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8871540 Laser dicing method  
A laser dicing method includes: placing a workpiece substrate on a stage; generating a clock signal; emitting a pulse laser beam synchronous with the clock signal; switching irradiation and...
8865568 Workpiece cutting method  
Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed...
8865566 Method of cutting semiconductor substrate  
Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the...
8865567 Method of manufacturing semiconductor device  
Ineffective chips are formed in the circumference of a semiconductor wafer and effective chips are formed in a region surrounded by the ineffective chips. Dicing lines partition the effective...
8859396 Semiconductor die singulation method  
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of...
8852969 Fabrication of compact opto-electronic component packages  
A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite...
8853056 Wafer dicing using femtosecond-based laser and plasma etch  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask including a...
8846532 Method and apparatus for ultra thin wafer backside processing  
A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support...
8841170 Methods for scribing of semiconductor devices with improved sidewall passivation  
A method of singulating semiconductor devices in the close proximity to active structures by controlling interface charge of semiconductor device sidewalls is provided that includes forming a...
8841141 Method for separating and transferring IC chips  
A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor...
8835207 Method of manufacturing a semiconductor integrated circuit device having a MEMS element  
In a method of manufacturing a semiconductor integrated circuit device having an MEMS element over a single semiconductor chip, the movable part of the MEMS element is fixed before the formation...
8836134 Semiconductor stacked package and method of fabricating the same  
A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a...
8836084 Structure for reducing integrated circuit corner peeling  
A crack prevention structure that reduces integrated circuit corner peeling and reduces cracking is disclosed. The crack prevention structure comprises a semiconductor substrate; a first plurality...
8835283 Fabrication method for producing semiconductor chips with enhanced die strength  
A fabrication method for producing semiconductor chips with enhanced die strength comprises following steps: forming a semiconductor wafer with enhanced die strength by comprising the substrate,...
8828891 Laser processing method  
For modulating laser light for forming a modified region SD3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an...
8828848 Die structure and method of fabrication thereof  
A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a...
8828803 Resin sealing method for semiconductor chips  
A resin sealing method for a plurality of semiconductor chips. The resin sealing method includes a chip holding sheet attaching step of attaching a chip holding sheet through an adhesive ring to a...
8822308 Methods and apparatus for transfer of films among substrates  
A method is disclosed which includes: forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in...
8809076 Semiconductor device and method of automatically inspecting an appearance of the same  
The invention provides a semiconductor device and a method of automatically inspecting the appearance, which achieves proper recognition of the size of a chipping occurring from an end portion of...
8809166 High die strength semiconductor wafer processing method and system  
Embodiments of methods and systems for processing a semiconductor wafer are described. In one embodiment, a method for processing a semiconductor wafer involves performing laser stealth dicing on...
8803302 System, method and apparatus for leadless surface mounted semiconductor package  
A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a...
8803332 Delamination resistance of stacked dies in die saw  
An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding...
8802543 Laser processing method  
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate...
8802545 Method and apparatus for plasma dicing a semi-conductor wafer  
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the...
8796802 Semiconductor photodetector and radiation detector system  
Semiconductor photodetectors are provided that may enable optimized usage of an active detector array. The semiconductor photodetectors may have a structure that can be produced and/or configured...
8796154 Method and apparatus for plasma dicing a semi-conductor wafer  
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the...
8796050 Method and apparatus for manufacturing white light-emitting device  
Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device...
8796113 Laser processing method for wafer  
A processing method for a wafer on which a plurality of devices are formed and partitioned by scheduled division lines includes a dividing groove by irradiating a laser beam of a wavelength to...
8796111 Stacked layers of nitride semiconductor and method for manufacturing the same  
According to one embodiment, stacked layers of a nitride semiconductor include a substrate, a single crystal layer and a nitride semiconductor layer. The substrate does not include a nitride...
8791387 Laser cutting method, display apparatus manufacturing method, and display apparatus  
To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that...
8791574 Semiconductor device and manufacturing method of the same  
In a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer, a two-step cutting technique is used for dicing. After formation of a groove in...
8785246 Multiple seal-ring structure for the design, fabrication, and packaging of integrated circuits  
A semiconductor circuit design includes an outer seal-ring and an inner seal-ring for each sub-section of the design that may potentially be cut into separate die. The use of multiple seal-rings...
8785249 Three dimensional microelectronic components and fabrication methods for same  
Aspects and examples include electrical components and methods of forming electrical components. In one example, a method includes selecting a substrate, forming a pattern of a first conductive...
8785299 Package with a fan-out structure and method of forming the same  
An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive...
8785234 Method for manufacturing a plurality of chips  
A method for manufacturing a plurality of chips comprises the step of providing a wafer comprising a plurality of chip areas separated by one or more dicing lines, wherein the chip areas are...
8785332 Method and apparatus for plasma dicing a semi-conductor wafer  
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the...
8778735 Packaging method of molded wafer level chip scale package (WLCSP)  
A WLCSP method comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer to cover metal bumps while forming an un-covered ring at the...
8778806 Method and apparatus for plasma dicing a semi-conductor wafer  
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the...
8778719 Linear semiconductor substrate, and device, device array and module, using the same  
The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width,...
8772126 Method of manufacturing a semiconductor device including grinding from a back surface and semiconductor device  
A cavity is etched from a front surface into a semiconductor substrate. After providing an etch stop structure at the bottom of the cavity, the cavity is closed. From a back surface opposite to...
8772065 Housing body and method for production thereof  
A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is...
8772137 Semiconductor wafer with assisting dicing structure and dicing method thereof  
A semiconductor wafer with an assisting dicing structure. The wafer comprises a substrate having a front surface and a rear surface. The front surface of the substrate comprises at least two...
8772133 Utilization of a metallization scheme as an etching mask  
The various aspects comprise methods and devices for processing a wafer. An aspect of this disclosure includes a wafer. The wafer comprises a plurality of die regions; a plurality of kerf regions...
8772134 Method for manufacturing semiconductor chips from a semiconductor wafer  
A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than...
8753959 Coating adhesives onto dicing before grinding and micro-fabricated wafers  
A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
8754538 Semiconductor chip including identifying marks  
A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a first layer of the chip and a second...
8754515 Stacked packages having through hole vias  
Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a...
8748297 Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill material  
In one embodiment, a method of forming a semiconductor device includes forming openings in a substrate. The method includes forming a dummy fill material within the openings and thinning the...
8749077 Three-dimensional integrated circuit (3DIC)  
An embodiment 3DIC device includes a semiconductor chip, a die, and a polymer. The semiconductor chip includes a semiconductor substrate, wherein the semiconductor substrate comprises a first...
8748289 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly...