|
Match
|
Document |
Document Title |
|
|
7611965 |
Semiconductor device and manufacturing method thereof
It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a...
|
|
|
7608521 |
Producing SOI structure using high-purity ion shower
Disclosed are methods for making SOI and SOG structures using purified ion shower for implanting ions to the donor substrate. The purified ion shower provides expedient, efficient, low-cost and...
|
|
|
7608471 |
Method and apparatus for integrating III-V semiconductor devices into silicon processes
Method and apparatus for fabricating semiconductor devices, for example, III-V semiconductor devices, having a desired substrate, for example, a silicon substrate. A method for fabricating...
|
|
|
7605056 |
Method of manufacturing a semiconductor device including separation by physical force
The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire)...
|
|
|
7605055 |
Wafer with diamond layer
A method of manufacturing a wafer using a support substrate of a crystalline material. On the surface of the support substrate, a layer of a diamond is grown to form a first wafer in combination...
|
|
|
7605054 |
Method of forming a device wafer with recyclable support
A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material...
|
|
|
7605051 |
Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same
A method for forming an internal electrode pattern having a predetermined shape includes the following: a step of forming a conductive layer by applying a metal paste on a first support, the metal...
|
|
|
7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
|
|
|
7601614 |
Manufacturing method of silicon on insulator wafer
A process for manufacturing a silicon on insulator (SOI) substrate is described. The process includes forming a buried oxidation layer in a first wafer and forming an oxidation layer on the first...
|
|
|
7601613 |
Manufacturing method of bonded wafer
In a first ion implantation step (a1), a delamination-intended ion implantation layer 3 is formed by implanting ions at a dosage less than a critical dosage from the insulating film 2 side of a...
|
|
|
7601611 |
Method of fabricating a semiconductor hetero-structure
A method of fabricating a structure that includes at least one semiconductor material for applications in microelectronics, optoelectronics or optics. The method includes transferring, onto a...
|
|
|
7598115 |
Method of fabricating organic light emitting display
A method of fabricating a donor substrate for a laser induced thermal imaging (LITI) process. A base substrate is prepared. A light-to-heat conversion layer is formed on the base substrate. A...
|
|
|
7595256 |
Semiconductor device, method of manufacturing thereof, and method of manufacturing base material
It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate...
|
|
|
7592239 |
Flexible single-crystal film and method of manufacturing the same
The present invention relates to a flexible single-crystal film and a method of manufacturing the same from a single-crystal wafer. That is, the present invention can manufacture a...
|
|
|
7588998 |
Method for producing a semiconductor element
A method for producing a semiconductor component, in particular a thin-film component, a semiconductor layer being separated from a substrate by irradiation with a laser beam having a plateaulike...
|
|
|
7588994 |
Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain
The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
|
|
|
7588969 |
Method for manufacturing semiconductor device, and semiconductor device
The present invention provides a manufacturing method of a thinned semiconductor device with high reliability at low cost and a semiconductor device manufactured by the method. A peeling layer, a...
|
|
|
7585749 |
Methods of forming a layer of material on a substrate and structures formed therefrom
A method for making a structure which may have at least one layer on a supporting substrate. The method includes at least the steps for forming from the supporting substrate an intermediate...
|
|
|
7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a...
|
|
|
7579654 |
Semiconductor on insulator structure made using radiation annealing
Systems and methods for and products of a semiconductor-on-insulator (SOI) structure including subjecting at least one unfinished surface to a laser annealing process. Production of the SOI...
|
|
|
7579621 |
Integrated BST microwave tunable devices using buffer layer transfer method
A BST microwave device includes a single crystal oxide wafer. A silicon dioxide layer is formed on the single crystal oxide layer. A silicon substrate is bonded on the silicon dioxide layer. A BST...
|
|
|
7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
|
|
|
7579259 |
Simplified method of producing an epitaxially grown structure
Method to produce a structure consisting of depositing a material by columnar epitaxy on a crystalline face of a substrate ( 2 ), of continuing so that the columns ( 4 ) give a continuous layer ( 5...
|
|
|
7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step,...
|
|
|
7575988 |
Method of fabricating a hybrid substrate
A method of fabricating a hybrid substrate by direct bonding of donor and receiver substrates where each substrate has a respective front face and surface, with the front face of the receiver...
|
|
|
7575983 |
Method for fabricating a device with flexible substrate and method for stripping flexible-substrate
A method for fabricating a device with flexible substrate includes providing a rigid substrate. Then, a flexible substrate layer is directly formed on the rigid substrate, wherein the flexible...
