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7625775 |
Multiple function thin-film resistor-capacitor array
A multiple function thin-film resistor-capacitor array is used for an optical fiber receiving module. A dielectric thin film with desired pattern and thickness is form on surface of a silicon...
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7625767 |
Methods of making spintronic devices with constrained spintronic dopant
A method is for making a spintronic device and may include forming at least one superlattice and at least one electrical contact coupled thereto, with the at least one superlattice including a...
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7625603 |
Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics
A silicon oxide layer is formed by oxidation or decomposition of a silicon precursor gas in an oxygen-rich environment followed by annealing. The silicon oxide layer may be formed with slightly...
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7622319 |
CMOS image sensor and manufacturing method thereof
A CMOS image sensor includes isolation regions and a photo diode region formed in a substrate, gate electrodes formed on the substrate, impurity injection regions formed in the substrate...
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7615796 |
Light emitting diode having an electrode buffer layer
A light emitting diode (LED) utilizes an adhesive layer to adhere a light emitting layer to a substrate. The LED further comprises an electrode buffer layer to enhance the adhesion between the...
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7615393 |
Methods of forming multi-doped junctions on a substrate
A method of forming a multi-doped junction on a substrate is disclosed. The method includes providing the substrate doped with boron, the substrate including a first substrate surface with a first...
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7611918 |
CMOS image sensor and method for fabricating the same
A CMOS image sensor and a method of fabricating the same are provided. The CMOS image sensor includes: an epitaxial layer of a first conductivity type, formed in a semiconductor substrate of the...
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7608874 |
Fully isolated photodiode stack
An array of fully isolated multi-junction complimentary metal-oxide-semiconductor (CMOS) filterless color imager cells is provided, together with an associated fabrication method. The method...
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7608474 |
Method for manufacturing optical element
A method for manufacturing an optical element having a metal wire grid containing a plurality of metal wires on a substrate includes forming the metal wire grid using an electrolytic plating process.
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7608470 |
Interconnection device including one or more embedded vias and method of producing the same
“An interconnection device comprises a Systems In Package (SIP) device, or Systems in Chip (SIC) device, including one or more embedded vias extending through a base substrate. A process to...
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7606399 |
Surface shape recognizing sensor device
A sensor cell includes a sensor electrode ( 101 ) formed on a substrate ( 100 ), a signal output unit ( 16 ) which outputs a signal corresponding to a capacitance (Cf) formed between the sensor...
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7605013 |
Photo-detector and related methods
An apparatus comprising at least one multilayer wafer which includes a device layer adjacent to a barrier layer, and the device layer includes at least two photoconductive regions separated by an...
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7601555 |
Wafer inspection system and method thereof
A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect...
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7601554 |
Shaped MEMS contact
A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear...
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7601551 |
Method for manufacturing optical device
A method for manufacturing an optical device having an optical block, through which a light is transmitted, is provided. The method includes steps of: forming a plurality of silicon oxide members,...
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7598132 |
Active photosensitive structure with buried depletion layer
An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes...
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7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die...
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7598108 |
Gallium nitride-on-silicon interface using multiple aluminum compound buffer layers
A thermal expansion interface between silicon (Si) and gallium nitride (GaN) films using multiple buffer layers of aluminum compounds has been provided, along with an associated fabrication method....
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7598107 |
Semi-sacrificial mold for diamond structures
A patterned structure forms a portion of the mold for a diamond molded structure but is separable from the mold by the same processes that release the diamond part. The mold portion may itself be a...
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7597819 |
Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films
Etchant solutions comprising a redox buffer can be used during the release etch step to reduce damage to the structural layers of a MEMS device that has noble material films. A preferred redox...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7595518 |
Doping mask and methods of manufacturing charge transfer image and microelectronic device using the same
Provided are a doping mask and methods of manufacturing a charge transfer image device and a microelectronic device using the same. The method includes forming a photoresist film on an entire...
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7595215 |
CMOS image sensor and method for manufacturing the same
A CMOS image sensor and a method for manufacturing the same are provided. The CMOS image sensor enlarges an area of a real image and prevents interference between adjacent pixels by forming a...
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7595209 |
Low stress thin film microshells
Multi-layered, planar microshells having low stress for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a...
