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7781310 Semiconductor die singulation method  
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.
7776746 Method and apparatus for ultra thin wafer backside processing  
A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support...
7776715 Reverse construction memory cell  
A method of fabricating a memory cell comprises forming a plurality of doped semiconductor layers on a carrier substrate. The method further comprises forming a plurality of digit lines separated...
7776720 Program-controlled dicing of a substrate using a pulsed laser  
A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse...
7776647 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors  
A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the...
7772109 Manufacturing method of multilayer wiring substrate  
A first multilayer wiring structural body 16 and a second multilayer wiring structural body 56 are simultaneously formed on both surfaces 101A, 101B of a substrate 101 and thereafter the portion...
7767557 Chilled wafer dicing  
A method for dicing a wafer is disclosed. One illustrative method includes forming a layer of frozen material above a plurality of integrated circuit dies on a substrate and performing a cutting...
7767551 Method for fabricating semiconductor chip  
After a film layer 6 formed from a die attach film 4 and a UV tape 5 has been provided as a mask on a semiconductor wafer 1, boundary trenches 7 for partitioning semiconductor elements 2 formed on...
7767554 Method of manufacturing semicondictor chip  
An object is to provide a semiconductor chip manufacturing method capable of removing test patterns in a higher efficiency in simple steps, while a general-purpose characteristic can be secured....
7767552 Method for avoiding die cracking  
Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor...
7767550 Wafer laser processing method and laser processing equipment  
A wafer laser processing method for forming a groove in a wafer having a plurality of areas which are sectioned by streets formed in a lattice pattern on the front surface of a substrate, a device...
7767595 Manufacturing method of semiconductor device  
In a manufacturing process of a semiconductor device, a manufacturing technique of a semiconductor device by which a lithography step that uses a photoresist is simplified is provided. A...
7763525 Method for positioning dicing line of wafer  
A method for positioning a dicing line includes the steps of: bonding an adhesive tape on a semiconductor layer of a wafer; detecting an image of the wafer by an imaging device on the basis of a...
7759224 Fabrication method of semiconductor integrated circuit device  
A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming...
7759223 Semiconductor wafer and manufacturing process for semiconductor device  
A semiconductor wafer 1 has first scribe lines 31 in two mutually perpendicular directions which have a first width and divide the semiconductor wafer 1 into a plurality of areas; second scribe...
7754582 Laser processing method  
A laser processing method including a first step of forming a first groove and a second step of forming a second groove on the workpiece. In the first step, the laser beam is intermittently...
7755205 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument  
The present invention is a method of manufacturing a semiconductor device, by forming a wiring on or above a wafer so that the wiring is electrically connected to a first electrode disposed on a...
7754584 Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device  
In a semiconductor substrate 1, a plurality of semiconductor elements 2 having diaphragm structures are formed in the form of cells in the longitudinal direction and the lateral direction, and...
7754511 Laser lift-off method  
The present invention discloses a laser lift-off method, which applies to lift off a transient substrate from an epitaxial layer grown on the transient substrate after a support substrate having...
7749865 Method for producing semiconductor wafers and a system for determining a cut position in a semiconductor ingot  
A method for producing semiconductor wafers, from a semiconductor ingot, wherein an oxygen concentration distribution in the growth axis direction is measured in the ingot state (F2), a position...
7749867 Method of cutting processed object  
A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P...
7749866 Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tape  
A method for sawing a wafer includes the following steps. A wafer which has an active surface, a back surface and a plurality of longitudinal and transverse sawing lines is provided, wherein the...
7741158 Method of making thermally enhanced substrate-base package  
An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive...
7741195 Method of stimulating die circuitry and structure therefor  
A method includes providing a wafer having a first die and a scribe grid, where the first die has die circuitry and a bond pad electrically connected to the die circuitry, and where the scribe...
7741701 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment  
A method for treating an area of a semiconductor wafer surface with a laser for reducing stress concentrations is disclosed. The wafer treatment method discloses treating an area of a wafer...
7737002 Wafer dividing method  
A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for...
7737000 Process for the collective fabrication of microstructures consisting of superposed elements  
The invention relates to the collective fabrication of superposed microstructures, such as an integrated circuit and a protective cover. Individual structures each comprising superposed first and...
