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7629697 |
Marker structure and method for controlling alignment of layers of a multi-layered substrate
The invention includes a lithographic system having a first source for generating radiation with a first wavelength and an alignment system with a second source for generating radiation with a...
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7629230 |
Wafer processing method
A wafer processing method for dividing, along streets, a wafer having a device area where devices are formed in a plurality of areas sectioned by the plurality of streets arranged in a lattice...
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7629228 |
Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the...
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7626137 |
Laser cutting by forming a modified region within an object and generating fractures
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work,...
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7622366 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device by which a wafer with devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern in the face-side...
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7622365 |
Wafer processing including dicing
Methods for processing semiconductor wafers are described herein. One embodiment includes removing portions of a first side of the semiconductor wafer to form a number of trenches of a particular...
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7622364 |
Bond pad for wafer and package for CMOS imager
An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal...
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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7618878 |
Wafer dividing method
A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal...
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7618877 |
Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device
In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the...
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7618875 |
Marking method for product information
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a...
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7618846 |
Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
A semiconductor device has a semiconductor die with a peripheral region around the die. A first insulating material is deposited in the peripheral region. A conductive via is formed through the...
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7615469 |
Edge seal for a semiconductor device and method therefor
In one embodiment, an edge seal region of a semiconductor die is formed by forming a first dielectric layer on a surface of a semiconductor substrate near an edge of the semiconductor die and...
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7615391 |
Solar cell and method of fabricating the same
A method of fabricating a solar cell forms a large number of grooves on a first main surface of a p-type silicon single crystal substrate sliced out from a silicon single crystal ingot as described...
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7612419 |
Wafer, semiconductor chip, and semiconductor device
Scribe lines demarcating semiconductor chips comprise, in both the vertical direction and the horizontal direction, first-type scribe lines of the minimum width enabling cutting by dicing or other...
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7611967 |
Wafer sawing method
A wafer sawing method for sawing a wafer by using a cutting tool is provided. Sawing paths are formed on a surface of the wafer. In the wafer sawing method, a carrier on which strip-shaped...
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7608525 |
Method for manufacturing nitride semiconductor substrate
A method for manufacturing a nitride semiconductor substrate comprises the steps of: growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a...
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7608523 |
Wafer processing method and adhesive tape used in the wafer processing method
A method of processing a wafer having a plurality of streets formed on the front surface in a lattice pattern and a plurality of devices formed in a plurality of areas sectioned by the plurality of...
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7608468 |
Apparatus and methods for determining overlay and uses of same
Disclosed are techniques and apparatus are provided for determining overlay error or pattern placement error (PPE) across the field of a scanner which is used to pattern a sample, such as a...
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7605057 |
Semiconductor device and manufacturing method thereof
A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into...
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7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
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7605016 |
CMOS image sensor and method of manufacturing the same
Disclosed are a CMOS sensor and a method of fabricating the CMOS sensor. The method includes the steps of: forming a first USG layer on an entire surface of a semiconductor substrate including a...
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7602072 |
Substrate having alignment marks and method of obtaining alignment information using the same
The alignment marks formed in a scribe line of a semiconductor substrate include at least one main mark, a first sub-mark and second sub-marks. The first sub-mark is formed at a central portion of...
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7601616 |
Wafer laser processing method
A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices...
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7601605 |
Method for manufacturing semiconductor device, method for forming alignment mark, and semiconductor device
A method for manufacturing a semiconductor device includes the steps of: forming a first dielectric film on a substrate; etching the first dielectric film in a plug forming region to form a first...
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7598157 |
Wafer dicing method
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed...
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7598156 |
Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
A method of manufacturing a device, including: an adhesive film attaching step of attaching an adhesive film to a back-side surface of a wafer in which devices are formed respectively in a...
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7598155 |
Method of manufacturing an overlay mark
A method of manufacturing an overlay mark is provided. Two first X-direction isolation structures, two first Y-direction isolation structures, two second X-direction isolation structures, and two...
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7598154 |
Manufacturing method of semiconductor device
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped...
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7595258 |
Overlay vernier of semiconductor device and method of manufacturing the same
After a mother vernier pattern is formed in a scribe region of a semiconductor substrate, a child vernier pad is formed on the inner region of a mother vernier, and a child vernier is formed on the...
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7592636 |
Radiation-emitting semiconductor component and method for the production thereof
A radiation-emitting semiconductor component having a radiation-transmissive substrate ( 1 ), on the underside of which a radiation-generating layer ( 2 ) is arranged, in which the substrate ( 1 )...
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7592237 |
Laser processing method and object to be processed
A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at...
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7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form...
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7588993 |
Alignment for backside illumination sensor
An apparatus and manufacturing method thereof, wherein an integrated circuit is located in a first region of a substrate having first and second opposing major surfaces, and wherein an alignment...
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7585751 |
Wafer dividing method using laser beam with an annular spot
In a wafer dividing method of dividing a wafer into individual devices, the wafer being sectioned by streets to form the devices each made of a laminated body in which an insulating film and a...
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7585750 |
Semiconductor package having through-hole via on saw streets formed with partial saw
A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer with many die having contact pads disposed on each die. The semiconductor wafer has saw street...
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7583834 |
Laser etched fiducials in roll-roll display
The present invention relates to a method of aligning comprising providing a support, applying a transparent layer, patterning at least the transparent layer to produce a pattern and an alignment...
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7582899 |
Semiconductor device having overlay measurement mark and method of fabricating the same
There are provided a semiconductor device having an overlay measurement mark, and a method of fabricating the same. The semiconductor device includes a scribe line region disposed on a...
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7582546 |
Device with damaged breakdown layer
A device utilizing a breakdown layer in combination with a programmable resistance material, a phase-change material or a threshold switching material. The breakdown layer having damage.
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7582541 |
Wafer laser processing method
A wafer laser processing method for forming a groove along streets in a wafer by moving the wafer at a predetermined feed rate while a laser beam whose focal spot is elliptic is applied along the...
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7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a...
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7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
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7575954 |
Ceramic substrate and method of breaking same
A ceramic substrate ( 100 ) includes a top surface, a plurality of identification marks ( 104 ), a protective compound ( 110 ), a bottom surface, and a plurality of grooves ( 106 ). The top surface...
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7569840 |
Alignment method of a laser beam processing machine
An alignment method of a laser beam processing machine comprising a chuck table, a laser beam application means having a condenser for applying a laser beam to the workpiece held on the chuck...
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7569427 |
Semiconductor component with connecting elements and method for producing the same
A semiconductor component with connecting elements between a semiconductor chip made from a semiconductor wafer with discrete semiconductor components and a superordinate circuit carrier is...
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7569421 |
Through-hole via on saw streets
A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide...
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7566638 |
Method of dicing a semiconductor device into plural chips
A semiconductor device includes a substrate, a seal layer which seals a semiconductor element formed on the substrate, wherein a side surface of the seal layer is positioned inside of a side...
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7566637 |
Method of inhibition of metal diffusion arising from laser dicing
Method of inhibiting metal diffusion arising from laser dicing is provided. The method includes dividing a wafer into at least one chip. The chip includes internal metallic features. The dividing...
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7566636 |
Method of scribing stuck mother substrate and method of dividing stuck mother substrate
There is provided a method of scribing a stuck mother substrate for obtaining a plurality of stuck substrates formed by sticking a first square substrate and a second square substrate together so...
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7566635 |
Substrate dividing method
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
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