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7625824 |
Process change detection through the use of evolutionary algorithms
The present invention provides a method for creating a process change detection algorithm. An evolutionary computing technique is applied to at least one process dataset containing at least one...
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7625495 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of...
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7622308 |
Process control using process data and yield data
A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”)....
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7618830 |
Rapid thermal processing apparatus and methods
Rapid thermal processing apparatus methods are disclosed. In a disclosed apparatus, rapid thermal processing is carried out when the residual oxygen detected by a residual oxygen detector does not...
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7601547 |
Magnetic annealing sequences for patterned MRAM synthetic antiferromagnetic pinned layers
A method is provided for fabricating a fixed layer for a MRAM device. The method includes providing the fixed layer. The fixed layer includes an antiferromagnetic pinning layer over a substrate and...
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7599811 |
Sensor for lithographic apparatus and method of obtaining measurements of lithographic apparatus
A sensor arrangement may be used to measure properties, such as optical properties, of a device arranged to process substrates. The sensor arrangement includes a substrate having the following: a...
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7595496 |
Optimized correction of wafer thermal deformations in a lithographic process
A method and apparatus of correcting thermally-induced field deformations of a lithographically exposed substrate, is presented herein. In one embodiment, the method includes exposing a pattern...
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7592190 |
Method of evaluating characteristics of and forming of an insulating film for a semiconductor device
A method of evaluating characteristics of an insulating film 1 is disclosed. The insulating film 1 is formed of an insulative inorganic material as a main material, the insulative inorganic...
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7582490 |
Controlled fabrication of gaps in electrically conducting structures
A method for controlling a gap in an electrically conducting solid state structure provided with a gap. The structure is exposed to a fabrication process environment conditions of which are...
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7572647 |
Internal balanced coil for inductively coupled high density plasma processing chamber
A coil is provided for use in a semiconductor processing system to generate a plasma with a magnetic field in a chamber. The coil comprises a first coil segment, a second coil segment and an...
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7569402 |
Chip data providing system and chip data providing server used therefore
A chip data providing system is provided. The chip data providing system is equipped with an inspection device for inspecting each chip after processing steps of forming integrated circuits on a...
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7553678 |
Method for detecting semiconductor manufacturing conditions
A method for detecting semiconductor-manufacturing conditions includes providing a photomask with a plurality of pattern areas each having a plurality of test lines with different pitches, exposing...
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7547561 |
Advanced process control model incorporating a target offset term
An advanced process control (APC) architecture comprising a process model that incorporates a target offset term is provided. The APC architecture may be applied to a so-called develop inspect...
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7534627 |
Methods and systems for controlling critical dimensions in track lithography tools
A method of controlling wafer critical dimension (CD) uniformity on a track lithography tool includes obtaining a CD map for a wafer. The CD map includes a plurality of CD data points correlated...
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7534628 |
Method for forming semiconductor device and method for forming photovoltaic device
A method for forming a semiconductor device including a semiconductor layer, formed of a silicon-based deposited film containing crystals by plasma-enhanced CVD, includes the steps of applying a...
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7531368 |
In-line lithography and etch system
The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer...
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7521697 |
Method for fabricating semiconductor device and equipment for fabricating the same
A method for fabricating a semiconductor device and an equipment for fabricating the semiconductor device are described. According to the method and the equipment, a semiconductor substrate is...
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7517141 |
Simultaneous control of deposition time and temperature of multi-zone furnaces
The present invention facilitates multi-zone furnace ( 102 ) based deposition processes by iteratively adjusting deposition time and zonal setpoint temperatures to mitigate deviations from desired...
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7517813 |
Two-step oxidation process for semiconductor wafers
An efficient method for the thermal oxidation of preferably silicon semiconductor wafers using LOCOS (local oxidation of silicon) processes is described. The mechanical stresses of the wafers are...
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7510884 |
Semiconductor production system and semiconductor production process
A semiconductor manufacturing apparatus according to the present invention comprises: a treating unit that treats a substrate to manufacture thereon a semiconductor device; a fluid supplying...
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7504268 |
Adaptive shape substrate support method
The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate....
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7482178 |
Chamber stability monitoring using an integrated metrology tool
A method and apparatus for monitoring the stability of a substrate processing chamber and for adjusting the process recipe. Thickness and CD measurement data are collected before wafer processing...
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7476554 |
Substrate processing method
A substrate processing method of the present invention includes the steps of placing a substrate inside a vacuum container containing particles and processing the substrate inside the container...
