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8058150 Particle free wafer separation  
A method for singulating semiconductor wafers is disclosed. A preferred embodiment comprises forming scrub lines on one side of the wafer and filling the scrub lines with a temporary fill...
8053335 Forming method of gallium nitride system compound semiconductor layer, transfer method of the same, and substrate structure with the same bonded thereto  
A method includes forming a first layer containing silicon oxide on a first substrate, partially removing the first layer to form an exposure portion on the first substrate, depositing amorphous...
8053279 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces  
Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic...
8048717 Method and system for bonding 3D semiconductor devices  
A method and system and for fabricating 3D (three-dimensional) SIC (stacked integrated chip) semiconductor devices. The system includes a vacuum chamber, a vacuum-environment treatment chamber,...
8048768 Joined wafer, fabrication method thereof, and fabrication method of semiconductor devices  
A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer...
8048774 Methods and systems for laser machining a substrate  
A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is...
8048777 Method for manufacturing semiconductor device  
An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate,...
8043895 Method of fabricating stacked assembly including plurality of stacked microelectronic elements  
A method is provided for fabricating a stacked microelectronic assembly by steps including stacking and joining first and second like microelectronic substrates, each including a plurality of like...
8043940 Method for manufacturing semiconductor chip and semiconductor device  
An improved yield of chips is realized by reducing the width of dicing streets on the front surface side of a semiconductor wafer. A method for semiconductor chip, divided a semiconductor wafer 10...
8039367 Scribe line structure and method for dicing a wafer  
A scribe line structure is disclosed. The scribe line structure includes a semiconductor substrate having a die region, a die seal ring region, disposed outside the die region, a scribe line...
8039364 Manufacturing method of semiconductor device  
An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive...
8039360 Method of assembling integrated circuit components  
The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the...
8039363 Small chips with fan-out leads  
A method of expanding the contact pitch for un-diced chips in an array by pre-slicing the array in a first direction, attaching a lead frame to the chips' contacts, and then slicing the array and...
8030179 Semiconductor device and method of manufacturing the same  
The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is...
8026181 Manufacturing method for semiconductor chips  
By performing plasma etching on the second surface of a semiconductor wafer on the first surface of which an insulating film is placed in dividing regions and on the second surface of which a mask...
8021964 Method of producing segmented chips  
To provide a method of producing segmented chips preventing the chips from being damaged by the chip jumping or by the contact of the neighboring chips while the back surfaces thereof are being...
8021923 Semiconductor package having through-hole vias on saw streets formed with partial saw  
A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die. The...
8021965 Inter-chip communication  
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and...
8021712 Wafer and manufacturing method of electronic component  
The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer...
8017521 Semiconductor package having through-hole vias on saw streets formed with partial saw  
A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer having a plurality of die. A trench is formed between the semiconductor die. The trench...
8018065 Wafer-level integrated circuit package with top and bottom side electrical connections  
A wafer-level, batch processed, die-sized integrated circuit (IC) package with both top and bottom side electrical connections is disclosed. In one aspect, a number of bonding wires can be...
8017501 Semiconductor package having through-hole vias on saw streets formed with partial saw  
A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die. The...
8017502 Wafer system with partial cuts  
A wafer system is provided including providing a wafer having a topside and a backside, forming a partial cut from the topside of the wafer within a wafer rim and thinning the wafer from the...
8011546 Scribing and breaking apparatus and system therefor  
A separation apparatus comprising a first and a second scribing portions for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined...
8012856 Method of producing semiconductor components  
A method is provided for producing a semiconductor component (1) comprising at least one semiconductor body (2) and one connection carrier region (5). A semiconductor layer sequence (20) with an...
8012857 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.
8011513 Semiconductor workpiece carriers and methods for processing semiconductor workpieces  
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support...
8012806 Multi-directional trenching of a die in manufacturing superjunction devices  
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least...
8012805 Manufacturing method for semiconductor chips, and semiconductor chip  
In a manufacturing method for performing plasma etching on a second surface of a semiconductor wafer that has a first surface where an insulating film is placed in dividing regions and the second...
8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer  
Nitride semiconductor wafers which are produced by epitaxially grown nitride films on a foreign undersubstrate in vapor phase have strong inner stress due to misfit between the nitride and the...
8003495 Manufacturing method for semiconductor integrated device  
In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the...
7998839 Semiconductor device and method for manufacturing the same  
A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor...
7998793 Light illumination during wafer dicing to prevent aluminum corrosion  
Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a...
7998763 Method for manufacturing semiconductor apparatus and mold assembly for the same  
A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating...
7998837 Method for fabricating semiconductor device using spacer patterning technique  
A method for fabricating a semiconductor device using optical proximity correction to form high integrated cell patterns that are less prone to bridge defects. The method includes: obtaining a...
7998838 Method and apparatus for scribing a line in a thin film using a series of laser pulses  
A series of laser pulses in a pulse train, each pulse with a predetermined temporal power shape, scribes a line in a thin film of material on a substrate. The predetermined temporal pulse shape...
7998840 Wafer laser processing method and apparatus  
A wafer laser processing method for forming deteriorated layers in the inside of a wafer having a device area and a peripheral excess area surrounding the device area, the surface of the device...
7994026 Plasma dicing apparatus and method of manufacturing semiconductor chips  
A plasma dicing apparatus in which a semiconductor wafer with a protective sheet stuck thereonto covering the entire circuit-forming surface and with an etching-resistant mask member stuck on the...
7994024 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Object cutting method
 
An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of...
7994025 Wafer processing method without occurrence of damage to device area  
A wafer processing method of processing a wafer having on a front surface a device area where a plurality of devices are formed by being sectioned by predetermined dividing lines, and an outer...
7989318 Method for stacking semiconductor dies  
A system and method for stacking semiconductor dies is disclosed. A preferred embodiment comprises forming through-silicon vias through the wafer, protecting a rim edge of the wafer, and then...
7989321 Semiconductor device gate structure including a gettering layer  
A method is provided that allows for maintaining a desired equivalent oxide thickness (EOT) by reducing the thickness of an interfacial layer in a gate structure. An interfacial layer is formed on...
7989313 Method and apparatus for creating RFID devices  
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed...
7989319 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.
7985661 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.
7981727 Electronic device wafer level scale packages and fabrication methods thereof  
Electronic device wafer level scale packages and fabrication methods thereof. A semiconductor wafer with a plurality of electronic devices formed thereon is provided. The semiconductor wafer is...
7981770 Wafer machining method for preparing a wafer for dicing  
A wafer working method which is capable of feeding a wafer diced by a laser dicing apparatus to a subsequent step without breaking the wafer. The wafer working method involves: a first machining...
7981723 Capped wafer method and apparatus  
A capped wafer includes a device wafer and an opposing cap wafer with an annular glass frit disposed between the device wafer and the cap wafer. The glass frit and the opposing wafers define a...
7977232 Semiconductor wafer including cracking stopper structure and method of forming the same  
A semiconductor wafer may include, but is not limited to, the following elements. A semiconductor substrate has a device region and a dicing region. A stack of inter-layer insulators may extend...
7972902 Method of manufacturing a wafer including providing electrical conductors isolated from circuitry  
Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip...