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7064045 |
Laser based method and device for forming spacer structures for packaging optical reflection devices
A method for forming a patterned silicon bearing material, e.g., silicon substrate. The method includes providing a silicon substrate, which has a surface region and a backside region. The method...
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7063993 |
Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape
A method of fabricating devices incorporating microelectromechanical systems (MEMS) using a UV curable tape includes providing a substrate ( 14 ) with a MEMS layer ( 18 ) arranged on one side ( 12...
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7064046 |
Manufacturing method of semiconductor device
The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the...
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7064014 |
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises...
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7060591 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature
The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a...
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7060592 |
Image sensor and fabricating method thereof
An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second...
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7060153 |
Display device and method of manufacturing the same
To provide a technique for manufacturing a high-performance display device by employing a plastic substrate. A peeling layer is formed on an element-forming substrate, and a semiconductor element...
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7060528 |
Method for mounting a semiconductor element to an interposer by compression bonding
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been...
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7056751 |
Method and system for increasing yield of vertically integrated devices
A method for increasing the manufacturing yield for a vertically integrated device is disclosed. The devices are composed of one or more multiple layer die. The number of functioning layers of each...
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7056649 |
Process for producing a tool insert for injection molding a part with two-stage microstructures
A process for producing microstructured tool insert for injection molding a part, the part being fabricated of a synthetic material, a metal or a ceramic material and including an arrangement of...
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7056810 |
Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
According to the package and the method for manufacturing the package of the present invention, a chip can be formed extremely to be thin, and manufactured at lower cost and higher throughput, and...
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7056809 |
Method for ion treating a semiconductor material for subsequent bonding
The invention relates to a manufacturing process of detachable substrates, the said process comprising a surface condition adjustment treatment of at least one of two layers of material, followed...
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7056789 |
Production method for semiconductor substrate and production method for field effect transistor and semiconductor substrate and field effect transistor
The present invention relates to a semiconductor substrate production method, field effect transistor production method, semiconductor substrate and field effect transistor which, together with...
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7052948 |
Film or layer made of semi-conductive material and method for producing said film or layer
The invention relates to a film or a layer made of semi-conducting material with low defect density in the thin layer, and a SOI-disk with a thin silicon layer exhibiting low surface roughness,...
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7051418 |
Method of measuring weak gas flows
Firstly, a supporting frame is produced, whose opening is spanned by an auxiliary layer flush on one side. Following the production of microstructures, flat parts or membranes on the common plane...
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7052978 |
Arrangements incorporating laser-induced cleaving
Arrangements incorporating laser-induced cleaving.
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7051424 |
Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension
A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension.
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7049211 |
In-situ-etch-assisted HDP deposition using SiF4
A process is provided for depositing an undoped silicon oxide film on a substrate disposed in a process chamber. A process gas that includes SiF 4 , a fluent gas, a silicon source, and an oxidizing...
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7049624 |
Member and member manufacturing method
A porous structure with high uniformity is provided even when evaluated at a high resolution (high evaluation standard) of several or several ten nm or less. By applying this porous structure to...
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7049208 |
Method of manufacturing of thin based substrate
Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build...
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7049175 |
Method of packaging RF MEMS
A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other...
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7045442 |
Method of separating a release layer from a substrate comprising hydrogen diffusion
The present invention is a separation method for easy separation of an allover release layer with a large area. Further, the present invention is the separating method that is not subjected to...
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7045392 |
Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
A method of fabricating a semiconductor device comprises the steps of: preparing a tape carrier 10 on which is formed lines of a plurality of bonding portions 14 across the width thereof, in a...
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7045441 |
Method for forming a single-crystal silicon layer on a transparent substrate
A method for forming a, single-crystal silicon layer on a transparent substrate. A transparent substrate having an amorphous silicon layer formed thereon and a silicon wafer having a hydrogen ion...
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7045438 |
Light emitting device, semiconductor device, and method of fabricating the devices
A semiconductor device in which degradation due to permeation of water and oxygen can be limited, e.g., a light emitting device having an organic light emitting device (OLED) formed on a plastic...
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7041536 |
Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor...
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7041577 |
Process for manufacturing a substrate and associated substrate
A process for producing a substrate is described. The process includes providing an assembly having a first layer weakly bonded to a temporary support at an interface therebetween. At least a...
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7041576 |
Separately strained N-channel and P-channel transistors
An integrated circuit with a first plurality of transistors formed on a first wafer and second plurality of transistors formed on a second wafer. At least a substantial majority of the transistor...
