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7427526 Deposited thin films and their use in separation and sacrificial layer applications  
This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs,...
7422964 Manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate  
A manufacturing method of a thin film apparatus, includes: a first step for forming a separation layer on a heat resistant substrate; a second step for forming a thin film device on the separation...
7422958 Method of fabricating a mixed substrate  
A method for fabricating a mixed substrate that include insulating material layer portions buried in a substrate of semiconductor material. The method includes providing a support substrate made of...
7420263 DBG system and method with adhesive layer severing  
An array of grooves ( 23 ) is formed in a first side ( 12 ) of a wafer ( 10 ) during a wafer processing method. A back grinding tape ( 16 ) is adhered to the first side. An amount of material is...
7416962 Method for processing a semiconductor wafer including back side grinding  
A method is provided for processing the back side of a semiconductor wafer after the wafer has been lapped. The process includes grinding the back side of the wafer to remove wafer material, to...
7410884 3D integrated circuits using thick metal for backside connections and offset bumps  
Backside connections for 3D integrated circuits and methods to fabricate thereof are described. A stack of a first wafer over a second wafer that has a substrate of the first wafer on top of the...
7410882 Method of manufacturing and structure of polycrystalline semiconductor thin-film heterostructures on dissimilar substrates  
According to various exemplary embodiments of this invention, a method of producing a semiconductor structure is provided that includes providing a layered structure on a first substrate, the...
7410813 Method of parallel lapping a semiconductor die  
In a lapping process for lapping away layers from a semiconductor device, where the region of interest is located near an edge or corner of the device, the method includes adding additional...
7407870 Method for manufacturing semiconductor device  
The present invention is a separation method for easy separation of an allover release layer with a large area. Further, the present invention is the separating method that is not subjected to...
7407868 Chemical thinning of silicon body of an SOI substrate  
The present invention discloses a method including: providing a silicon wafer; forming a buried oxide (BOX) in the silicon wafer below a silicon body; and reducing a thickness of the silicon body...
7407867 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate  
A method for producing a semiconductor structure that includes at least one useful layer on a substrate. This method includes providing a source substrate with a zone of weakness therein that...
7402465 Method of fabricating single-crystal silicon film and method of fabricating TFT adopting the same  
A method for forming a single-crystal silicon film of high quality is provided. The method includes the operations of: growing single-crystal silicon to a predetermined thickness of a crystal...
7399680 Method and structure for implanting bonded substrates for electrical conductivity  
A partially completed multi-layered substrate, e.g., silicon on silicon. The substrate has a thickness of material from a first substrate. The thickness of material comprises a first face region....
7399652 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained  
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor...
7393774 Method of fabricating microconnectors  
A method of fabricating microconnectors. A wafer is provided, and a dielectric layer is formed on a first surface of the wafer. The dielectric layer is bonded to a support wafer, and a thinning...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7393714 Method of manufacturing external force detection sensor  
A method of manufacturing an external force detection sensor in which a sensor element is formed by through-hole dry etching of an element substrate, and an electrically conductive material is used...
7393700 Low temperature methods of etching semiconductor substrates  
Methods of etching a semiconductor substrate may include providing a first gas that is chemically reactive with respect to the semiconductor substrate, and while providing the first gas, providing...
7387946 Method of fabricating a substrate for a planar, double-gated, transistor process  
A semiconductor fabrication process includes forming a sacrificial layer on a substrate of a donor wafer and implanting hydrogen ions into the substrate through the sacrificial layer to create a...
7387944 Method for low temperature bonding and bonded structure  
A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of...
7384812 Method of manufacturing a semiconductor device with light shading means  
The semiconductor device according to this invention is characterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a...
7384811 Method of separating semiconductor wafer, and separating apparatus using the same  
With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting...
7381630 Method for integrating MEMS device and interposer  
A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially...
7381628 Process of making a microtube and microfluidic devices formed therewith  
A process for producing a tube suitable for microfluidic devices. The process uses first and second wafers, each having a substantially uniform doping level. The first wafer has a first portion...
7381285 Manufacturing method of a device  
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered...
