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7611969 |
Generation and applications of negative dielectric constant materials
A negative dielectric is induced by the application of a dc bias-electric field in aggregates of oxide nano-particles whose surfaces have been specially treated. The magnitude of the dielectric...
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7582508 |
Method for manufacturing an organic semiconductor device that utilizes ionic salt
A method for manufacturing an organic semiconductor device having enhanced uniformity of light-emission and excellent luminance with relatively low driving voltage by a wet process is disclosed....
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7564138 |
Method for attaching chips in a flip-chip arrangement
Targeted heating is employed to essentially only heat a material that is used as a spacer and to bond a first chip of a flip-chip to a second chip thereof and not the rest of the chips. In order to...
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7563696 |
Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
A semiconductor device manufacturing apparatus which uses a thermal CVD reaction to deposit a film onto a substrate has a ring with an electrode terminal that makes contact with either the...
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7501328 |
Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of...
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7487678 |
Z offset MEMS devices and methods
A microelectromechanical system (MEMS) device with a mechanism layer and a base. The top surface of the base is bonded to the mechanism layer and defines a gap in the top surface of the base. A...
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7456030 |
Electroforming technique for the formation of high frequency performance ferromagnetic films
A hybrid method of fabricating magnetic core elements of an on-chip inductor structure addresses issues associated with conventional bottom up and damascene magnetic core plating techniques. The...
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7427802 |
Irreversible reduction of the value of a polycrystalline silicon resistor
The invention relates to a method and device for the irreversible reduction of the value of an integrated polycrystalline silicon resistor. The inventive method consists in temporarily subjecting...
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7402182 |
High-power LGA socket
A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped...
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7332377 |
Manufacturing method with self-aligned arrangement of solid body electrolyte memory cells of minimum structure size
The object of providing a method for manufacturing solid body electrolyte memory cells or CB memory cells, respectively, which is suited for the simplified manufacturing of highly dense arrays with...
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7314781 |
Device packages having stable wirebonds
A method of making a packaged electrical device comprises the steps of (a) connecting one end of a wire to a first point (e.g., a first electrical node) in the package, and (b) connecting the other...
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7307267 |
Electric device with phase change material and parallel heater
The electric device ( 1, 100 ) has a body ( 2, 102 ) having a resistor ( 7, 107 ) comprising a phase change material being changeable between a first phase and a second phase. The resistor ( 7, 107...
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7294560 |
Method of assembling one-dimensional nanostructures
A method provides a simple yet reliable technique to assemble one-dimensional nanostructures selectively in a desired pattern for device applications. The method comprises forming a plurality of...
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7259040 |
Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby
A process for manufacturing a phase change memory array, includes the steps of: forming a plurality of PCM cells, arranged in rows and columns; and forming a plurality of resistive bit lines for...
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7250729 |
Method of spark-processing silicon and resulting materials
The subject invention pertains to a method of spark processing silicon and resulting materials. The subject invention also relates to electroluminescent devices incorporating the materials produced...
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7220657 |
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device
A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The...
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7214557 |
Light receiving or light emitting modular sheet and process for producing the same
A light receiving or light emitting modular sheet having a plurality of spherical elements arranged in matrix. It is constituted only of acceptable spherical elements and photoelectric conversion...
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7205631 |
Poly-silicon stringer fuse
A polysilicon silicide stringer fuse is constructed having a narrow width by using an overlay tolerance of the photo stepper tool instead of the minimum critical dimension tolerance of the stepper...
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7195989 |
Electrochemical fabrication methods using transfer plating of masks
Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at...
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7148119 |
Process for production of semiconductor substrate
A process for producing a semiconductor substrate is provided which comprises steps of forming a porous layer on a first substrate, forming a nonporous monocrystalline semiconductor layer on the...
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7135387 |
Method of manufacturing semiconductor element
A method for stably activating pn-successive layers in a semiconductor element in a short time is disclosed. Pulsed beams, each of which has a pulse shape that is approximately rectangular, are...
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7119353 |
Electric device with phase change material and method of manufacturing the same
The electric device ( 100 ) has a body ( 102 ) having a resistor ( 107 ) comprising a phase change material being changeable between a first phase and a second phase. The resistor ( 107 ) has a...
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7075140 |
Low voltage EEPROM memory arrays
A non-volatile memory array includes memory cells connected in a common source arrangement and formed in columns of isolated well regions so that Fowler-Nordheim tunneling is used for both write...
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7074728 |
Method for crystallizing amorphous film and method for fabricating LCD by using the same
A method for crystallizing an amorphous film by using an electric field and an ultraviolet (UV) ray, and method for fabricating an LCD by using the same. The method for crystallizing an amorphous...
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7067398 |
Method of producing electronic circuit and electronic circuit
According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting...
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7037807 |
Electric field induced spin-polarized current
A device and a method for generating an electric-field-induced spin current are disclosed. A highly spin-polarized electric current is generated using a semiconductor structure and an applied...
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7022541 |
Patterned growth of single-walled carbon nanotubes from elevated wafer structures
A wafer-scale fabrication approach for manufacturing single-walled carbon nanotube (SWNT) tips is implemented. Catalyst material is selectively placed (e.g., patterned) onto a plurality of...
