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7678673 Strengthening of a structure by infiltration  
The present invention provides a method of strengthening a structure, to heal the imperfection of the structure, to reinforce the structure, and thus strengthening the dielectric without...
7674688 Sawing method for a semiconductor element with a microelectromechanical system  
A sawing method for a Micro Electro-Mechanical Systems (MEMS) semiconductor device, wherein a gum material is disposed between a wafer having at least one MEMS and a carrier, and the gum material...
7675091 Semiconductor wafer and method of fabricating the same  
Disclosed is a semiconductor wafer and method of fabricating the same. The semiconductor wafer is comprised of a semiconductor layer formed on an insulation layer on a base substrate. The...
7666747 Process of manufacturing semiconductor device  
A method that suppresses etching damage without increasing a chip area of a semiconductor device. An integrated circuit including a MOS transistor is formed in a device area, and a discharge...
7666760 Method of dividing wafer  
A method of dividing a wafer includes: a denatured layer forming step of forming a denatured layer in the inside of the wafer along streets; a first feeding step in which the whole area of the...
7662699 Method for fabricating semiconductor device  
An object is to provide a technology capable of improving a manufacturing yield of semiconductor devices by preventing scattering of irregular-shaped scraps formed at the time of dicing. To...
7659132 Semiconductor element holding apparatus and semiconductor device manufactured using the same  
A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the...
7659140 Integrated circuit system with a debris trapping system  
An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the...
7659128 Method of processing silicon wafer and method of manufacturing liquid ejecting head  
A break pattern is formed on a silicon wafer using an anisotropic etching process. The break pattern includes a plurality of through holes, each of having a first plane perpendicular to a plane...
7655541 Wafer processing method and laser processing apparatus  
In a wafer processing method for penetrating a wafer by use of a laser processing apparatus including a chuck table for holding the wafer, laser beam irradiation means for irradiating the wafer...
7655539 Dice by grind for back surface metallized dies  
Semiconductor device processing and methods for dicing a semiconductor wafer into a plurality of individual dies that can have back surface metallization are described. The methods comprise...
7656012 Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another  
A chip-scale or wafer-level-package, having passivation layers on substantially all surfaces thereof to form a hermetically sealed-package, is provided. The package may be formed by disposing a...
7651925 Vacuum expansion of integrated circuits at sort  
A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact...
7651888 Wafer lever fixture and method for packaging micro-electro-mechanical-system devices  
A fixture for packaging MEMS devices includes a base, a first material layer, an insulating layer and a second material layer. The base defines units, each including a notch. The first material...
7651882 RFID tag circuit die with shielding layer to control I/O bump flow  
The present description describes back-end processes, the use of which may help overcome these problems and limitations of the prior art. In one optional embodiment, the back-end process includes...
7648894 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same  
The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for...
7648850 Method for producing semiconductor chip  
A method for producing many semiconductor chips, each having a semiconductor circuit disposed on the face thereof and a die bonding film stuck to the back thereof, from a semiconductor wafer in...
7645685 Method for producing a thin IC chip using negative pressure  
The present invention relates to a method for bonding a first thin plate having a first adhesion surface and a first back surface and a second thin plate having a second adhesion surface and a...
7645686 Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit  
The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support...
7642175 Semiconductor devices having a back surface protective coating  
A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to...
7642113 Semiconductor wafer dividing method  
An element is formed on the major surface of a semiconductor wafer, and a groove is formed in the back surface of the semiconductor wafer along a dicing line or chip dividing line by a mechanical...
7637997 Silicon wafer, method for producing silicon wafer and method for growing silicon single crystal  
A silicon single crystal is grown by the CZ method. A silicon melt from which the crystal is grown is added with dopant such that the crystal has a resistivity of 0.025 to 0.08 Ωcm. As well as the...
7632696 Semiconductor chip with a porous single crystal layer and manufacturing method of the same  
A semiconductor chip including a semiconductor substrate provided with a semiconductor device region and a porous single crystal layer, where the semiconductor device region is formed on the main...
7632707 Electronic device package and method of manufacturing the same  
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic...
7629228 Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks  
On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the...
7629229 Laser processing method  
In a laser beam processing method, when a laser beam is emitted along a second predetermined dividing line to form a second groove intersecting a first groove previously formed, the power output...
7629231 Fabrication method of semiconductor device  
A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a...
7615397 Micro-element package and manufacturing method thereof  
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make...
7611968 Wafer laser processing method and laser beam processing machine  
A wafer laser processing method for forming deteriorated layers in the inside of a wafer having devices which are formed in a plurality of areas sectioned by a plurality of streets formed in a...
7611966 Dual pulsed beam laser micromachining method  
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser melts portions of the workpiece prior to a second...
7611967 Wafer sawing method  
A wafer sawing method for sawing a wafer by using a cutting tool is provided. Sawing paths are formed on a surface of the wafer. In the wafer sawing method, a carrier on which strip-shaped...
7608481 Method for producing semiconductor package  
A method for producing a semiconductor package including a main semiconductor chip having a semiconductor circuit formed on one surface thereof, at least one subsidiary semiconductor chip stacked...
7605057 Semiconductor device and manufacturing method thereof  
A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into...
7605015 Process for the singulation of integrated devices in thin semiconductor chips  
A process for the fabrication of an integrated device in a semiconductor chip envisages: forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to the...
7601642 Method of processing silicon wafer  
The inventive method for processing a silicon wafer is a method comprising step 11 in which a single crystal ingot is sliced into thin disc-like wafers; step 13 in which the surface of each wafer...
7601616 Wafer laser processing method  
A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices...
7598120 Method for holding semiconductor wafer  
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground;...
7598157 Wafer dicing method  
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed...
7595226 Method of packaging an integrated circuit die  
A structure (40) for holding an integrated circuit die (38) during packaging includes a support substrate (42), a release film (44) attached to the substrate (42), and a swelling agent (60). A...
7591071 Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate  
A semiconductor device includes a lateral end surface and a connection electrode for external electrical connection. The connection electrode is exposed at the side surface. A manufacturing method...
7592203 Method of manufacturing an electronic protection device  
A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second...
7592235 Semiconductor device including semiconductor memory element and method for producing same  
A wafer, in which a plurality of rectangular regions are defined on the face of the wafer by streets arranged in a lattice pattern, and a semiconductor memory element is disposed in each of the...
7592236 Method for applying a structure of joining material to the back surfaces of semiconductor chips  
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured...
7592237 Laser processing method and object to be processed  
A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at...
7579260 Method of dividing an adhesive film bonded to a wafer  
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
7569409 Isolation structures for CMOS image sensor chip scale packages  
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a...
7566638 Method of dicing a semiconductor device into plural chips  
A semiconductor device includes a substrate, a seal layer which seals a semiconductor element formed on the substrate, wherein a side surface of the seal layer is positioned inside of a side...
7566585 Semiconductor component and method for production of a semiconductor component  
A semiconductor substrate, a semiconductor chip and a semiconductor component with areas composed of a stressed monocrystalline material, and a method for production of a semiconductor component...
7564119 Adhesive sheet for laser dicing and its manufacturing method  
An adhesive sheet for laser dicing is used for dicing a workpiece into individual chips by light absorption ablation of laser beam and has at least an adhesive layer on one side of a base material...
7563695 Method and system for high-speed precise laser trimming and scan lens for use therein  
A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a...