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7413927 Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages  
An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a...
7410831 Method and device for dividing plate-like member  
In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like...
7402503 Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus  
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are...
7402502 Method of manufacturing a semiconductor device by using a matrix frame  
A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the...
7399698 Semiconductor device and method of manufacturing the same  
A method of manufacturing a semiconductor device includes: forming a first pad including a first metal and an inter-connection line including the first metal in a scribe lane region; forming a...
7399682 Wafer processing method  
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7393760 Method for dicing glass substrate  
A method for dicing a sheet workpiece includes the following steps. A base ( 10 ) is provided. A water-soluble adhesive ( 20 ) is coated onto the base, and the workpiece is placed on the...
7393758 Wafer level packaging process  
Wafer level packaging process for packaging MEMS or other devices. In some embodiments, a MEMS wafer with normal thickness is firstly bonded to a cap wafer of normal thickness, followed by a...
7393757 Method for separating semiconductor wafer from supporting member, and apparatus using the same  
A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness...
7392732 Scribing tool and method  
A scribing tool for use in semiconductor scribing apparatus includes a rotatable semiconductor wafer scribing wheel engageable with the semiconductor wafer to form a scribe line when the tool...
7387949 Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus  
A semiconductor device includes a semiconductor element, a penetrating electrode which penetrates the semiconductor element, and a resin layer which selectively covers side walls and corners of the...
7387948 Structure and method of forming a semiconductor material wafer  
A structure and method of forming a semiconductor material wafer comprising forming an ingot of semiconductor material. A first dielectric layer is formed on the surface of the ingot, and the...
7384817 Method of assembling semiconductor devices with LEDs  
Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor...
7384811 Method of separating semiconductor wafer, and separating apparatus using the same  
With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting...
7381285 Manufacturing method of a device  
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered...
7378290 Isolation circuit  
An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is...
7375009 Method of forming a conductive via through a wafer  
Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least...
7375007 Method of manufacturing a semiconductor device  
To provide a penetration electrode having high quality. A method of manufacturing a semiconductor device includes the following steps: (a) forming a concave part from a first face of a...
7374970 Manufacturing method of a tray, a socket for inspection, and a semiconductor device  
The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base...
7371664 Process for wafer thinning  
The present invention relates to a process for thinning a semiconductor wafer. Two surfaces of the wafer separately form a surface-bond glue (layer) and a surface protective glue (layer). The...
7371663 Three dimensional IC device and alignment methods of IC device substrates  
Alignment methods of IC device substrates. A first IC device substrate has a first front side for defining a plurality of first IC features, a first backside opposite the first front side, and a...
7371612 Method of fabrication of stacked semiconductor devices  
A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective...
7368321 Semiconductor package and method for manufacturing the same  
A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the...
7364983 Method and apparatus for creating RFID devices  
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed...
7358158 Wafer machining adhesive tape, and its manufacturing method and using method  
An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in...
7358157 Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby  
A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having...
7358153 Method for cutting junction board, and chip  
A junction board cutting method includes, upon cutting a junction board formed by bonding a second main surface of a first substrate having a first main surface provided with chip areas and scribe...
7357694 Jet singulation  
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to...
7354801 Method for manufacturing semiconductor device  
In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit...
7352071 Method of fabricating anti-warp package  
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is...
7350446 Wafer dividing apparatus  
A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to...
7348275 Processing method for semiconductor wafer  
A processing method for a semiconductor wafer which is generally circular, and which has on the face thereof an annular surplus region present in an outer peripheral edge portion of the face, and a...
7348263 Manufacturing method for electronic component, electronic component, and electronic equipment  
A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing...
7341926 Wafer dividing method  
A method of dividing a wafer having a plurality of first dividing lines and a plurality of second dividing lines perpendicular to the plurality of first dividing lines formed on the front surface,...
7335578 Method for manufacturing semiconductor chip  
A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive...
7335530 Freeform substrates and devices  
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but...
7332414 Chemical die singulation technique  
A method is provided for manufacturing a semiconductor device from a substrate ( 200 ) having an active surface ( 204 ) and a non-active surface ( 206 ). The method comprises depositing a backing...
7332373 Method of manufacturing semiconductor device  
The present invention provides a method of manufacturing semiconductor device. The method includes providing a semiconductor wafer having a main surface; defining a chip forming region which...
7326590 Method for manufacturing ball grid array package  
A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower...
7323397 Method and apparatus of fabricating a semiconductor device by back grinding and dicing  
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front...
7316965 Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level  
A MEMS device ( 100 ) is provided that includes a handle layer ( 108 ) having a sidewall ( 138 ), a cap ( 132 ) overlying said handle layer ( 108 ), said cap ( 132 ) having a sidewall ( 138 ), and...
7314782 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method  
The invention relates to a method of manufacturing a semiconductor device ( 10 ) in which, in a semiconductor body ( 1 ) with a temporary substrate ( 2 ), at least one semiconductor element ( 3 )...
7312107 Semiconductor device and manufacturing method thereof  
A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a...
7306975 Semiconductor wafer cutting blade and method  
The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device...
7303977 Laser micromachining method  
A laser micromachining method is disclosed wherein a workpiece is milled using an incident beam from a laser beam focused above the surface of the workpiece. The incident beam is guided by a plasma...
7303976 Wafer bonding method  
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a...
7297624 Semiconductor device and method for fabricating the same  
A method for fabricating a semiconductor device including forming a depression in a front surface of a semiconductor substrate, forming an electrode pad within the depression, forming structures...
7294559 Wafer dicing process for optical electronic packing  
A wafer dicing process for optical electronic packing is provided. The process includes: providing a first wafer (glass wafer) and a second wafer (interposer wafer); etching the second wafer to...
7294531 Wafer level chip stack method  
Provided is a method by which differently-sized chips may be stacked at the wafer level. The wafer level chip stack method utilizes first and second wafer assemblies that support first and second...
Matches 1 - 50 out of 799 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >