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8470712 Process for the transfer of a thin film comprising an inclusion creation step  
A process for transferring a thin film includes forming a layer of inclusions to create traps for gaseous compounds. The inclusions can be in the form of one or more implanted regions that...
8461021 Multiple seal ring structure  
The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring...
8461023 Die singulation method  
A method is disclosed for singulating die from a semiconductor substrate (e.g. a semiconductor-on-insulator substrate or a bulk silicon substrate) containing an oxide layer (e.g. silicon dioxide...
8460957 Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical semiconductor apparatus  
A method for manufacturing a high quality optical semiconductor device includes: (a) preparing a growth substrate; (b) forming a semiconductor layer on the growth substrate; (c) forming a metal...
8461601 Method for producing a plurality of optoelectronic devices, and optoelectronic device  
A method for producing a plurality of optoelectronic devices is specified, comprising the following steps: providing a connection carrier assemblage having a plurality of device regions, wherein...
8461024 Methods and apparatus for thinning, testing and singulating a semiconductor wafer  
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator...
8461671 Miniature packaging for discrete circuit components  
A miniature packaging for a discrete circuit component that comprises a core dice for the circuit component fabricated on a semiconductor substrate. The core dice has at least a pair of...
8455913 Package-integrated thin film LED  
LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the...
8455332 Method and apparatus for manufacturing LED devices using laser scribing  
A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices...
8450187 Method of cutting semiconductor substrate  
Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the...
8445360 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly...
8440503 Methods for performing reflow in bonding processes  
A method includes placing a cover over a lower package component, wherein the cover comprises an opening aligned to the lower package component. An upper package component is placed over the lower...
8441105 Semiconductor device, wafer structure and method for fabricating semiconductor device  
A semiconductor device includes an element forming region including at least one semiconductor element formed on at least one compound semiconductor layer formed on a substrate and a trench formed...
8442362 Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system  
An optical coupling structure that interfaces between optical devices mounted on a substrate and optical waveguides formed in the substrate. A manufacturing method includes preparing a wafer...
8436472 Corner stress release structure design for increasing circuit routing areas  
An integrated circuit structure includes a semiconductor chip, which further includes a corner and a seal ring dispatched adjacent edges of the semiconductor chip; and a corner stress release...
8435868 Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device  
With a general wafer level package process, in order to prevent corrosion of an aluminum type pad electrode in a scribe region in a plating process, the pad electrode is covered with a pad...
8431454 Fabricating process of circuit substrate and circuit substrate structure  
A fabricating process of circuit substrate sequently includes: providing a substrate with a pad and a dielectric stack layer disposed at the substrate and overlaying the pad, in which the stack...
8431440 Chip manufacturing method  
A substrate table used for manufacturing a chip is provided. The substrate table includes a substrate stage, a substrate placement surface formed on the substrate stage, and on which a substrate...
8431428 Optical device wafer processing method and laser processing apparatus  
An optical device wafer processing method including a laser processed groove forming step of applying a laser beam for performing ablation to the front side or back side of a substrate of an...
8432032 Chip package and fabrication method thereof  
A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate, having a first surface and an opposite second surface. A through hole is formed...
8426293 IC chip and its manufacturing method  
It is an object of the present invention to decrease a unit cost of an IC chip and to achieve the mass-production of IC chips. According to the present invention, a substrate having no limitation...
8420419 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device  
A method of fabricating a III-nitride semiconductor laser device includes: preparing a substrate product, where the substrate product has a laser structure, the laser structure includes a...
8415234 Wafer dividing method  
A wafer dividing method including a step of applying a laser beam to a wafer along division lines with the focal point of the laser beam set inside the wafer, thereby forming modified layers...
8415232 Dividing method for wafer having die bonding film attached to the back side thereof  
A wafer is divided into individual devices along division lines formed on the front side of the wafer. The devices are respectively formed in a plurality of regions partitioned by the division...
8409967 Method for manufacturing semiconductor chips from a semiconductor wafer  
A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than...
8409968 Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion  
Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the...
