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8603351 Working method for cutting  
An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified...
8597967 Method and system for dicing substrates containing gallium and nitrogen material  
The present disclosure relates generally to semiconductor techniques. More specifically, embodiments of the present disclosure provide methods for efficiently dicing substrates containing gallium...
8597963 Manufacture of light emitting devices with phosphor wavelength conversion  
A method of manufacturing a light emitting device: an LED wafer having an array of LEDs formed on a surface thereof, the method comprises: a) fabricating a sheet of phosphor/polymer material...
8598015 Laser processing method  
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate...
8597074 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces  
Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic...
8592950 Semiconductor device and method of forming through vias with reflowed conductive material  
A semiconductor device is made by providing a first semiconductor wafer having semiconductor die. A gap is made between the semiconductor die. An insulating material is deposited in the gap. A...
8586415 Dicing/die-bonding film, method of fixing chipped work and semiconductor device  
A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2),...
8580656 Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor  
Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free...
8580615 Method and system for wafer level singulation  
A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate...
8575006 Process to form semiconductor packages with external leads  
This invention discloses a process for packaging semiconductor device with external leads. The process includes comprises Step 1: providing a lead frame comprising a plurality of lead frame units...
8575729 Semiconductor chip with linear expansion coefficients in direction parallel to sides of hexagonal semiconductor substrate and manufacturing method  
The semiconductor chip (18) of the present invention is a semiconductor chip (18) on which a power semiconductor device (10) is formed, and which includes a semiconductor substrate made from a...
8575004 Lift-off structure for substrate of a photoelectric device and the method thereof  
The present invention related to a lift-off structure adapted to a substrate having a photoelectric device, the structure comprising: a buffer layer, forming on the substrate; an upper sacrificial...
8569097 Flexible III-V solar cell structure  
Solar cell structures include stacked layers in reverse order on a germanium substrate wherein a n++ (In)GaAs buffer layer plays dual roles as buffer and contact layers in the inverted structures....
8563404 Process for dividing wafer into individual chips and semiconductor chips  
A process to divide a wafer into individual chips is disclosed. The process (1) etches semiconductor layers for an active device to form two grooves putting the virtual cut line therebetween,...
8564078 Method for producing a micromechanical component having a trench structure for backside contact  
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a...
8563343 Method of manufacturing laser diode device  
A method of manufacturing a laser diode device includes: forming, in a semiconductor laser bar, separation trenches extending across all of a transverse dimension of the semiconductor laser bar...
8555492 Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach  
A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral...
8557682 Multi-layer mask for substrate dicing by laser and plasma etch  
Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a first mask material layer soluble in a solvent over the semiconductor substrate...
8558280 Semiconductor device and method of manufacturing the semiconductor device  
A semiconductor device according to the present invention including: a substrate; a compound semiconductor layer formed on the substrate; an element forming area provided in the compound...
8557684 Three-dimensional integrated circuit (3DIC) formation process  
A method includes performing a laser grooving to remove a dielectric material in a wafer to form a trench, wherein the trench extends from a top surface of the wafer to stop at an intermediate...
8551865 Method of cutting an object to be processed  
A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P...
8551888 Method of forming patterns for semiconductor device  
A method of forming patterns for a semiconductor device. The method includes: forming a first hard mask layer on a layer which is to be etched; forming a second hard mask layer on the first hard...
8546244 Method of manufacturing semiconductor device  
A method includes the steps of: (a) fixing a front surface of a wafer (semiconductor wafer) having the front surface, a plurality of chip regions formed on the front surface, a dicing region...
8541262 Die edge contacts for semiconductor devices  
A semiconductor device utilizing die edge contacts is provided. An integrated circuit die has a post-passivation layer with a trench filled with a conductive material extending from a contact to a...
8541290 Optoelectronic substrate and methods of making same  
A method of fabricating a device by providing an auxiliary substrate having a metal nitride layer disposed thereon where the nitride layer has a nitrogen face and an opposite face and a...
8536025 Resized wafer with a negative photoresist ring and design structures thereof  
A resized wafer using a negative photoresist ring, methods of manufacture and design structures thereof are disclosed. The method includes forming a ring within a radius of a wafer. The method...
8524576 Wafer processing method  
In a wafer processing method, the back side of a wafer having a plurality of devices on the front side thereof is ground, thereby reducing the thickness of the wafer to a predetermined thickness....
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue  
A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An...
8524577 Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure  
A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to...
8524575 Group III nitride crystal and method for producing the same  
A method for producing a group III nitride crystal in the present invention includes the steps of cutting a plurality of group III nitride crystal substrates 10p and 10q having a main plane from a...
8525019 Thin film article and method for forming a reduced conductive area in transparent conductive films for photovoltaic modules  
A method for forming a reduced conductive area in transparent conductive. The method includes providing a transparent, electrically conductive, chemically reducible material. A reducing atmosphere...
8518805 Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby  
Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the...
8519511 Substrate dividing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8518800 Substrate dividing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8518801 Substrate dividing method  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
8513777 Method and apparatus for generating reticle data  
A method for generating reticle data for forming a reticle. The method includes recognizing a non-layout region free from main chips in a process pattern, dividing the non-layout region into a...
8513095 Method and system for separating photovoltaic strips  
A method for manufacturing solar strips. The method includes providing a photovoltaic material including a back side region, a front side surface, and a plurality of photovoltaic strip regions...
8513098 Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure  
A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to...
8513060 Manufacturing method using multi-step adhesive curing for sealed semiconductor device  
A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of...
8507363 Laser and plasma etch wafer dicing using water-soluble die attach film  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer...
8502350 Stacked layers of nitride semiconductor and method for manufacturing the same  
According to one embodiment, stacked layers of a nitride semiconductor include a substrate, a single crystal layer and a nitride semiconductor layer. The substrate does not include a nitride...
8497141 Semiconductor device and method of manufacturing it  
A method of manufacturing a semiconductor device capable of largely increasing the yield and a semiconductor device manufactured by using the method is provided. After a semiconductor layer is...
8492246 Method of manufacturing integrated circuit device  
It is an object of the present invention to improve a factor which influences productivity such as variation caused by a characteristic defect of a circuit by thinning or production yield when an...
8486761 Hybrid combination of substrate and carrier mounted light emitting devices  
A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon...
8486756 Flip chip bonded semiconductor device with shelf and method of manufacturing thereof  
The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a...
8486724 Wafer level reflector for LED packaging  
An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED...
8481352 Method of fabricating light emitting diode chip  
The present invention provides a method of fabricating a light emitting diode chip having an active layer between an N type semiconductor layer and a P type semiconductor layer. The method...
8481861 Method of attaching die to circuit board with an intermediate interposer  
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients...
8476129 Method and structure of sensors and MEMS devices using vertical mounting with interconnections  
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one...
8476109 Semiconductor workpiece carriers and methods for processing semiconductor workpieces  
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support...