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7629666 |
Method and structure for implanting bonded substrates for electrical conductivity
A partially completed multi-layered substrate, e.g., silicon on silicon. The substrate has a thickness of material from a first substrate. The thickness of material comprises a first face region....
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7626257 |
Semiconductor devices and methods of manufacture thereof
Vertically stacked integrated circuits and methods of fabrication thereof are disclosed. Deep vias that provide vertical electrical connection for vertically stacked integrated circuits are formed...
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7625810 |
Wafer processing method
A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are...
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7625809 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an...
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7622362 |
Method for manufacturing semiconductor device
According to the present invention, there is provided a method for manufacturing a semiconductor device that includes preparing a first semiconductor substrate and a second semiconductor substrate,...
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7622361 |
Method for manufacturing semiconductor device
It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire...
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7615468 |
Methods for making substrates and substrates formed therefrom
A method for making substrates for use in optics, electronics, or opto-electronics. The method may include transferring a seed layer onto a receiving support and depositing a useful layer onto the...
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7615467 |
Method for manufacturing SOI wafer
This method for manufacturing an SOI wafer includes: a step of subjecting a mirror-polished active layer wafer to a rapid thermal annealing treatment; a step of forming insulating films in a front...
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7615466 |
Method for producing a semiconductor-on-insulator structure
The invention relates to a process of treating a structure for electronics or optoelectronics, wherein the structure that has a substrate, a dielectric layer having a thermal conductivity...
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7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked...
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7615394 |
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array pads arrayed on an outer side of the...
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7608483 |
Method of machining wafer
A method of machining a wafer, wherein a wafer provided with devices each having a low dielectric constant insulating film (low-k film) stacked on the face side thereof is divided into the...
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7605054 |
Method of forming a device wafer with recyclable support
A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material...
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7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
A semiconductor wafer back-surface grinding method, for grinding a back surface of a semiconductor wafer, an opposed front surface of the semiconductor wafer being adhered to a support base...
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7601217 |
Method of fabricating an epitaxially grown layer
A method of forming an epitaxially grown layer, preferably by providing a region of weakness in a support substrate and transferring a nucleation portion to the support substrate by bonding. A...
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7595257 |
Process of forming an electronic device including a barrier layer
An electronic device can include a substrate ( 12 ) having a primary surface ( 14 ), a second surface ( 16, 22 ) opposite the primary surface ( 14 ), and an electrode ( 50 ). In one embodiment, the...
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7592239 |
Flexible single-crystal film and method of manufacturing the same
The present invention relates to a flexible single-crystal film and a method of manufacturing the same from a single-crystal wafer. That is, the present invention can manufacture a...
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7592235 |
Semiconductor device including semiconductor memory element and method for producing same
A wafer, in which a plurality of rectangular regions are defined on the face of the wafer by streets arranged in a lattice pattern, and a semiconductor memory element is disposed in each of the...
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7582540 |
Method for manufacturing SOI wafer
This method for manufacturing an SOI wafer includes: a step of forming insulating films in a front surface and a mirror-polished rear surface of an active layer wafer; a step of removing the...
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7579259 |
Simplified method of producing an epitaxially grown structure
Method to produce a structure consisting of depositing a material by columnar epitaxy on a crystalline face of a substrate ( 2 ), of continuing so that the columns ( 4 ) give a continuous layer ( 5...
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7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step,...
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7566631 |
Low temperature fusion bonding with high surface energy using a wet chemical treatment
Described is a wet chemical surface treatment involving NH 4 OH that enables extremely strong direct bonding of two wafer such as semiconductors (e.g., Si) to insulators (e.g., SiO 2 ) at low...
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7563691 |
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding...
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7560322 |
Method of making a semiconductor structure for high power semiconductor devices
A substrate arrangement for high power semiconductor devices includes a SiC wafer having a Si layer deposited on a surface of the SiC wafer. An SOI structure having a first layer of Si, an...
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7560310 |
Semiconductor constructions and semiconductor device fabrication methods
A method of fabricating a semiconductor device includes etching a substrate formed on a backside of a semiconductor wafer to form a recess in the substrate, and forming a sputter film in the...
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7560305 |
Apparatus and method for high density multi-chip structures
Devices and methods are described including a multi-chip assembly. Embodiments of multi-chip assemblies are provided that uses both lateral connection structures and through chip connection...