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7473567 |
Change rate prediction method, storage medium, and substrate processing system
A change rate prediction method according to which there can be eliminated the need for experimentally determining electron beam intensities for making a change rate of a specification value of a...
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7474979 |
Integrated circuit device test system and method
A method for integrated device testing can include the steps of: receiving wafer test data that identifies wafer test failures with the dice tested while part of a shared common substrate;...
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7460972 |
Methods and systems for performing real-time wireless temperature measurement for semiconductor substrates
A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive...
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7452732 |
Comparing identifying indicia formed using laser marking techniques to an identifying indicia model
A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser-reactive...
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7449348 |
Feedback control of imprint mask feature profile using scatterometry and spacer etchback
The present invention relates generally to photolithographic systems and methods, and more particularly to systems and methodologies that facilitate compensating for retrograde feature profiles on...
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7440869 |
Mapping yield information of semiconductor dice
In one exemplary embodiment, yield information of semiconductor dice is mapped by obtaining yield information of a first die that was formed on a first location on a first wafer. Yield information...
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7439068 |
Plasma monitoring method, plasma processing method, method of manufacturing semiconductor device, and plasma processing system
Disclosed is a plasma monitoring method for detecting the amount of atomic radicals generated by dissociation of a molecular raw material gas during a plasma processing conducted by introducing the...
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7435514 |
Active mask lithography
An active mask emits a patterned energy flux in response to an energy input.
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7432179 |
Controlling gate formation by removing dummy gate structures
A method of forming semiconductor structures comprises following steps. A gate dielectric layer is formed over a substrate in an active region. A gate electrode layer is formed over the gate...
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7416472 |
Systems for planarizing workpieces, e.g., microelectronic workpieces
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
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7413500 |
Methods for planarizing workpieces, e.g., microelectronic workpieces
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
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7402801 |
Inspecting method of a defect inspection device
An inspecting method comprises the following steps. A plurality of defect inspection devices is formed on a wafer. Each defect inspection device comprises an insulating layer and a conductive layer...
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7403832 |
Method and system for advanced process control including tool dependent machine constants
A controller and a method of controlling a process tool is provided, in which machine constants used for calibrating manipulated variables of the control algorithm are explicitly introduced into...
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7402442 |
Physically highly secure multi-chip assembly
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate...
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7399705 |
Method for producing a local coating and combinatory substrate having such coating
A method for producing at least one local coating on a substrate is provided, as well as a combinatory substrate having such a local coating, a mask that is removable in a non-destructive manner...
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7390751 |
Dry etching method and apparatus for performing dry etching
A dry etching method includes loading a wafer on a lower electrode having at least two cooling paths. Cooling fluids having different temperatures are supplied to each of the cooling paths of the...
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7384876 |
Method and apparatus for determining consumable lifetime
A plasma processing device comprising a gas injection system is described, wherein the gas injection system comprises a gas injection assembly body, a consumable gas inject plate coupled to the gas...
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7368302 |
Dynamic metal fill for correcting non-planar region
Methods and a system are disclosed for correcting a non-planar region during fabrication of a semiconductor product on a wafer. The invention separates an exposure of at least a portion of a fill...
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7364922 |
Automated semiconductor wafer salvage during processing
The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate...
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7353379 |
Methods for configuring a plasma cluster tool
A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically...
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7348187 |
Method, device, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects
In the case of the method, an analysis is performed by using values of at least one process parameter of the manufacturing process of the physical object and, as a result of the analysis, when they...
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7340372 |
Apparatus and method for investigating parameters of layers deposited on semiconductor wafers
In order to determine the dielectric constant of a layer deposited on a semiconductor wafer ( 2 ), the density of the layer is obtained. To obtain that density, the wafer ( 2 ) without the layer is...
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7337091 |
Method and apparatus for coordinating fault detection settings and process control changes
A system includes a process tool for processing a workpiece, a process controller, and a fault monitor. The process controller is configured to determine a control action for updating an operating...
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7332368 |
Light guide for image sensor
A new method to form an image sensor device is achieved. The method comprises forming an image sensing array in a substrate comprising a plurality of light detecting diodes with spaces between the...
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7324865 |
Run-to-run control method for automated control of metal deposition processes
A method is provided, the method comprising monitoring consumption of a sputter target to determine a deposition rate of a metal layer during metal deposition processing using the sputter target,...
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7320895 |
Thyristor-based device having dual control ports
Switching operations, such as those used in memory devices, are enhanced using a thyristor-based semiconductor device adapted to switch between a blocking state and a conducting state. According to...
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7314766 |
Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus
A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the...
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