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8742547 Semiconductor wafer and its manufacture method, and semiconductor chip  
A semiconductor wafer includes: a first semiconductor chip area formed with a semiconductor element; a second semiconductor chip area formed with a semiconductor element; and a scribe area...
8742599 Identification mechanism for semiconductor device die  
A method and system for uniquely identifying each semiconductor device die from a wafer is provided. Identifying features are associated with device die bond pads. In one embodiment, one or more...
8741692 MEMS wafer-level packaging  
A method for forming semiconductor devices with wafer-level packaging (WLP) includes providing a silicon-on-insulator (SOI) substrate, forming a mask on a silicon layer of the SOI substrate,...
8735772 Method and apparatus for improved laser scribing of opto-electric devices  
Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers...
8728916 Method for manufacturing semiconductor element  
A method for manufacturing a semiconductor element of the present invention, has: a laser irradiation step of focusing a pulsed laser beam inside of a substrate constituting a wafer, thereby...
8728914 Workpiece cutting method  
Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed...
8729561 P type III-nitride materials and formation thereof  
In one implementation, a method of forming a P type III-nitride material includes forming a getter material over a III-nitride material, the III-nitride material having residual complexes formed...
8723314 Semiconductor workpiece with backside metallization and methods of dicing the same  
Various semiconductor workpieces and methods of dicing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a channel in a metallization structure on...
8716066 Method for plating a semiconductor package lead  
A method of forming a packaged semiconductor device includes loading an array of package sites in position for saw singulation, saw singulating the array of package sites, and performing a...
8716063 Wafer level chip scale package and process of manufacture  
Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of...
8709868 Sensor packages and method of packaging dies of differing sizes  
A method (90) entails placing (124) sensor elements (122) in an array (126) arranged to correspond with locations of controller dies (24) in a controller wafer (94) and encapsulating (128) the...
8703583 Fabrication method of semiconductor device  
A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a...
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring  
A package structure and fabrication method thereof. The structure includes a substrate having a terminal, a chip overlying the substrate, the chip having an active surface, having a center region...
8685838 Laser beam machining method  
A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8...
8679947 Self-formation of high-density defect-free and aligned nanostructures  
A device and method for forming nanostructures includes providing a monocrystalline semiconductor layer on a flexible substrate and stressing the substrate in accordance with a crystal cleave...
8679945 Backgrind process for integrated circuit wafers  
An integrated circuit is formed by coating a top surface of a wafer that has been processed through all integrated circuit chip manufacturing steps prior to backgrind with photoresist, applying...
8673742 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device includes forming a starting-point crack on a cleavage line on a surface of a semiconductor substrate; forming preliminary cracks intermittently...
8673745 Method of cutting object to be processed  
A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P...
8664088 Manufacturing a heat sink material using a discharge wire  
Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on...
8664089 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the...
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption  
The width of scribe lines may be reduced in semiconductor devices by applying a process technique in which trenches may be formed first from the rear side on the basis of a required width of the...
8658515 Method of manufacturing film for semiconductor device  
The present invention aims to provides a method of manufacturing a film for a semiconductor device in which a dicing film, a die bond film, and a protecting film are laminated in this order,...
8658436 Method for separating and transferring IC chips  
[Problems] There are provided a chip separation method and a chip transfer method using features of dry etching. [Means for Solving the Problems] In the chip separation method, a multiple number...
8652940 Wafer dicing used hybrid multi-step laser scribing process with plasma etch  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The mask is composed of...
8652942 Method for manufacturing electronic parts  
A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive...
8652938 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device  
The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer...
8653563 Semiconductor device  
A semiconductor device includes: a substrate comprised of gallium nitride; an active layer provided on the substrate; a first buffer layer that is provided between the substrate and the active...
8652941 Wafer dicing employing edge region underfill removal  
In one embodiment, a dielectric material layer embedding metal structures is ablated from the chip-containing substrate by laser grooving, which is performed on dicing channels of the...
8652939 Method and apparatus for die assembly  
Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having...
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer  
In one aspect of the present invention, a method of sawing a semiconductor wafer will be described. A semiconductor wafer is positioned in a wafer sawing apparatus that includes a sawing blade and...
8648444 Wafer scribe line structure for improving IC reliability  
A semiconductor wafer having a multi-layer wiring structure is disclosed. The wafer comprises a plurality of chip die areas arranged on the wafer in an array and scribe line areas between the chip...
8642445 Method and apparatus for reducing package warpage  
Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure...
8642447 Semiconductor wafer and manufacturing method of semiconductor device  
A method of manufacturing a semiconductor device includes preparing a semiconductor wafer including a silicon substrate and a laminate having a compound semiconductor layer; etching and removing a...
8643177 Wafers including patterned back side layers thereon  
A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After...
8642920 Wafer dividing apparatus and laser processing apparatus  
A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular...
8637970 Chip package and fabrication method thereof  
An embodiment of the present invention relates to a chip package and fabrication method thereof, which includes a chip protection layer or an additional etching stop layer to cover conducting pads...
8637967 Method for fabricating a semiconductor chip and semiconductor chip  
A method includes structuring a semiconductor substrate to produce a number semiconductor chips. Each of the semiconductor chips includes a first main face and a number of side faces. An...
8637382 Layer transfer of films utilizing thermal flux regime for energy controlled cleaving  
A method and system for cleaving a film of material utilizing thermal flux. The method includes providing a substrate having a face and an underlying cleave region including a prepared initiation...
8633086 Power devices having reduced on-resistance and methods of their manufacture  
A method for forming a support structure for supporting and handling a semiconductor wafer containing vertical FETs formed at the front surface thereof is provided. In one embodiment, a...
8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof  
A semiconductor wafer with an assisting dicing structure. The wafer comprises a substrate having a front surface and a rear surface. The front surface of the substrate comprises at least two...
8629042 Method for stacking semiconductor dies  
A system and method for stacking semiconductor dies is disclosed. A preferred embodiment comprises forming through-silicon vias through the wafer, protecting a rim edge of the wafer, and then...
8623703 Silicon device and silicon device manufacturing method  
A silicon device has a flat panel shape which is a polygon in a plan view, and at least one corner of the polygon includes two sides adjacent to each other out of plural sides of the polygon and a...
8624351 Package structure and method for making the same  
A package structure which includes a non-conductive substrate, a conductive element, a passivation, a jointed side, a conductive layer, a solder and a solder mask is disclosed. The conductive...
8623744 Die singulation method  
A method is disclosed for singulating die from a semiconductor substrate (e.g. a semiconductor-on-insulator substrate or a bulk silicon substrate) containing an oxide layer (e.g. silicon dioxide...
8623137 Method and device for slicing a shaped silicon ingot using layer transfer  
A method for slicing a shaped silicon ingot includes providing a single crystal silicon boule characterized by a cropped structure including a first end-face, a second end-face, and a length along...
8617964 Laser processing method  
A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming...
8615857 Method of manufacturing piezoelectric vibrators  
Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric...
8614139 Dicing film with protecting film  
The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is...
8609513 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device includes the steps of: preparing a combined wafer; obtaining a first intermediate wafer by forming an active layer; obtaining a second...
8610238 Crack stop trenches  
Structures and methods of forming crack stop trenches are disclosed. The method includes forming active regions disposed in cell regions of a substrate, the cell regions separated by dicing...