7378332 Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method  
Provided are a bonding substrate whose defective bonding portion in a peripheral region of an active layer has been removed by a polishing applied thereto after a surface grinding, a manufacturing...
7375008 Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof  
The invention relates to a method of re-forming a useful layer on a donor wafer after taking off a useful layer formed of a material chosen from among semiconductor materials. The donor wafer...
7375007 Method of manufacturing a semiconductor device  
To provide a penetration electrode having high quality. A method of manufacturing a semiconductor device includes the following steps: (a) forming a concave part from a first face of a...
7371662 Method for forming a 3D interconnect and resulting structures  
A method for forming three-dimensional (3D) integrated circuits includes providing a first wafer comprising a silicon layer on a top surface of the first wafer, providing a second wafer comprising...
7371660 Controlled cleaving process  
A technique for forming a film of material ( 12 ) from a donor substrate ( 10 ). The technique has a step of introducing energetic particles ( 22 ) through a surface of a donor substrate ( 10 ) to...
7368310 Light generating semiconductor device and method of making the same  
In a method of making a semiconductor light generating device, a GaN-based semiconductor portion is formed on a GaN or AlGaN substrate. The GaN-based semiconductor portion includes a light...
7368062 Method and apparatus for a low parasitic capacitance butt-joined passive waveguide connected to an active structure  
Undoped layers are introduced in the passive waveguide section of a butt-joined passive waveguide connected to an active structure. This reduces the parasitic capacitance of the structure.
7364974 Double gate FET and fabrication process  
A method of fabricating a double gate FET on a silicon substrate includes the steps of sequentially epitaxially growing a lower gate layer of crystalline rare earth silicide material on the...
7364954 Method for manufacturing semiconductor device  
The present invention provides a manufacturing method of a semiconductor device at low cost and with high reliability. According to one feature of a method for manufacturing a semiconductor device...
7361528 Germanium infrared sensor for CMOS imagers  
A method of fabricating a germanium infrared sensor for a CMOS imager includes preparation of a donor wafer, including: ion implantation into a silicon wafer to form a P+ silicon layer; growing an...
7358593 Microfabricated miniature grids  
A grid structure and method for manufacturing the same. The grid is used for gating a stream of charged particles in certain types of particle measurement instruments, such as ion mobility...
7358152 Wafer bonding of thinned electronic materials and circuits to high performance substrate  
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the...
7354798 Three-dimensional device fabrication method  
A method is described for fabricating a three-dimensional integrated device including a plurality of vertically stacked and interconnected wafers. Wafers ( 1, 2, 3 ) are bonded together using...
7348275 Processing method for semiconductor wafer  
A processing method for a semiconductor wafer which is generally circular, and which has on the face thereof an annular surplus region present in an outer peripheral edge portion of the face, and a...
7348262 Method for fabricating module of semiconductor chip  
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump;...
7348261 Wafer scale thin film package  
A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple...
7348252 Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches  
A method for forming a bonded SOI wafer is provided in which a first wafer having a single-crystal semiconductor region has a first dielectric layer disposed at an outer surface of the first wafer...
7344959 Metal filled through via structure for providing vertical wafer-to-wafer interconnection  
A method of fabricating a through via connection useful in providing a vertical wafer-to-wafer interconnect structure is provided as well as the vertical interconnect structure that is formed by...
7344936 Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production  
A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating ( 6 ) as a self-supporting...
7338896 Formation of deep via airgaps for three dimensional wafer to wafer interconnect  
A method for forming deep via airgaps in a semiconductor substrate is disclosed comprising the steps of patterning a hole in the substrate, partly fill said hole with a sacrificial material (e.g....
7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device  
An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on...
7338882 Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same  
A method of fabricating a nano silicon on insulator (SOI) wafer having an excellent thickness evenness without performing a chemical mechanical polishing (CMP) and a wafer fabricated by the same...
7335575 Semiconductor constructions and semiconductor device fabrication methods  
A method of fabricating a semiconductor device includes etching a substrate to form a recess, the substrate being formed on a backside of a semiconductor wafer, forming pores in the substrate in an...
7335574 Semiconductor device and manufacturing method of the same  
Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface...
7335572 Method for low temperature bonding and bonded structure  
A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface...
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