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6759310 |
Method for making a semiconductor substrate comprising a variant porous layer
A semiconductor substrate includes a porous semiconductor having: a porous layer, with an impurity concentration on varying in the depth direction, or having a porous semiconductor containing an...
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6747725 |
Device for cutting liquid crystal display panel and method for cutting using the same
A device for cutting a liquid crystal display panel and a method for cutting using the same are disclosed in the present invention. The device includes a first scribing unit having first and second...
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6746889 |
Optoelectronic device with improved light extraction
An improved method for producing optoelectronic devices such as light emitting diodes or laser diodes is provided. Light emitting diodes or laser diodes are provided with improved light extraction....
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6746898 |
Integrated chip package structure using silicon substrate and method of manufacturing the same
An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon...
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6746559 |
Method and apparatus for separating composite member using fluid
To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a...
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6743661 |
Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts
An apparatus and method for flexibly bonding an integrated circuit package to a printed circuit board are provided. The apparatus includes a semiconductor having first and second sides, where the...
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6743662 |
Silicon-on-insulator wafer for RF integrated circuit
An RF semiconductor device is fabricated from a starting substrate comprising a polysilicon handle wafer, a buried oxide layer over the polysilicon handle wafer, and a silicon layer over the oxide...
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6740567 |
Laminating method for forming integrated circuit microelectronic fabrication
Within a method for fabricating a semiconductor integrated circuit microelectronic fabrication there is first provided a first semiconductor substrate. There is then formed over the first...
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6737300 |
Chip scale package and manufacturing method
A chip scale package mainly comprises a substrate attached to the active surface of a semiconductor chip through an anisotropic conductive adhesive film (ACF). The substrate is provided with a...
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6727422 |
Heat sink/heat spreader structures and methods of manufacture
A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic...
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6727111 |
Process for making electronic chip device incorporating plural elements
A multi-element electronic chip device is manufactured which has a plurality of elements such as film resistors 2 or the like on one insulating substrate 1 by carrying out a step of performing...
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6727549 |
Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer
A method of fabricating a film of active devices is provided. First damaged regions are formed, in a substrate, underneath first areas of the substrate where active devices are to be formed. Active...
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6720246 |
Flip chip assembly process for forming an underfill encapsulant
A flip chip assembly process forming an underfill encapsulant. The method includes providing a chip having an active surface and a plurality of conductive bumps arranged in array with a...
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6720237 |
Method for manufacturing a semiconductor film
A method for manufacturing a semiconductor film includes a step of preparing a first member including a semiconductor substrate, a semiconductor layer, and a separation layer provided between the...
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6720640 |
Method for reclaiming delaminated wafer and reclaimed delaminated wafer
In a method for reclaiming a delaminated wafer produced as a by-product in the production of bonded wafer by the ion implantation and delamination method, at least ion-implanted layer on a...
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6720238 |
Method for manufacturing buried areas
A manufactured multi-layered silicon wafer with a buried insulating layer and buried areas with different parameters is formed by bonding together a first wafer and a second wafer. Before the...
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6713846 |
Multilayer high &kgr dielectric films
A new multilayer dielectric film for improving dielectric constant and thermal stability of gate dielectrics is provided. The multilayer dielectric film comprises a first layer formed of a metal...
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6709966 |
Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device
A semiconductor device comprising the bump containing magnetic body, magnetic body, the bump including non-magnetic body for at least partially covering the magnetic body, mixture of magnetic...
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6706547 |
Method of manufacturing a circuit device with trenches in a conductive foil
After conductive patterns are formed on the conductive foil every block by employing isolation trenches, conductive plating layers are arranged selectively on the conductive patterns. Therefore, it...
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6707160 |
Semiconductor device using substrate having cubic structure and method of manufacturing the same
A plurality of semiconductor chips bent along the outer circumferential surface of a cylindrical substrate are mounted to the outer circumferential surface of the substrate. The bumps of these...
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6707133 |
Semiconductor chip having an arrayed waveguide grating and module containing the semiconductor chip
On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a...
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6703254 |
Method for manufacturing semiconductor laser device
A semiconductor thin film including a well layer is laminated on a semiconductor substrate, the semiconductor substrate and the semiconductor thin film is cleaved, and a cleavage plane of the...
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6696352 |
Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer
A process for producing a multilayered substrate. In a first step, an adhesive layer is applied to a surface of a support substrate. Then a device substrate is placed into contact with the adhesive...
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6693023 |
Ion implantation method and ion implantation equipment
In an ion implantation method using an ion implantation equipment having an extraction electrode and a post accelerator, ion is uniformly implanted into a shallow region from the surface of a...
