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9040389 Singulation processes  
In one embodiment, a method of forming a semiconductor device comprises forming a groove on and/or over a first side of a substrate. A dicing layer is formed from a second side of the substrate...
9034733 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the...
9034732 Semiconductor-on-insulator with back side support layer  
Embodiments of the present invention provide for the provisioning of efficient support to semiconductor-on-insulator (SOI) structures. Embodiments of the present invention may additionally provide...
9034731 Integrated, integrated circuit singulation system  
An integrated, integrated circuit singulation system is provided including scribing a substrate using mechanical cutting or a plurality of passes of laser cutting, and dicing the substrate using...
9012304 Semiconductor die singulation method  
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of...
9006088 Method for forming semiconductor gate structure and semiconductor gate structure  
A method for forming a semiconductor gate structure and a semiconductor gate structure are provided. The method includes: providing a substrate with a Ge layer as a surface thereof; forming a Sn...
9006798 Semiconductor device including trench transistor cell array and manufacturing method  
A semiconductor device includes a trench transistor cell array in a silicon semiconductor body with a first main surface and a second main surface opposite to the first main surface. A main...
8999812 Graphene devices and methods of manufacturing the same  
A graphene device may include a channel layer including graphene, a first electrode and second electrode on a first region and second region of the channel layer, respectively, and a capping layer...
8999818 Semiconductor device and method of manufacturing semiconductor device  
A semiconductor element is formed on a first surface of the substrate. A resin layer is formed over a second surface of the substrate which is opposite to the first surface of the substrate and on...
8999816 Pre-patterned dry laminate mask for wafer dicing processes  
Approaches for protecting a wafer during plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer with a front surface having a plurality of...
8993412 Method for reducing backside die damage during die separation process  
In one aspect of the present invention, a method of sawing a semiconductor wafer will be described. A semiconductor wafer is positioned in a wafer sawing apparatus that includes a sawing blade and...
8993413 Method of manufacturing semiconductor device  
A method of manufacturing a semiconductor device includes the steps of preparing a semiconductor wafer having a thick portion in an outer circumferential end portion and a thin portion in a...
8987734 Semiconductor wafer, semiconductor process and semiconductor package  
The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of...
8980727 Substrate patterning using hybrid laser scribing and plasma etching processing schemes  
Approaches for patterning semiconductor or other wafers and dies are described. For example, a method of patterning features within a substrate involves forming a mask layer above a surface of a...
8980764 Method and apparatus for plasma dicing a semi-conductor wafer  
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the...
8975161 Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method  
A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is...
8969175 Method for producing singulated semiconductor devices  
A method for producing singulated semiconductor components includes providing a starting substrate. An etching process is carried out to form depressions at a side of the starting substrate. The...
8962452 Semiconductor die singulation apparatus and method  
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of...
8962363 Method for forming a groove on a surface of flat plate formed of a nitride semiconductor crystal  
Provided is a novel method for forming a groove composed of two smooth inclined surfaces on a surface of a flat plate formed of a nitride semiconductor crystal having an A, C, M-axes. In the...
8956954 Method of processing wafers for saving material and protecting environment  
A method of processing wafers for saving material and protecting environment is implemented to collect defective or incomplete wafers and perform cutting operation to create a plurality of...
8956955 Manufacturing method of semiconductor device and semiconductor device  
A method to prevent contamination of the principal surface side in a process of grinding the back surface side of a semiconductor wafer. At an intersection of a scribe region of a semiconductor...
8956951 Method for manufacturing SOI wafer  
A method for manufacturing an SOI wafer includes performing a flattening heat treatment on an SOI wafer under an atmosphere containing an argon gas, in which conditions of SOI wafer preparation...
8952519 Chip package and fabrication method thereof  
A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate, having a first surface and an opposing second surface. A spacer is disposed under...
8946056 Splitting method for optical device wafer  
In a splitting method for an optical device wafer, the wafer having optical devices formed individually in regions partitioned by a plurality of crossing scheduled splitting lines provided on a...
8945963 Optical device processing method  
An optical device processing method including: a groove forming step of forming a plurality of grooves on a front side of a sapphire substrate; a film forming step of forming an epitaxial film on...
8946055 Laser processing method for cutting substrate and laminate part bonded to the substrate  
A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a...
8940636 Through hole vias at saw streets including protrusions or recesses for interconnection  
A semiconductor package includes a semiconductor wafer having a plurality of semiconductor die. A contact pad is formed over and electrically connected to an active surface of the semiconductor...
8940618 Method and device for cutting semiconductor wafers  
A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the...
8921227 Semiconductor device assembly and semiconductor device and method of manufacturing the same  
A method of manufacturing, at a reduced cost, a semiconductor device assembly and a semiconductor device, having a conductive support which is not eroded by an etchant for a lift-off layer even...
8921204 Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses  
A method for fabricating semiconductor dice includes the steps of providing a wafer assembly having a substrate and semiconductor structures on the substrate; and defining the semiconductor dice...
8916456 Group III-V substrate material with particular crystallographic features  
A substrate including a body comprising a Group III-V material and having an upper surface, the body comprising an offcut angle defined between the upper surface and a crystallographic reference...
8916452 Semiconductor device and method of forming WLCSP using wafer sections containing multiple die  
A semiconductor wafer contains semiconductor die separated by saw streets. The semiconductor wafer is singulated through a portion of the saw streets to form wafer sections each having multiple...
8916453 Method for manufacturing an electronic component  
A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is diced along dicing streets to...
8912048 Method of fabricating semiconductor device including a substrate attached to a carrier  
A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of...
8912077 Hybrid laser and plasma etch wafer dicing using substrate carrier  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask composed of a...
8912025 Method for manufacture of bright GaN LEDs using a selective removal process  
A method of fabricating LED devices includes using a laser to form trenches between the LEDs and then using a chemical solution to remove slag creating by the laser.
8912075 Wafer edge warp supression for thin wafer supported by tape frame  
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of reducing edge warping in a supported...
8912078 Dicing wafers having solder bumps on wafer backside  
Approaches for hybrid laser scribe and plasma etch dicing process for a wafer having backside solder bumps are described. For example, a method of dicing a semiconductor wafer having integrated...
8906782 Method of separating semiconductor die using material modification  
A method for separating semiconductor die includes forming a porous region on a semiconductor wafer and separating the die at the porous region using mechanical or other means.
8895345 Dicing methods  
The present invention provides a dicing method that achieves excellent dicing properties at low costs by removing a metal film through a metal processing operation with a diamond tool and then...
8895357 Integrated circuit and method of manufacturing the same  
Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a...
8895408 Semiconductor device  
A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip...
8895363 Die preparation for wafer-level chip scale package (WLCSP)  
Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) device from a wafer substrate, the method comprises grinding the back-side of the...
8889526 Apparatus for thinning, testing and singulating a semiconductor wafer  
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator...
8889525 Substrate dividing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8883614 Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, approaches for wafer dicing with wide kerf by using a laser scribing and...
8883701 Method for wafer dicing and composition useful thereof  
A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed...
8877610 Method of patterning a substrate  
In various embodiments, a method of patterning a substrate may include: forming an auxiliary layer on or above a substrate and forming a plasma etch mask layer on or above the auxiliary layer,...
8879596 Semiconductor laser  
A semiconductor laser includes a semiconductor body having an active region that generates radiation and a ridge-shaped region, wherein the ridge-shaped region has a longitudinal axis running...
8877611 Devices with crack stops  
An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a...