7736995 Process for producing components  
The invention relates to a process for producing components, in particular small glass plates such as windows for optical caps for optical components. The process includes providing a substrate,...
7736999 Manufacturing method of semiconductor device  
An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive...
7736944 Semiconductor device with improved design freedom of external terminal  
A semiconductor device comprises: a semiconductor chip having a first main surface, a second main surface, and a plurality of side surfaces; an extension portion which contacts and surrounds the...
7737003 Method and structure for optimizing yield of 3-D chip manufacture  
The process begins with separate device wafers having complimentary chips. Thin metal capture pads, having a preferred thickness of about 10 microns so that substantial pressure may be applied...
7732239 Method for manufacturing solid-state image sensor  
A method using a divided exposure technology is provided for restraining deterioration in the performance of a solid-state image sensor. A photoresist is formed over a semiconductor substrate and...
7728257 Method of forming embrittled areas inside wafer for division  
A method of forming embrittled areas in multiple layers inside a wafer so as to enable the wafer to be divided correctly even at areas where embrittled areas intersect. In a first direction...
7727862 Semiconductor device including semiconductor constituent and manufacturing method thereof  
A semiconductor device includes a semiconductor constituent having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. An...
7727857 Manufacturing method of semiconductor device  
To provide a thin semiconductor device having flexibility. A groove is formed in one surface of a substrate; an element layer including an element is formed, the element being disposed within the...
7723210 Direct-write wafer level chip scale package  
A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings,...
7718510 Laser processing method and semiconductor chip  
A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a...
7718512 Integrated circuit wafer with inter-die metal interconnect lines traversing scribe-line boundaries  
A metal interconnect structure formed over a substrate in an integrated circuit that traverses a scribe-line boundary between a first die and a second die includes at least one metal interconnect...
7718454 Method for manufacturing a semiconductor laser  
A method of manufacturing semiconductor laser device including a GaN wafer includes forming a semiconductor layer on the GaN wafer and on which ridge portions are formed. Grooves are formed in the...
7718511 Processing method for wafer  
A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is...
7700392 Manufacturing method of semiconductor laser devices and manufacturing apparatus of the same  
The present invention is to provide a semiconductor laser device manufacturing method for realizing highly reliable semiconductor laser devices. The semiconductor laser device manufacturing method...
7696010 Wafer dividing method  
A method of dividing a wafer having devices which are formed in a plurality of areas sectioned by a plurality of dividing lines formed in a lattice pattern on the front surface, into individual...
7696069 Wafer dividing method  
Disclosed herein is a method of dividing a wafer having a plurality of streets which are formed in a lattice pattern on the front surface and having devices which are formed in a plurality of...
7696068 Method for manufacturing vertical light-emitting diode  
A method for manufacturing a vertical light-emitting diode is described. In the method for manufacturing the vertical light-emitting diode, a sapphire substrate is provided. An illuminant...
7692274 Reinforced semiconductor structures  
Reinforced semiconductor structures are provided. An exemplary embodiment of a reinforced semiconductor structure comprises a semiconductor wafer comprising a plurality of dielectric layers formed...
7687374 Method of isolating semiconductor laser diodes  
Provided is a method of isolating semiconductor laser diodes (LDs), the method including the steps of: preparing a substrate; forming a plurality of semiconductor LDs on the substrate, each...
7687332 SOI circuit having reduced crosstalk interference and a method for forming the same  
A method allowing the elimination of crosstalk interference, through the semiconductive substrate, between portions of a circuit provided on a same substrate comprising an upper semiconductive...
7687373 Wafer dividing method and apparatus  
In the case of cutting streets on the rear surface of a wafer by laser beam irradiation, even if the wafer is variously doped or thermally-treated, the streets of a wafer front surface can...
7687375 Lamination device manufacturing method  
A lamination device manufacturing method for manufacturing a lamination device using a reinforced wafer formed with an annular reinforced portion, includes a wafer lamination step in which a rear...
7678589 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor  
A method for manufacturing a capacitive semiconductor sensor includes: forming a plurality of circuit chips in a wafer, wherein each circuit chip includes a pad for testing a sensor chip; bonding...