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7968974 Scribe seal connection  
A feedthrough in an IC scribe seal is disclosed. The feedthrough is structured to maintain isolation of components in the IC from mechanical damage and chemical impurities introduced during...
7968470 Plasma nitriding method, method for manufacturing semiconductor device and plasma processing apparatus  
A nitriding process is performed at a process temperature of 500° C. or more by causing microwave-excited high-density plasma of a nitrogen-containing gas to act on silicon in the surface of a...
7968430 Compound semiconductor device and method for manufacturing same  
A compound semiconductor device includes a laminated body including a crystal substrate and a compound semiconductor multilayer film. The laminated body has a major surface, a first side face, a...
7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same  
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of...
7968378 Electronic device  
One embodiment provides a method of manufacturing semiconductor devices. For example, a sawn and expanded wafer is utilized having dielectrical material deposited between the diced and deposited...
7968428 Fabrication method of semiconductor circuit device  
When a semiconductor wafer is formed to be thin, steps need to be taken to prevent warping of the wafer. For this purpose, a protective tape is affixed to a surface of the semiconductor wafer, and...
7964476 Method and apparatus for the laser scribing of ultra lightweight semiconductor devices  
A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is...
7960247 Die thinning processes and structures  
Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or...
7955951 LED-laser lift-off method  
The present invention discloses an LED-laser lift-off method, which applies to lift off a transient substrate from an epitaxial layer grown on the transient substrate after a support substrate...
7955952 Crackstop structures and methods of making same  
An integrated circuit chip and a method of fabricating an integrated circuit chip. The integrated circuit chip includes: a continuous first stress ring proximate to a perimeter of the integrated...
7955885 Methods of forming packaged micro-electromechanical devices  
Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first...
7955955 Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures  
A semiconductor product comprises a semiconductor substrate having a top surface and a bottom surface including a semiconductor chip. The semiconductor substrate has a top surface and a perimeter....
7955893 Wafer level chip scale package and process of manufacture  
Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of...
7951300 Water-scale needle array  
Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape...
7947574 Laser processing method and semiconductor chip  
A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a...
7943490 Method of cutting PCBS  
The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined...
7943489 Bonded wafer assembly system and method  
A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a...
7943488 Transfer method of functional region, LED array, LED printer head, and LED printer  
A method includes placing a first bonding layer on at least one of a first functional region bonded on a release layer with a light releasable adhesive layer on a first substrate, and a transfer...
7943426 Package structure for integrated circuit device and method of the same  
The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit...
7939429 Nitride semiconductor device and method of manufacturing the same  
A method of manufacturing a nitride semiconductor device includes the steps of: forming a division guide groove by applying a laser beam having a wavelength and energy density causing multiphoton...
7939354 Method of fabricating nitride semiconductor laser  
A method of fabricating a nitride semiconductor laser comprises preparing a substrate having a plurality of marker structures and a crystalline mass made of a hexagonal gallium nitride...
7939374 Supply mechanism for the chuck of an integrated circuit dicing device  
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits...
7927927 Semiconductor package and method therefor  
A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an...
7927974 Method of forming a modified layer in a substrate  
First, mapping data storing interrupted areas is obtained. In a first modified-layer forming step, before a stacked article is stacked on a front surface of a substrate, a laser beam is directed...
7923350 Method of manufacturing a semiconductor device including etching to etch stop regions  
A method of manufacturing a semiconductor device. The method includes providing a wafer having a first face and a second face opposite the first face, selectively doping the wafer via the first...
7923349 Wafer level surface passivation of stackable integrated circuit chips  
An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative...
7923297 Manufacturing method of semiconductor device  
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped...
7919395 Method for separating wafer using two laser beams  
A wafer separating method including a laminated member removing step for partially removing a laminated member of a wafer along streets by applying a laser beam to the wafer along the streets, and...
7915142 Wafer processing method  
A wafer processing method for dividing a wafer into individual devices along streets. The wafer processing method includes the steps of forming a division groove on the front side of the wafer...
7915467 Semiconductor wafer and semiconductor device  
Disclosed is a semiconductor wafer which is characterized in that a resin layer composed of a resin composition containing a cyclic olefin resin (A) having an epoxy group and a photoacid generator...
7915082 Semiconductor device  
A method of fabricating a semiconductor device includes depositing a mask of low melting point material on a surface of the semiconductor device; depositing a layer to be structured relative to...
7910385 Method of fabricating microelectronic devices  
Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic...
7906410 Method of manufacturing semiconductor chip using laser light and plasma dicing  
In a method in which a semiconductor wafer 1 having integrated circuits 3 formed in a plurality of chip regions and test patterns 4 formed in scribe lines 2a is divided by a plasma etching process...
7902636 Semiconductor chip including a substrate and multilayer part  
A semiconductor device is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a...
7904855 Methods for partially removing circuit patterns from a multi-project wafer  
Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without...
7897486 Semiconductor wafer coat layers and methods therefor  
Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a...
7897488 Dividing method for wafer having film on the front side thereof  
A wafer dividing method for dividing a wafer having a film on the front side thereof. The wafer dividing method includes a modified layer forming step of applying a laser beam having a...
7892949 Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region  
To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width direction of the cutting region, and a...
7886798 Expanding method and expanding device  
An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between...
7888776 Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss  
One embodiment of the present invention relates to a scribe seal integrity detector. In this embodiment a scribe seal integrity detector is formed in an integrated circuit chip die. The scribe...
7887665 Expanding method and expanding device  
An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between...
7888238 Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes  
A wafer process material is prepared which has a plurality of semiconductor formation regions of different planar sizes, each including a low dielectric constant film/wiring line stack structure...
7888141 Manufacturing method for semiconductor integrated device  
In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the...
7888237 Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer  
A method of cutting a semiconductor wafer includes preparing a semiconductor wafer including a scribe region and a chip region, forming a groove in the scribe region, loading the semiconductor...
7888236 Semiconductor device and fabrication methods thereof  
A method for packaging a semiconductor device disclosed. A substrate comprising a plurality of dies, separated by scribe line areas respectively is provided, wherein at least one layer is...
7880763 Semiconductor device and manufacturing method therefor  
A semiconductor device is obtained, in which excellent characteristics are achieved, the reliability is improved, and an SiC wafer can also be used for the fabrication. A plurality of...
7879685 System and method for creating electric isolation between layers comprising solar cells  
Methods for forming a patterned layer from common layer in a photovoltaic application are provided. The patterned layer is configured to form one or more portions of one or more solar cells on a...
7880615 Electronic device manufacturing system and electronic device manufacturing method  
A tag manufacturing system includes an antenna forming apparatus which forms multiple antennas in such a way that the antennas are formed in a point-symmetrical arrangement including antenna...
7880193 Method for forming an integral electromagnetic radiation shield in an electronic package  
A method and system for fabricating an integral electromagnetic radiation shield for an electronic package is disclosed. Various embodiments include exposing a portion of at least one ground...
7875501 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure  
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a...