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8183076 |
Micro-electro-mechanical system device, out-of-plane sensor and method for making micro-electro-mechanical system device
The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and...
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8183077 |
Force input control device and method of fabrication
Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing...
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8173513 |
Method for manufacturing a semiconductor pressure sensor
Method for manufacturing a semiconductor pressure sensor, wherein, in a silicon substrate, trenches are dug and delimit walls; a closing layer is epitaxially grown, that closes the trenches at the...
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8173471 |
Method for fabricating micro-electro-mechanical system (MEMS) device
A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side,...
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8168461 |
Micro-electro-mechanical device and method of manufacturing the same
The present invention improves mechanical strength of a micro-electro-mechanical device (MEMS) having a movable portion to improve reliability. In a micro-electro-mechanical device (MEMS) having a...
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8163583 |
Manufacturing method of micro electronic mechanical system structure
A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the...
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8153476 |
Electronic component and method of manufacturing the same
An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a...
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8148792 |
Pressure sensor and method for manufacturing the pressure sensor
A pressure sensor of the present invention includes a lower substrate which has an insulating layer having a through-hole penetrating from one side to the other side, and an active layer formed to...
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8143971 |
MEMS resonator
A MEMS resonator, comprising a planar resonator body formed of two different materials with opposite sign temperature coefficient of Young's modulus. A first portion of one material extends across...
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8142670 |
Micro-oscillating element and method of making the same
A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first...
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8143907 |
Capacitive occupant sensor
A capacitive occupant sensor includes a sensor mat having U-parts arranged in a first direction and, a second direction perpendicular to each other. The U-parts located adjacent to each other are...
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8143082 |
Wafer bonding of micro-electro mechanical systems to active circuitry
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
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8138006 |
Method for producing a micromechanical component having a trench structure for backside contact
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate....
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8138791 |
Stressed transistors with reduced leakage
Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may...
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8129802 |
Integrated micro electro-mechanical system and manufacturing method thereof
In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate,...
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8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
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8124435 |
Method for manufacturing a microelectromechanical component, and a microelectromechanical component
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical...
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8119432 |
Method and apparatus for MEMS oscillator
A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator...
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8119431 |
Method of forming a micro-electromechanical system (MEMS) having a gap stop
A method of forming a micro-electromechanical system (MEMS) includes providing a cap substrate, providing a support substrate, depositing a conductive material over the support substrate,...
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8114696 |
CMOS image sensor with asymmetric well structure of source follower
Provided is a CMOS image sensor with an asymmetric well structure of a source follower. The CMOS image sensor includes: a well disposed in an active region of a substrate; a drive transistor having...
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8114699 |
Integration manufacturing process for MEMS device
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a...
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8093087 |
Method for fabricating MEMS device
Method for fabricating MEMS device has a first surface and a second surface and having a MEMS region and an IC region. A MEMS structure is formed over the first surface. A structural dielectric...
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8093644 |
Multiwalled carbon nanotube memory device
A carbon nanotube based memory device comprises a set of three concentric carbon nanotubes having different diameters. The diameters of the three concentric carbon nanotubes are selected such that...
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8088638 |
MEMS DC to DC switching converter
The present invention provides a DC high voltage converter having an oscillator driver, main switch array and topological enhanced capacitors. The switch array utilizes MEM cantilevers and...
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8084285 |
Forming a micro electro mechanical system
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second...
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8076169 |
Method of fabricating an electromechanical device including at least one active element
The invention relates to a method of fabricating an electromechanical device including an active element, wherein the method comprises the following steps: a) making a monocrystalline first stop...
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8071413 |
Micro-electro-mechanical system (MEMS) sensor and method for making same
The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended...
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8071411 |
Low temperature ceramic microelectromechanical structures
A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting...
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8071412 |
Method of fabricating micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8072036 |
Micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8067811 |
MEMS device, MEMS device module and acoustic transducer
A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap...
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8058106 |
MEMS device package with vacuum cavity by two-step solder reflow method
In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is...
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8058952 |
MEMS resonator, a method of manufacturing thereof, and a MEMS oscillator
The invention relates to a MEMS resonator comprising a first electrode, a movable element (48) comprising a second electrode, the movable element (48) at least being movable towards the first...
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8057374 |
Ergonomic tool lifting machine and method
An ergonomic tool lifting machine and method particularly useful for manipulating a machine tool or another heavy object. In one embodiment of the invention, the machine tool is a large milling...
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8053265 |
Mitigation of high stress areas in vertically offset structures
Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion...
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8053267 |
Three-dimensional force input control device and fabrication
The present invention provides three-dimensional force input control devices for use in sensing vector forces and converting them into electronic signals for processing, and methods of fabricating...
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8043880 |
Microelectronic device
One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and...
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8039284 |
Dual metal silicides for lowering contact resistance
A method for forming a semiconductor structure includes: providing a semiconductor substrate; forming an NMOS device at a surface of the semiconductor substrate, which comprises forming a first...
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8033091 |
Quantum tunnelling transducer device
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state...
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8035176 |
MEMS package and packaging method thereof
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate,...
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8030111 |
Integration manufacturing process for MEMS device
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a...
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8030112 |
Method for fabricating MEMS device
A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on...
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8026120 |
Method of manufacturing MEMS device
A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to...
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8021906 |
Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith
Disclosed are methods and microsystems for vertically through-plating (6) cover plates (5) for microsystem components (2, 2a) by means of a conductive solder glass (8). Said methods and...
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8018077 |
Electromechanical system having a controlled atmosphere, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that...
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8012785 |
Method of fabricating an integrated CMOS-MEMS device
An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate....
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8008738 |
Integrated differential pressure sensor
An integrated differential pressure sensor includes, in a monolithic body of semiconductor material, a first face and a second face, a cavity extending at a distance from the first face and...
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8003422 |
Micro-electro-mechanical system device and method for making same
According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order;...
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8003973 |
Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
A multi layered substrate structure can be formed where the substrates are coupled together using surface Coulomb forces. Connect substrates electrically connects signals and DC voltages between...
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7998776 |
Methods for manufacturing MEMS sensor and thin film thereof with improved etching process
A method for manufacturing a MEMS sensor and a thin film thereof includes steps of etching a top surface of a single-crystal silicon wafer in combination of a deposition process, an isotropic DRIE...
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