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7553743 |
Wafer bonding method of system in package
A method of bonding a wafer in a system in package is provided. A plating layer is formed on each of a first semiconductor substrate and a second semiconductor substrate. The plating layers are...
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7553695 |
Method of fabricating a package for a micro component
Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch...
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7547609 |
Method and structure for implanting bonded substrates for electrical conductivity
A process for forming multi-layered substrates, e.g., silicon on silicon. The process includes providing a first substrate, which has a thickness of material to be removed. The thickness of...
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7547579 |
Underfill process
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an...
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7544964 |
Method for fabricating thin layer device
A method for producing a thin layer device such as a superconductive device excellent in mechanical strength and useful as a submillimeter band receiver is provided. The thin layer device is...
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7541264 |
Temporary wafer bonding method for semiconductor processing
A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two...
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7541263 |
Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized
The invention relates to a method for producing a semiconducting structure on a semiconducting substrate, one surface of which has a topology, this method including:
a) a step for forming a...
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7541224 |
Active matrix type display device and method of manufacturing the same
A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention...
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7538010 |
Method of fabricating an epitaxially grown layer
A method of forming an epitaxially grown layer by providing a support substrate that includes a region of weakness therein to define a support portion and a remainder portion on opposite sides of...
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7534685 |
Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor
A method for fabrication of a monolithically integrated SOI substrate capacitor has the steps of: forming an insulating trench ( 14 ), which reaches down to the insulator ( 11 ) and surrounds a...
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7534641 |
Method for manufacturing a micro-electro-mechanical device
A technique for manufacturing a micro-electro-mechanical (MEM) device includes a number of steps. Initially, a first wafer is provided. Next, a bonding layer is formed on a first surface of the...
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7531430 |
Method for producing a semiconductor-on-insulator structure
The invention relates to a process of treating a structure for electronics or optoelectronics, wherein the structure that has a substrate, a first oxide layer, an intermediate layer, a second oxide...
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7531428 |
Recycling the reconditioned substrates for fabricating compound material wafers
Methods for fabricating compound material wafers are described. An embodiment of the method includes providing a donor substrate having a surface, forming a weakened zone in the donor substrate to...
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7531425 |
Method of fabricating bonded wafer
This invention relates to a method of fabricating a bonded wafer 39 in which a bond wafer 31 and a base wafer 32 , both of which are composed of silicon single crystal, are bonded while...
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7528054 |
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
A semiconductor component includes a thin semiconductor chip and a wiring substrate that carries the semiconductor chip on its upper side and includes external contacts on its underside and/or its...
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7528053 |
Three-dimensional package and method of making the same
A three-dimensional package and a method of making the same including providing a wafer; forming at least one blind hole in the wafer; forming an isolation layer on the side wall of the blind hole;...
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7521384 |
Method and apparatus for peeling surface protective film
A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the...
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7521363 |
MEMS device with non-standard profile
A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a...
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7521323 |
Method of fabricating a double gate field effect transistor device, and such a double gate field effect transistor device
The present invention discloses a method of forming a double gate field effect transistor device, and such a device formed with the method. One starts with a semiconductor-on-insulator substrate,...
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7514341 |
Finishing process for the manufacture of a semiconductor structure
The invention relates to a process for the formation of a structure comprising a thin layer made of semiconductor material on a substrate, including the steps of providing a zone of weakness in a...
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7514291 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies
Methods relating to singulation of dice from semiconductor wafers. Trenches or channels are formed in the bottom surface of a semiconductor wafer, corresponding in location to wafer streets. The...
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7510950 |
Method for manufacturing semiconductor device
It is an object of the present invention to provide a method for manufacturing a semiconductor device, which is flexible and superiority in physical strength. As a method for manufacturing a...
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7510945 |
Element formation substrate, method of manufacturing the same, and semiconductor device
A support-side substrate having a thermal oxide film on the major surface is bonded to an active-layer-side substrate having a thermal oxide film on the major surface while making the major...
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7507670 |
Silicon electrode assembly surface decontamination by acidic solution
Methods for cleaning silicon surfaces of electrode assemblies by efficiently removing contaminants from the silicon surfaces without discoloring the silicon surfaces using an acidic solution...
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