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7018911 |
Methods for fabrication for phase-changeable memory devices having phase-changeable material regions with lateral contacts
A phase-changeable memory device comprises a substrate and an access transistor formed in and/or on the substrate. Laterally spaced apart first and second conductive patterns are disposed on the...
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6992368 |
Production of metal insulator metal (MIM) structures using anodizing process
Metal-insulator-metal capacitor structures are formed in semiconductor substrates using an anodization procedure on deposited underlying metalization followed by deposition of the second metal and...
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6984548 |
Method of making a nonvolatile memory programmable by a heat induced chemical reaction
A nonvolatile memory cell occupying a minimum chip area is provided with a cell structure that includes two or more base materials being programmable by a heat induced chemical reaction to form a...
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6951797 |
Method relating to anodic bonding
The present invention relates to a method of bonding a first member ( 110, 210, 130, 230, 410, 430, 510, 530, 610 ) to a second silicon member ( 120, 220, 420 a, 420 b, 600 ) through anodic...
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6927082 |
Method of evaluating the quality of a contact plug fill
Defective contact plug fills can be detected by applying an etching solution, which in some embodiments preferentially etches in the <111> direction. The etching solution is some embodiments...
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6887342 |
Field-assisted fusion bonding
A method of field-assisted fusion bonding produces multiple-layer devices. Contacts ( 301, 303, 305, 307, 309 ) are placed at various points along different surfaces of a combination of two or more...
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6864110 |
Electrophoretic processes for the selective deposition of materials on a semiconducting device
The present invention provides a process and apparatus for selectively depositing materials on a semiconductor device, such as depositing phosphors or other optical materials on a light emitting...
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6838353 |
Devices having improved capacitance and methods of their fabrication
A capacitor formed by a person using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates...
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6835620 |
Method of manufacturing flash memory devices
Disclosed is a method of manufacturing flash memory devices. According to the present invention, the method comprises the steps of sequentially forming a gate oxide film, a first polysilicon film...
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6815315 |
Method for electrochemical oxidation
Disclosed is a method for the electrochemical oxidation of a semiconductor layer. In an electrochemical oxidation treatment for the production process of an electron source 10 (field-emission...
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6812117 |
Method for creating a reconfigurable nanometer-scale electronic network
The present invention includes a method for creating a reconfigurable nanometer-scale electronic network. One embodiment of the invention is made up of the following steps. The first step entails...
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6808963 |
Process for fabricating a thin-film device having inclined sides
In a process for producing a thin-film device, a conducting layer composed of an anodically oxidizable metal is formed on a substrate and is etched to form gate bus lines and gate electrode having...
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6806171 |
Method of producing a thin layer of crystalline material
A technique for forming a film of crystalline material, preferably silicon. The technique creates a sandwich structure with a weakened region at a selected depth underneath the surface. The...
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6734084 |
Method of manufacturing a semiconductor device with recesses using anodic oxide
A method for manufacturing a semiconductor device is capable of controlling amounts of protrusion of penetration electrodes ( 5 ) from a rear surface of a semiconductor substrate ( 4 ) in a easy...
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6699436 |
Apparatus for measuring contaminant mobile ions in dielectric materials
Methods and apparatus are provided for measuring contaminant mobile ions in a dielectric portion of a semiconductor. The apparatus is comprised of a heat source configured to elevate a temperature...
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6677218 |
Method for filling trenches in integrated semiconductor circuits
A method in which a recess is formed in the surface of a semiconductor substrate and a material is grown on the inner wall of the recess, includes the steps of producing an electrically insulating...
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6664123 |
Method for etching metal layer on a scale of nanometers
A method for etching a metal layer on a scale of nano meters, includes preparing a substrate on which a metal layer is formed, positioning a micro tip over the metal layer, generating an electron...
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6632699 |
Process for making a color selective Si detector array
A multiplicity of components form a photodiode array on a substrate. Each of the components consists of a transistor of the p-n-p type with the outermost p-doped layer being transformed into an...
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6617191 |
Method for anodizing silicon substrates for surface type acceleration sensors
An epitaxial growth layer, an oxide film, and a passivation film are formed on a silicon substrate. Except for an opening formed on a part of the passivation film, the upper surface of the...
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6613612 |
Fuse in semiconductor device and fabricating method thereof
The semiconductor device includes a semiconductor substrate, an insulating layer on the semiconductor substrate wherein a groove is patterned to a predetermined depth in an upper surface of the...
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6593214 |
Method of manufacturing semiconductor device
A photoresist is provided with an opening as a dummy pattern in a space area, i.e., a dummy region, other than a pattern of elements and circuits in one chip, thereby increasing the number of...
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6593213 |
Synthesis of layers, coatings or films using electrostatic fields
Systems and methods are described for synthesis of films, coatings or layers using electrostatic fields. A method includes applying an electrostatic field across a first precursor layer that is...
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6576502 |
Method for forming LDD/offset structure of thin film transistor
A method for fabricating a thin film transistor. An active layer is first formed on a substrate, then a first insulating layer is formed on the active layer. Next, a gate electrode pattern is...
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