Match Document Document Title
8329496 Dithered scanned laser beam for scribing solar cell structures  
Provided herein are methods of scribing a solar cell structure to create isolated solar cells. The methods involve scanning and high frequency dithering of a laser beam across a solar cell...
8329560 Laser processing apparatus and method using beam split  
Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus...
8329561 Method of producing semiconductor device  
A method of producing a semiconductor device includes: a dicing step of dicing a wafer member using a dicing blade to form a cut portion in the wafer member, in which the wafer member is formed of...
8329600 Method and system for high-speed precise laser trimming and scan lens for use therein  
A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a...
8329558 Wafer processing method  
A processing method for a wafer having a device area where a plurality of devices are formed on the front side of the wafer and a peripheral marginal area surrounding the device area. The...
8324081 Wafer level surface passivation of stackable integrated circuit chips  
An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative...
8324082 Method for fabricating conductive substrates for electronic and optoelectronic devices  
A method for fabricating a conductive substrate for an electronic device includes the steps of providing a semiconductor substrate; forming a plurality of grooves part way through the...
8324077 Semiconductor device and manufacturing method thereof  
To provide a structure and a manufacturing method for efficiently forming a transistor to which tensile strain is preferably applied and a transistor to which compressive strain is preferably...
8324714 Semiconductor device and method for making the same  
A semiconductor device includes a semiconductor substrate having a main surface in which a semiconductor element region where a plurality of functional elements are formed is formed; a multilevel...
8314013 Semiconductor chip manufacturing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8309454 Structure for electrostatic discharge in embedded wafer level packages  
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises...
8310032 Wafer and method of manufacturing semiconductor device  
In a wafer, a first chip region and a second chip region are separated from each other by a dicing region. The dicing region includes: a first center region; a first intermediate region located on...
8309403 Method for encapsulating electronic components on a wafer  
A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an...
8304325 Substrate dividing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8304326 Edge seal for a semiconductor device and method therefor  
In one embodiment, an edge seal region of a semiconductor die is formed by forming a first dielectric layer on a surface of a semiconductor substrate near an edge of the semiconductor die and...
8298919 Manufacturing method of semiconductor device and semiconductor device  
A method to prevent contamination of the principal surface side in a process of grinding the back surface side of a semiconductor wafer. At an intersection of a scribe region of a semiconductor...
8298963 Semiconductor device and manufacturing method of the same  
With a recent shrinking semiconductor process, insulating layers formed between interconnect layers are becoming thin. To avoid parasitic capacitance between them, materials of a low dielectric...
8299580 Semiconductor wafer and a method of separating the same  
A semiconductor wafer includes a plurality of predetermined separation lines extending from an upper surface to a bottom surface; and a semiconductor substrate including a plurality of chip...
8295767 Method of manufacturing a microradio  
A microradio is provided with a hysteretic switch to permit an optimum range increasing charging cycle, with the charging cycle being long relative to the transmit cycle. Secondly, an ensemble of...
8294254 Chip scale surface mounted semiconductor device package and process of manufacture  
A semiconductor device package die and method of manufacture are disclosed. The device package die may comprise a device substrate having one or more front electrodes located on a front surface of...
8293652 Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method  
To provide a substrate processing method and a semiconductor chip manufacturing method that enable low-cost formation of a mask for etching using plasma etching. During formation of a mask used in...
8278190 Methods of forming light-emitting structures  
Methods of forming light-emitting structures, as well as related devices and/or systems are described. In some cases, the methods utilize a layer transfer and/or layer separation step(s) used to...
8278186 Wafer cleaning method and wafer bonding method using the same  
The present invention relates to a wafer cleaning and a wafer bonding method using the same that can improve a yield of cleaning process and bonding property in bonding the cleaned wafer by...
8278191 Methods and systems for metal-assisted chemical etching of substrates  
Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for...
8274165 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same  
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a...
8273604 Semiconductor device and method of forming WLCSP structure using protruded MLP  
A semiconductor device can include a carrier substrate, and a first semiconductor die disposed on a surface of the carrier substrate. An encapsulant can be disposed over the first semiconductor...
8268704 Method for dicing substrate  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8268643 Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate  
The present invention provides a substrate formed at a low cost and having a controlled plate shape, an epitaxial layer provided substrate obtained by forming an epitaxial layer on the substrate,...
8263479 Method for cutting semiconductor substrate  
Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the...
8258044 Method for fabricating chip elements provided with wire insertion grooves  
The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film...
8258010 Making a semiconductor device having conductive through organic vias  
A plurality of semiconductor die is mounted to a carrier separated by a peripheral region. An insulating material is deposited in the peripheral region. A first opening is formed in the insulating...
8252662 Method and structure for manufacture of light emitting diode devices using bulk GaN  
A method for manufacturing a plurality light emitting diodes includes providing a gallium nitride containing bulk crystalline substrate material configured in a non-polar or semi-polar...
8247311 Laser processing method  
A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming...
8247773 Method and apparatus for reading identification mark on surface of wafer  
An identification mark constituted of irregularities is formed on the surface of a wafer, which is sealed with a resin layer and a dicing tape may be adhered to the backside. Multiple infrared...
8241960 Semiconductor device manufacturing equipment and semiconductor device manufacturing method  
Semiconductor device manufacturing equipment in which in the process of dividing a substrate into individual semiconductor devices using a dicing blade, the possibility of an odd piece flying off...
8236611 Die singulation method and package formed thereby  
A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the...
8232184 Method for manufacturing silicon carbide semiconductor device and the silicon carbide semiconductor device  
Silicon carbide semiconductor device includes trench, in which connecting trench section is connected to straight trench section. Straight trench section includes first straight trench and second...
8227700 Chip having side protection terminal and package using the chip  
A chip includes a chip body having an upper surface on which an active surface is formed, and at least one side protrusion terminal protruding from a lateral surface of the chip body and...
8227276 Manufacture of light emitting devices with phosphor wavelength conversion  
A method of manufacturing a light emitting device comprises: depositing over substantially the entire surface of a LED wafer having a array of LEDs formed on a surface thereof a mixture of at...
8227269 Manufacture of light emitting devices with phosphor wavelength conversion  
A method of manufacturing a light emitting device comprises: a) depositing over substantially the entire surface of a LED diode wafer having an array of LEDs formed on a surface thereof a mixture...
8222078 Chip scale surface mounted semiconductor device package and process of manufacture  
A semiconductor device package die and method of manufacture are disclosed. The device package die may comprise a device substrate having one or more front electrodes located on a front surface of...
8222050 Manufacturing method for semiconductor integrated device  
In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the...
8211725 Method of manufacturing flexible display device  
A method of manufacturing a flexible display device is disclosed. The method includes arranging a first substrate having a plurality of depression units, forming a first plastic film in each of...
8202786 Method for manufacturing semiconductor devices having a glass substrate  
A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate...
8198175 Processing method for package substrate  
A processing method for a package substrate having a base substrate partitioned by a plurality of crossing division lines to form a plurality of chip forming areas where a plurality of...
8198713 Semiconductor wafer structure  
One embodiment provides a semiconductor wafer structure including a semiconductor wafer and a spacer layer. The semiconductor wafer includes active areas. The spacer layer is configured to provide...
8193613 Semiconductor die having increased usable area  
According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller...
8193039 Semiconductor chip with reinforcing through-silicon-vias  
A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first...
8193016 Semiconductor laser device and method of manufacturing the same  
A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface,...
8193038 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer  
A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of...