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6692981 |
Method of manufacturing a solar cell
A method of manufacturing a solar cell comprises interposing an intermediate layer containing p-type or n-type impurity between a silicon thin film and a support substrate, and heating all or part...
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6688948 |
Wafer surface protection method
In a wafer surface protection method, a protective film is formed on a front surface of a wafer before the wafer performs a potentially wafer process. The protective film is a non-adhesive layer....
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6686257 |
Method for transferring epitaxy layer
A method for transferring an epitaxy layer is provided. The method includes steps of (a) providing a first substrate, (b) forming a first epitaxy layer on the first substrate, (c) forming a masking...
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6682990 |
Separation method of semiconductor layer and production method of solar cell
The separation method of a semiconductor layer according to the present invention comprises separating a semiconductor layer and a semiconductor substrate at a separation layer formed therebetween,...
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6679964 |
Method for integrating image sensors with optical components
The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order...
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6677174 |
Method for patterning devices
The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. A first layer of organic materials is deposited over a substrate,...
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6673189 |
Method for producing a stable bond between two wafers
A method for producing a re-releasable bond between two wafers which is stable at high temperatures and mechanically stable is described. The two wafers to be bonded are placed one on top of the...
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6670212 |
Micro-machining
A method of fabricating a micro-mechanical sensor ( 101 ) comprising the steps for forming an insulating layer ( 6 ) onto the surface of a first wafer ( 4 ) bonding a second wafer ( 2 ) to the...
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6667252 |
Method of manufacturing compound semiconductor substrate
A compound semiconductor substrate is manufactured by forming a higher-quality compound semiconductor layer having a smaller number of crystalline defects on a single-crystal substrate, and...
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6664169 |
Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus
In a process for producing a semiconductor member, and a solar cell, making use of a thin-film crystal semiconductor layer, the process includes the steps of: (1) anodizing the surface of a first...
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6656820 |
Method for manufacturing a semiconductor device having a reliable thinning step
The present invention relates to a method for manufacturing a semiconductor device from a step of thinning a semiconductor device substrate to a step of dicing it, and a semiconductor device. The...
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6653207 |
Process for the production of electric part
A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor...
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6653205 |
Composite member separating method, thin film manufacturing method, and composite member separating apparatus
This invention relates to a composite member separating method in which a first member ( 1 ) having a separation layer ( 4 ) and a transfer layer ( 5 ) on the separation layer ( 4 ) is bonded to a...
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6645831 |
Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide
A wafer pair comprising a substantially defect-free germanium wafer and methods of making the same. The wafer pair comprises the substantially defect-free germanium wafer directly bonded to a...
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6645833 |
Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method
The invention relates to a method of manufacturing layer-like structures in which a material layer having hollow cavities, preferably a porous material layer, is produced on or out of a substrate...
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6638835 |
Method for bonding and debonding films using a high-temperature polymer
The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is...
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6638836 |
Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group
The manufacture process includes: forming a first wafer of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification...
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6627518 |
Method for making three-dimensional device
A method for making a three-dimensional device is disclosed. The method includes a step of forming a first cleaving layer, a first intermediate layer, and a first transferred layer on a first...
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6624050 |
Method of manufacturing semiconductor device
A plurality of solar batteries are provided between a first substrate and a second substrate. The first substrate and the second substrate are formed of, for example, a paper or a non-woven cloth,...
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6624047 |
Substrate and method of manufacturing the same
In a method of manufacturing a bonded substrate stack by bonding a first substrate having a porous layer to a second substrate to prepare a bonded substrate stack, and separating the bonded...
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6620646 |
Chip size image sensor wirebond package fabrication method
To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active...
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6618269 |
Discrete circuit component and process of fabrication
A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically...
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6607969 |
Method for making pyroelectric, electro-optical and decoupling capacitors using thin film transfer and hydrogen ion splitting techniques
A method for making a thin film device or pyroelectric sensor is provided. A film layer of thin film functional material is grown on a large diameter growth substrate. One or more protective layers...
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6607968 |
Method for making a silicon substrate comprising a buried thin silicon oxide film
A method for making a silicon substrate having a buried thin silicon oxide film is described. The method consists of: a) producing a first element having a first silicon body whereof the main...
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6607941 |
Process and structure improvements to shellcase style packaging technology
A variety of improved shell case style packages as well as shell case style wafer level packaging processes are described. Generally, in shell case style packaging, traces are patterned on the top...
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6605518 |
Method of separating composite member and process for producing thin film
To cause a crack at a fixed position in a separation layer, a method of separating a composite member includes the steps of forming a separation layer inside a composite member, forming inside the...
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