8158448 |
Resonator and methods of making resonators
A resonator and method of making a resonator are provided. A particular method includes etching a silicon substrate to form a resonator structure. The resonator structure includes at least one...
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8148187 |
Method for manufacturing a micromechanical component having a volume-elastic medium and micromechanical component
A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally...
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8143083 |
Physical quantity sensor device and method for producing the same
A circuit board is mounted on a package via an adhesive agent as an elastic member. A sensor element is stacked in fixed relation onto the circuit board. The sensor element, the circuit board, and...
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8138006 |
Method for producing a micromechanical component having a trench structure for backside contact
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate....
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8138025 |
Microcap wafer bonding method and apparatus
A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one...
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8132314 |
Method and system for packaging and mounting surface acoustic wave sensor elements to a flex plate
A method and system for packaging and mounting a sensor to a flex plate for use in sensing, for example, torque. In some instances, a SAW sense die can be adhesively bonded to a metal disc that...
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8124436 |
MEMS switch capping and passivation method
A MEMS switch with a platinum-series contact is capped through a process that also passivates the contact by controlling, over time, the amount of oxygen in the environment, pressures and...
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8124435 |
Method for manufacturing a microelectromechanical component, and a microelectromechanical component
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical...
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8124434 |
Method and system for packaging a display
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the...
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8119502 |
Method for packaging components
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are...
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8115305 |
Integrated circuit package system with thin profile
An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an...
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8114697 |
Piezoelectric microphone, speaker, microphone-speaker integrated device and manufacturing method thereof
A piezoelectric microphone, a speaker, a microphone-speaker integrated device and a manufacturing method thereof are provided. The microphone-speaker integrated device includes a silicon substrate...
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8109149 |
Contact stress sensor
A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element...
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8105871 |
Semiconductor device and manufacturing method of the same
A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part...
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8101469 |
Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
A method of forming Monolithic CMOS-MEMS hybrid integrated, packaged structures includes the steps of providing: providing at least one semiconductor substrate having a CMOS device area including...
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8101458 |
Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
A method of forming Monolithic CMOS-MEMS hybrid integrated, packaged structures includes the steps of providing: providing a semiconductor substrate with pre-fabricated cmos circuits on the front...
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8093085 |
Method of forming suspension object on monolithic substrate
A method of forming a suspension object on a monolithic substrate is provided. A silicon base layer of the monolithic substrate has a circuit layer composed of at least one wet etching region, at...
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8093087 |
Method for fabricating MEMS device
Method for fabricating MEMS device has a first surface and a second surface and having a MEMS region and an IC region. A MEMS structure is formed over the first surface. A structural dielectric...
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8093086 |
Packaged device and method of manufacturing the same
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part...
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8089144 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor...
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8088647 |
Bumping free flip chip process
Methods, systems, and apparatuses for an integrated circuit package assembly process are provided. A wafer is received having a surface defined by a plurality of integrated circuit regions....
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8084285 |
Forming a micro electro mechanical system
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second...
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8084332 |
Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique...
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8067258 |
Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures
A method of protecting a substrate during fabrication of semiconductor, MEMS, or biotechnology devices. The method includes application of a protective thin film which typically has a thickness...
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8058145 |
Micro-electro-mechanical device and manufacturing method for the same
It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the...
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8058106 |
MEMS device package with vacuum cavity by two-step solder reflow method
In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is...
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8058639 |
Nitride semiconductor element and method for production thereof
A light-emitting apparatus of the present invention includes: a mounting base 260 which has a wire 265; and a nitride-based semiconductor light-emitting device flip-chip mounted on the mounting...
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8048704 |
Method of forming a MEMS topped integrated circuit with a stress relief layer
The bow in a wafer that results from fabricating a large number of MEMS devices on the top surface of the passivation layer of the wafer so that a MEMS device is formed over each die region is...
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8048717 |
Method and system for bonding 3D semiconductor devices
A method and system and for fabricating 3D (three-dimensional) SIC (stacked integrated chip) semiconductor devices. The system includes a vacuum chamber, a vacuum-environment treatment chamber, and...
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8043881 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to...
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8043880 |
Microelectronic device
One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and...
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8043891 |
Method of encapsulating a wafer level microdevice
The present invention discloses a method of encapsulating a wafer level microdevice, which includes: fabricating a microdevice on top side of a first silicon wafer; depositing a first capping...
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8043882 |
Method of making microminiature moving device
A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the...
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8039285 |
Thin film getter protection
A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering...
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8033091 |
Quantum tunnelling transducer device
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state...
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8030175 |
Method of bonding selected integrated circuit to adhesive substrate
A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a...
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8030112 |
Method for fabricating MEMS device
A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on...
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8026594 |
Sensor device and production method therefor
A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame...
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8021906 |
Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith
Disclosed are methods and microsystems for vertically through-plating (6) cover plates (5) for microsystem components (2, 2a) by means of a conductive solder glass (8). Said methods and...
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8022433 |
Semiconductor sensor device and method for manufacturing same
Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting...
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8018301 |
Micro-electro-mechanical transducer having a surface plate
A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a...
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8017436 |
Thin substrate fabrication method and structure
A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and...
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