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9040335 Side vented pressure sensor device  
A semiconductor sensor device has a pressure sensing die and at least one other die mounted on a substrate, and electrical interconnections that interconnect the pressure sensing die and the at...
9038269 Printhead with nanotips for nanoscale printing and manufacturing  
A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may...
9038466 Micromechanical component and manufacturing method for a micromechanical component  
A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator...
9040334 MEMS integrated pressure sensor devices and methods of forming same  
A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the...
9040336 Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap  
A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable...
9034680 Method for producing a microelectromechanical device and microelectromechanical device  
In a method for producing a micro-electromechanical device in a material substrate, a component element defining the position of an electronic component and/or required for the function of the...
9035451 Wafer level sealing methods with different vacuum levels for MEMS sensors  
The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In...
9034679 Method for fabricating multiple types of MEMS devices  
A method entails providing a substrate with a structural layer having a thickness. A partial etch process is performed at locations on the structural layer so that a portion of the structural...
9034681 Chip package and method for forming the same  
An embodiment of the invention provides a chip package, which includes: a substrate having an upper surface and a lower surface; a passivation layer located overlying the upper surface of the...
9029178 Method for producing a device comprising cavities formed between a suspended element resting on insulating pads semi-buried in a substrate and this substrate  
A method for producing a device including plural cavities defined between a substrate in at least one given semiconductor material and a membrane resting on a top of insulating posts projecting...
9024395 Taxel-addressable matrix of vertical nanowire piezotronic transistors  
A tactile sensing matrix includes a substrate, a first plurality of elongated electrode structures, a plurality of vertically aligned piezoelectric members, an insulating layer infused into the...
9023675 Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas  
A process for encapsulating a microelectronic device, comprising the following steps: make the microelectronic device on a first substrate;make one portion of a first material not permeable to the...
9018030 Transparent force sensor and method of fabrication  
A transparent force sensor for use in touch panel displays (touch screens) and method for fabricating the same are disclosed. The transparent force sensor is capable of detecting touch by...
9013012 Self-sealing membrane for MEMS devices  
Embodiments of the present disclosure are related to MEMS devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane...
9012254 Methods for forming a sealed liquid metal drop  
Methods for forming an enclosed liquid metal (LM) drop inside a sealed cavity by formation of LM components as solid LM component layers and reaction of the solid LM component layers to form the...
9006846 Through silicon via with reduced shunt capacitance  
This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can...
9006015 Dual layer microelectromechanical systems device and method of manufacturing same  
Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the...
8993388 Manufacturing method of liquid crystal display having touch sensor  
A method of manufacturing a liquid crystal display having a touch sensor, the method including forming a plurality of thin film transistors on a first substrate, forming a plurality of pixel...
8980668 Integrated getter area for wafer level encapsulated microelectromechanical systems  
There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film...
8981500 Method for producing an optical window device for a MEMS device  
A method for producing an optical window device for a MEMS device, including applying a layer made of a transparent material onto a substrate having a recess, and deforming the layer so that it is...
8975107 Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of features using local oxidation regions  
In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is...
8975104 Low temperature ceramic Microelectromechanical structures  
A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences...
8975620 Organic semiconductor device and manufacturing method thereof  
An organic semiconductor device includes a carrier, a source, a drain, an organic semiconductor single-crystalline channel layer, an organic insulation layer and a gate. The source and the drain...
8969102 Testing an electrical connection of a device cap  
A method of testing a device includes setting a potential of a cap terminal of the device to a first voltage, setting a potential of a self test plate of the device to a testing voltage, and...
8969109 Tunable light-emitting diode  
A method of forming a light-emitting diode including determining a first level of tensile stress to be applied to a base substrate including a plurality of quantum well layers to adjust a band-gap...
8969151 Integrated circuit system employing resistance altering techniques  
An integrated circuit system that includes: providing a substrate including a first region and a second region; forming a first device over the first region and a resistance device over the second...
8962367 MEMS device with release aperture  
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial...
8963120 Optoelectronic semiconductor component and photonic crystal  
An optoelectronic semiconductor component includes a semiconductor layer sequence having at least one active layer, and a photonic crystal that couples radiation having a peak wavelength out of or...
8963281 Simultaneous isolation trench and handle wafer contact formation  
Techniques are described to simultaneously form an isolation trench and a handle wafer contact without additional mask steps. In one or more implementations, an isolation trench and a handle wafer...
8963263 Resistant strain gauge  
The invention relates to measurement and control of mechanical values, in particular, to control of stress conditions of various structures and manufacturing sensors of resistant strain gauge type...
8956903 Planar cavity MEMS and related structures, methods of manufacture and design structures  
A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes...
8952467 Electronic device and its manufacturing method  
An electronic device includes a substrate, a sidewall that is disposed on the substrate and forms a cavity, a first layer that is disposed on the sidewall and covers the cavity, a second layer...
8952463 MEMS structure preventing stiction  
A MEMS (Micro-Electro-Mechanical-System) structure preventing stiction, comprising: a substrate; and at least two structural layers above the substrate, wherein at least one of the at least two...
8946872 Method for producing a semiconductor  
A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a...
8945968 Compliant micro device transfer head with integrated electrode leads  
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into...
8941193 Method for manufacturing a hybrid integrated component  
A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one...
8940570 Micro-electro-mechanical system (MEMS) structures and design structures  
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one fixed electrode on a substrate. The method...
8941192 MEMS actuator device deployment  
A method for making an actuator device includes forming a substantially planar structure having a stage resiliently supported for movement within a plane of the structure, an actuator coupled to...
8936959 Integrated rf MEMS, control systems and methods  
An rf MEMS system has a semiconductor substrate, e.g., silicon. The system also has a control module provided overlying one or more first regions of the semiconductor substrate according to a...
8936960 Method for fabricating an integrated device  
A method for fabricating an integrated device includes the following steps. First, a multi-layered structure is formed on a substrate, wherein the multi-layered structure is embedded in a lower...
8932893 Method of fabricating MEMS device having release etch stop layer  
A method of fabricating a microelectromechanical (MEMS) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the...
8928042 Structure having plural conductive regions and process for production thereof  
A structure having a plurality of conductive regions insulated electrically from each other comprises a movable piece supported movably above the upper face of the conductive region, the movable...
8921165 Elimination of silicon residues from MEMS cavity floor  
The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter...
8921144 Planar cavity MEMS and related structures, methods of manufacture and design structures  
A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a lower sacrificial material used to form a lower cavity. The method further includes forming a cavity via...
8921145 Hybrid MEMS bump design to prevent in-process and in-use stiction  
A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of...
8921951 MEMS device and manufacturing method thereof  
A MEMS device includes: a movable element supported by a supporting member on a substrate; an encapsulation structure provided above the substrate so as to encapsulate the movable element; and a...
8921952 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof  
Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a...
8916942 Microelectromechanical resonator and a method for producing the same  
The invention relates to temperature compensated micro-electro-mechanical (MEMS) resonators (300) preferably made of silicon. Prior art MEMS resonators have a significant temperature coefficient...
8916407 MEMS device and method of manufacturing same  
A method of manufacturing a micromachined resonator having a moveable member comprising forming the moveable member from a material having a first concentration of dopants of a first impurity...
8916943 MEMS devices having a plurality of cavities  
An integrated circuit device includes a first layer comprising at least two partial cavities, an intermediate layer bonded to the first layer, the intermediate layer formed to support at least two...