8399962 Semiconductor chip and process for production thereof  
A semiconductor chip of the present invention is a semiconductor device that includes a hexagonal semiconductor layer having anisotropic mechanical properties. A semiconductor chip (21), when...
8399338 Electronic component manufacturing method  
The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand...
8394707 Method of splitting of brittle materials with trenching technology  
One aspect of the invention relates to a method for splitting an object made of brittle material into at least two pieces. The object has a first flat surface and a second flat surface opposite to...
8389629 Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part  
A multi-layered adhesive sheet 100, includes: a substrate film 106, an adhesive layer 103 formed by coating an adhesive having a specific composition onto this substrate film 106, and a die...
8389380 Method for making a substrate of the semiconductor on insulator type with an integrated ground plane  
A method for making a semiconductor on insulator (SeOI) type substrate that includes an integrated ground plane under the insulating layer wherein the substrate is intended to be used in making...
8383436 Manufacturing method for semiconductor chips, and semiconductor chip  
By performing plasma etching on the second surface of a semiconductor wafer on the first surface of which an insulating film is placed in dividing regions and on the second surface of which a mask...
8378458 Semiconductor chip with a rounded corner  
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor wafer that has plural...
8372665 Manufacturing method for semiconductor integrated device  
In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the...
8372673 Method of seperating two material systems  
An embodiment of this invention discloses a method of separating two material systems, which comprises steps of providing a bulk sapphire; forming a nitride system on the bulk sapphire; forming at...
8373254 Structure for reducing integrated circuit corner peeling  
A crack prevention structure that reduces integrated circuit corner peeling and reduces cracking is disclosed. The crack prevention structure comprises a semiconductor substrate; a first plurality...
8367471 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices  
Stacked semiconductor devices, semiconductor assemblies, methods of manufacturing stacked semiconductor devices, and methods of manufacturing semiconductor assemblies. One embodiment of a...
8361883 Laser processing method  
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate...
8361903 Method and apparatus for ultra thin wafer backside processing  
A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support...
8361885 Group-III nitride semiconductor laser device, method of fabricating group-III nitride semiconductor laser device, and method of estimating damage from formation of scribe groove  
A method of fabricating group-III nitride semiconductor laser device includes: preparing a substrate comprising a hexagonal group-III nitride semiconductor and having a semipolar principal...
8357590 Method for producing semiconductor wafers composed of silicon having a diameter of at least 450 mm, and semiconductor wafer composed of silicon having a diameter of 450 mm  
Silicon semiconductor wafers are produced by: pulling a single crystal with a conical section and an adjoining cylindrical section having a diameter ≧450 mm and a length of ≧800 mm from a melt in...
8357996 Devices with crack stops  
An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a...
8354302 Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections  
A semiconductor device includes a semiconductor chip having a plurality of electrode pads, and a rewiring pattern having a plurality of interconnects connected to the electrode pads and extending...
8354349 Semiconductor device having sealing film and manufacturing method thereof  
A semiconductor device includes a plurality of wiring lines which are provided on an upper side of a semiconductor substrate and which have connection pad portions, and columnar electrodes are...
8349708 Integrated circuits on a wafer and methods for manufacturing integrated circuits  
Integrated circuits (1) on a wafer comprise a wafer substrate (2), a plurality of integrated circuits (1) formed lattice-like in rows and columns on the wafer substrate (2), and first and second...
8349709 Method of layout of pattern  
A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip...
8349710 Shielding techniques for an integrated circuit  
Described herein are techniques for forming, during wafer processing, a conductive shielding layer for a chip formed from a wafer. The conductive shielding layer can be formed on multiple sides of...
8343804 Implementing multiple different types of dies for memory stacking  
A method and structure are provided for implementing multiple different types of dies for memory stacking. A common wafer is provided with a predefined reticle type. The reticle type includes a...
8338917 Multiple seal ring structure  
The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring...
8329559 Damascene process for use in fabricating semiconductor structures having micro/nano gaps  
In fabricating a microelectromechanical structure (MEMS), a method of forming a narrow gap in the MEMS includes a) depositing a layer of sacrificial material on the surface of a supporting...