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7592204 |
Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical...
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7591913 |
Thermoelectric properties by high temperature annealing
The present invention generally provides methods of improving thermoelectric properties of alloys by subjecting them to one or more high temperature annealing steps, performed at temperatures at...
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7588956 |
CMOS image sensor and method of manufacturing the same
Disclosed herein are a CMOS image sensor and a method of manufacturing the same, which can reduce current leakage through a plug connecting a photodiode and a transfer transistor to each other, and...
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7586529 |
Solid-state imaging device
A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a...
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7586139 |
Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor
An imaging sensor with an array of FET pixels and method of forming the imaging sensor. Each pixel is a semiconductor island, e.g., N-type silicon on a Silicon on insulator (SOI) wafer. FETs are...
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7585691 |
Solid-state imaging device and method for producing the same
In a solid-state imaging device, a light-shielding film 10 a is formed of at least one of a high melting point metal film or a high melting point metal compound film. The surface of the...
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7585690 |
Process for producing group III nitride compound semiconductor light emitting device, group III nitride compound semiconductor light emitting device and lamp
A process for producing a group III nitride compound semiconductor light emitting device, the group III nitride compound semiconductor light emitting device and a lamp, having excellent...
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7582920 |
Apparatus comprising an avalanche photodiode
Avalanche photodiodes are provided, wherein the APDs provide both high optical coupling efficiency and low dark count rate. The APDs are formed such that their cap layer has an active region of...
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7582499 |
Photo sensor and a method for manufacturing thereof
A photo sensor has an insulator layer for covering a diode stack, and the insulator layer is made of photoresist to reduce a side leakage current.
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7582490 |
Controlled fabrication of gaps in electrically conducting structures
A method for controlling a gap in an electrically conducting solid state structure provided with a gap. The structure is exposed to a fabrication process environment conditions of which are...
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7579197 |
Method of forming a magnetic tunnel junction structure
In a particular illustrative embodiment, a method of forming a magnetic tunnel junction (MTJ) device is disclosed that includes forming a trench in a substrate. The method further includes...
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7575966 |
Method for fabricating pixel structure of active matrix organic light-emitting diode
A method for fabricating an AMOLED pixel includes forming a transparent semiconductor layer on a substrate and forming a first channel layer of the switch TFT, a lower electrode of a storage...
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7575948 |
Method for operating photosensitive device
A method for operating a photosensitive device is provided. At first, the photosensitive device is provided, which comprising a photo sensor circuit and a photo sensor, where the photo sensor is...
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7575933 |
Modification of selectivity for sensing for nanostructure device arrays
An electronic system for selectively detecting and identifying a plurality of chemical species, which comprises an array of nanostructure sensing devices, is disclosed. Within the array, there are...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7569488 |
Methods of making a MEMS device by monitoring a process parameter
Embodiments of the present invention relate to methods and systems for making a microelectromechanical system MEMS device comprising supplying an etchant to etch one or more sacrificial structures...
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7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting...
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7569411 |
Metal MEMS devices and methods of making same
Metal MEMS structures are fabricated from metal substrates, preferably titanium, utilizing micromachining processes with a new deep etching procedure to provide released microelectromechanical...
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7566940 |
Electromechanical devices having overlying support structures
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in...
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7566581 |
Systems and methods for creating MEMS gyros
Methods and systems for creating microelectromechanical system (MEMS) gyros. The methods and systems include generating a map of motor bias and creating MEMS gyros based on the map of motor bias to...
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7563635 |
Electronic device and method of manufacturing the same
In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21 , hydrofluoric acid is injected, so as to dissolve a...
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7563632 |
Methods for packaging and sealing an integrated circuit die
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or...
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7563631 |
Reduced barrier photodiode / gate device structure for high efficiency charge transfer and reduced lag and method of formation
A pixel cell having a reduced potential barrier near a region where a gate and a photodiode are in close proximity to one another, and a method for forming the same are disclosed. Embodiments of...
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7563625 |
Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
Methods for fabricating a semiconductor light-emitting diode (LED) device with increased light extraction are provided. The method generally includes applying a mask to a surface of an LED wafer,...
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7560789 |
Semiconductor device
A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine...
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7560303 |
Method and apparatus for linear die transfer
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing...
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