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7625773 |
Anti-stiction technique for electromechanical systems and electromechanical device employing same
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion...
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7625772 |
Method for making an electromechanical component on a plane substrate
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at...
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7624644 |
Semiconductor pressure sensor and method for manufacturing semiconductor pressure sensor
A semiconductor pressure sensor includes a diaphragm; a resistor provided on a top surface of the diaphragm; an insulating film formed on the diaphragm and the resistor having a penetrating part...
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7622783 |
MEMS thermal actuator and method of manufacture
A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered...
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7611920 |
Photonic coupling scheme for photodetectors
A room temperature operation polycrystalline infrared responsive photodetector, manufactured by a process, comprising the steps of patterning vacuum-deposited material and dry-etching a photonic...
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7607213 |
Method of making a device for measuring deformation
A method of making a device for measuring deformation includes a step of depositing a silicon adhesion underlayer on a silicon carbide surface by chemical vapor spraying, and a step of depositing a...
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7601551 |
Method for manufacturing optical device
A method for manufacturing an optical device having an optical block, through which a light is transmitted, is provided. The method includes steps of: forming a plurality of silicon oxide members,...
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7598109 |
Method for fabricating micrometer or nanometer channels
Thin films, which are deposited on a sacrificial film on a substrate, are released and bonded back on a substrate surface. This technology provides open and closed 2D confined micro-/nano-channels...
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7595209 |
Low stress thin film microshells
Multi-layered, planar microshells having low stress for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a...
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7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7572660 |
Electrical through-plating of semiconductor chips
A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7569488 |
Methods of making a MEMS device by monitoring a process parameter
Embodiments of the present invention relate to methods and systems for making a microelectromechanical system MEMS device comprising supplying an etchant to etch one or more sacrificial structures...
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7566940 |
Electromechanical devices having overlying support structures
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in...
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7566582 |
Systems, methods and devices relating to actuatably moveable machines
Systems, methods and devices relating to actuatably movable machines and with methods of using and manufacturing the same.
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7560789 |
Semiconductor device
A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine...
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7556978 |
Piezoelectric MEMS switches and methods of making
MEMS piezoelectric switches 100 that provide advantages of compact structure ease of fabrication in a single unit, and that are free of high temperature-induced morphological changes of the...
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7550311 |
Near-field optical probe based on SOI substrate and fabrication method thereof
Provided is near-field optical probe including: a cantilever arm support portion that is formed of a lower silicon layer of a silicon-on-insulator (SOI) substrate, the cantilever arm support...
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7549328 |
Method of fabricating a pressure sensor
A method of fabricating a pressure sensor ( 30 ) for harsh environments such as vehicle tires, formed from a wafer substrate ( 32 ) with a recess, a flexible membrane ( 50 ) covering the recess to...
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7547568 |
Electrical conditioning of MEMS device and insulating layer thereof
A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior...
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7544531 |
Ground strap for suppressing stiction during MEMS fabrication
To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches...
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7541214 |
Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
The present invention is related to a method for manufacturing micro-electro-mechanical systems (MEMS) having movable and stationary suspended structures formed from mono-crystalline silicon wafer...
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7540192 |
Physical quantity sensor having optical part and method for manufacturing the same
A method for manufacturing a physical quantity sensor having a movable portion, a support portion and an optical part is provided. The method includes steps of: etching a silicon substrate so that...
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7537952 |
Method of manufacturing MEMS device package
A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being...
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7534640 |
Support structure for MEMS device and methods therefor
A microelectromechanical systems device having support structures formed of sacrificial material that is selectively diffused with a dopant material or formed of a selectively oxidized metal...
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7531371 |
Multisurfaced microdevice system array and a method of producing the array
A multisurfaced microdevice system array is produced from a wafer formed of semiconductor substrate material. Sensing, controlling and actuating microdevices are fabricated at specific location on...
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7528048 |
Planar vertical resistor and bond pad resistor and related method
Resistors that avoid the problems of miniaturization of semiconductor devices and a related method are disclosed. In one embodiment, a resistor includes a planar resistor material that extends...
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7527998 |
Method of manufacturing MEMS devices providing air gap control
Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate,...
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7527996 |
Non-planar surface structures and process for microelectromechanical systems
Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Voids are...
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7524693 |
Method and apparatus for forming an electrical connection to a semiconductor substrate
A device ( 100 ) may use one or more conductive elements ( 112 ) to electrically couple a substrate ( 116 ) and a cap ( 114 ). In one embodiment, an acceleration sense element may be formed on the...
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7521276 |
Compliant terminal mountings with vented spaces and methods
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
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7521265 |
Method for measuring an amount of strain of a bonded strained wafer
In a method for measuring an amount of strain of a bonded strained wafer, at least one strained layer is formed on a single crystal substrate. The bonded strained wafer is measured with respect to...
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7517711 |
MEMS type resonator, process for fabricating the same and communication unit
A MEMS resonator and a method for manufacturing thereof are provided, in which an adsorption of a beam into a substrate in a wet process when manufacturing a MEMS is prevented and other oscillation...
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7514760 |
IC-compatible MEMS structure
An IC-compatible MEMS structure and a method to form such a structure are described. In an embodiment, an integrated circuit having a MEMS device is formed. The structure comprises a plurality of...
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7514285 |
Isolation scheme for reducing film stress in a MEMS device
A method of electrically isolating a MEMS device is provided. In one example, a piezo-resistive pressure sensor having an exposed silicon region undergoes a Local Oxidation of Silicon (LOCOS)...
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7514283 |
Method of fabricating electromechanical device having a controlled atmosphere
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that...
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7504276 |
Micro device having micro system structure and method for method for manufacturing the same
A micro device having a micro system structure includes a protection film disposed on the micro system structure for protecting from a particle. The protection film includes a first protection film...
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7495301 |
Thin film accelerometer
A thin film structure including a conductive thin film provided on a substrate and configured to be displaced in response to an applied acceleration, a pair of electrode pads formed on the...
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7492040 |
Glass lid, and package provided with such a lid, for the encapsulation of electronic components
The encapsulation lid comprises at least two glass layers of different compositions, a first layer called the bottom layer, which is continuous, and at least a second layer, which is discontinuous...
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7491567 |
MEMS device packaging methods
A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that...
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7491566 |
Method of forming a device by removing a conductive layer of a wafer
A method of forming a MEMS device provides a wafer having a base, a first conductive layer, a second conductive layer, and an intermediate conductive layer. After it provides the wafer, the method...
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7482192 |
Method of making dimple structure for prevention of MEMS device stiction
A MEMS device having a proof mass resiliently mounted above a substrate has projections formed on adjacent surfaces of the mass and substrate. The device is formed by creating a plurality of holes...
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7479402 |
Comb structure fabrication methods and systems
A method of manufacturing a vertical comb structure for a micro electromechanical (MEMS) device. Tooth structures are formed on a first wafer. A second wafer is then bonded to the tooth structures...
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7476948 |
Microminiature moving device and method of making the same
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46, a movable comb electrode 49, etc.) displaceable in parallel to...
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7469590 |
Package structure of pressure sensor
A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate...
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7465599 |
Method for manufacturing physical quantity sensor
A physical quantity sensor includes: a semiconductor substrate; a cavity disposed in the substrate and extending in a horizontal direction of the substrate; a groove disposed on the substrate and...
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7459329 |
Method of fabricating silicon-based MEMS devices
A method of fabricating a silicon-based microstructure is disclosed, which involves depositing electrically conductive amorphous silicon doped with first and second dopants to produce a structure...
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7456399 |
Calibrating multiple photoelectron spectroscopy systems
A method comprising obtaining a first set of spectral data for a first sample film measured by a first system, extracting intensities for one or more elemental species associated with the first...
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7456042 |
Microelectromechanical systems having stored charge and methods for fabricating and using same
Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed...
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7456041 |
Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
A method of manufacturing a MEMS structure including forming a porous layer having a predetermined thickness on the top surface of a substrate over an area where a cavity is to be formed; forming...
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