|
|
|
7575982 |
Stacked-substrate processes for production of nitride semiconductor structures
Methods are provided of fabricating compound nitride semiconductor structures. A group-III precursor and a nitrogen precursor are flowed into a processing chamber to deposit a first layer over a...
|
|
|
7572714 |
Film taking-off method
The invention relates to a method of producing a film intended for applications in electronics, optics or optronics starting from an initial wafer, which includes a step of implanting atomic...
|
|
|
7569421 |
Through-hole via on saw streets
A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide...
|
|
|
7569409 |
Isolation structures for CMOS image sensor chip scale packages
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support...
|
|
|
7566633 |
Semiconductor device and method for manufacturing the same
An object of the present invention is to provide a semiconductor device which has flexibility and resistance to a physical change such as bending and a method for manufacturing the semiconductor...
|
|
|
7563694 |
Scribe based bond pads for integrated circuits
A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and...
|
|
|
7563693 |
Method for manufacturing semiconductor substrate and semiconductor substrate
A method for manufacturing a semiconductor substrate comprises the steps of: forming a gate oxide film as an insulating layer on the surface of a semiconductor substrate; implanting boron ions for...
|
|
|
7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit force
A substrate gap adjusting device adjusts a gap between first and second substrates in a composite substrate. In the substrate gap adjusting device, the composite substrate includes the first...
|
|
|
7547579 |
Underfill process
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an...
|
|
|
7544587 |
Wafer dividing method and wafer dividing apparatus
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to...
|
|
|
7544585 |
Structure of strained silicon on insulator and method of manufacturing the same
Provided is a strained SOI structure and a method of manufacturing the strained SOI structure. The strained SOI structure includes an insulating substrate, a SiO 2 layer formed on the insulating...
|
|
|
7541262 |
Method for producing semiconductor device
The present invention contemplates preventing clogging of a dicer for forming separation trenches in a semiconductor wafer, and as well improving the yield of a semiconductor device cut out of the...
|
|
|
7541257 |
Semiconductor device having three-dimensional construction and method for manufacturing the same
A semiconductor device includes: a silicon substrate; and a silicon oxide film disposed on the silicon substrate. The silicon oxide film includes a part, which separates from a surface of the...
|
|
|
7540077 |
Method for bonding slider row bars for photolithography process
A method for bonding slider row bars for photolithography process, includes steps of: providing a first carrier plate having a sticky surface; providing slider row bars each having a first surface...
|
|
|
7537949 |
Optoelectronic substrate and methods of making same
A method of producing an optoelectronic substrate by detaching a thin layer from a semi-conducting nitride substrate and transferring it to an auxiliary substrate to provide at least one...
|
|
|
7534702 |
Method for manufacturing a semiconductor device
An efficient mass-production method of very small devices that can receive or transmit data in touch, preferably, out of touch is provided by forming an integrated circuit made of a thin film over...
|
|
|
7534701 |
Process for transferring a layer of strained semiconductor material
A process for preparing a semiconductor wafer with a strained layer having an elevated critical thickness. A first wafer having a strained layer of a semiconductor material on a matching layer is...
|
|
|
7534700 |
Method of fabricating a semiconductor device having a film in contact with a debonded layer
A semiconductor device in which degradation due to permeation of water and oxygen can be limited, e.g., a light emitting device having an organic light emitting device (OLED) formed on a plastic...
|
|
|
7534699 |
Separating and assembling semiconductor strips
A method and an apparatus for separating elongated semiconductor strips from a wafer of semiconductor material are disclosed. Vacuum is applied to the face of each semiconductor strip forming an...
|
|
|
7531429 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
Embodiments of the invention use silicon on porous silicon wafers to produce a reduced-thickness IC device wafers. After device manufacturing, a temporary support is bonded to the device layer. The...
|
|
|
7531428 |
Recycling the reconditioned substrates for fabricating compound material wafers
Methods for fabricating compound material wafers are described. An embodiment of the method includes providing a donor substrate having a surface, forming a weakened zone in the donor substrate to...
|
|
|
7528054 |
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
A semiconductor component includes a thin semiconductor chip and a wiring substrate that carries the semiconductor chip on its upper side and includes external contacts on its underside and/or its...
|
|
|
7528053 |
Three-dimensional package and method of making the same
A three-dimensional package and a method of making the same including providing a wafer; forming at least one blind hole in the wafer; forming an isolation layer on the side wall of the blind hole;...
|
|
|
7528000 |
Method of fabricating optical device caps
A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the...
|