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7042105 |
Methods for dicing wafer stacks to provide access to interior structures
Methods for dicing water stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first...
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7037806 |
Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride
A method of fabricating a semiconductor-on-insulator semiconductor substrate is disclosed that includes providing first and second semiconductor substrates. Either oxygen or nitrogen is introduced...
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7033912 |
Silicon carbide on diamond substrates and related devices and methods
A method of forming a high-power, high-frequency device in wide bandgap semiconductor materials with reduced junction temperature, higher power density during operation and improved reliability at...
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7033914 |
Method of making a package structure by dicing a wafer from the backside surface thereof
The present invention relates to a method of making a package structure by dicing a wafer from the backside surface thereof comprising: (a) providing a first wafer having a active surface, a...
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7033910 |
Method of fabricating multi layer MEMS and microfluidic devices
A method for fabricating multi layer microelectromechanical and microfluidic devices is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with...
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7035489 |
Thin film electro-optical deflector device and a method of fabrication of such a device
An electro-optical deflector device, having a thin ferroelectric oxide film and a method of fabricating the deflector device is described. One embodiment of a thin film electro-optic deflector...
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7029548 |
Method for cutting a block of material and forming a thin film
A process for cutting out a block of material includes a step of introducing ions in the block thereby forming an embrittled zone and defining at least one superficial part of the block. The method...
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7026224 |
Method for dicing semiconductor chips and corresponding semiconductor chip system
A method for dicing semiconductor chips and a corresponding semiconductor chip system are described. The met-hod includes the steps: provision of a substrate having an upper substrate level, a...
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7022585 |
Method for making thin film devices intended for solar cells or silicon-on-insulator (SOI) applications
In one inventive aspect, a thin film device is manufactured by (a) forming a porous semiconductor layer in the form of a thin film on an original substrate, the formation being immediately followed...
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7022586 |
Method for recycling a substrate
The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing...
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7018910 |
Transfer of a thin layer from a wafer comprising a buffer layer
A process for producing a structure of a thin layer of semiconductor material obtained from a composite structure donor wafer. The donor wafer includes a lattice parameter matching layer of a...
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7018909 |
Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
The invention relates to methods of forming a relaxed or pseudo-relaxed layer on a substrate, wherein the relaxed layer may be a semiconductor material. An implementation of the method includes...
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7015118 |
Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line
A silicon wafer 50 including a plurality of semiconductor devices patterned on a top surface thereof as a result of a wafer production process is prepared. A transparent film is applied on the...
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7015117 |
Methods of processing of gallium nitride
A method for improving thermal dissipation in large gallium nitride light emitting diodes includes replacing sapphire with a better thermal conductor resulting in more efficient removal of thermal...
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7012319 |
System for integrating a circuit on an isolation layer and method thereof
A method for integrating a system on an isolation layer. A first isolation substrate including a first circuit deposition region and a first substrate-combining region, and a second isolation...
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7005319 |
Global planarization of wafer scale package with precision die thickness control
In accordance with the present invention, a method for producing at least two different chips with a controlled total chip thickness such that when these chips are placed into a corresponding...
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7005324 |
Method of fabricating stacked semiconductor chips
A groove is formed on a semiconductor substrate having integrated circuits and electrodes from a first surface. An insulating layer is formed on an inner surface of the groove. A conductive layer...
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7001826 |
Wafer with a relaxed useful layer and method of forming the wafer
A process for forming a useful layer ( 6 ) from a wafer ( 10 ), the wafer ( 10 ) comprising a supporting substrate ( 1 ) and a strained layer ( 2 ) that are chosen respectively from crystalline...
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6998329 |
SOI wafer producing method, and wafer separating jig
In the process of fabricating an SOI wafer based on the Smart Cut® Process, a stack 34 of an SOI wafer 39 and a residual wafer 38 are separated into the individual wafers using a wafer...
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6995075 |
Process for forming a fragile layer inside of a single crystalline substrate
Process for forming a fragile layer inside of a single crystalline substrate near one of the substrate surfaces. The fragile layer contains hydrogen mostly in form of hydrogen platelets oriented in...
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6995634 |
Surface-acoustic-wave component adapted to electronic circuit and device, and manufacturing method therefor
A surface-acoustic-wave component that comprises a first piezoelectric layer composed of zinc oxide (ZnO), a second piezoelectric layer composed of lithium niobate (LiNbO 3 ), and a protective...
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6991995 |
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer
A method of producing a semiconductor structure having at least one support substrate and an ultrathin layer. The method includes bonding a support substrate to a source substrate, detaching a...
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