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6881650 |
Method for forming SOI substrate
A method for forming SOI substrates including a SOI layer containing germanium and a strained silicon layer disposed on the SOI layer, comprises forming a relaxed silicon-germanium layer on a first...
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6881649 |
Method of making device chips collectively from common material substrate
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate...
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6878608 |
Method of manufacture of silicon based package
A silicon based package (SBP) is formed starting with a thick wafer, which serves as the base for the SBP, composed of silicon which has a first surface and a reverse surface which are planar. Then...
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6878607 |
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a...
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6875672 |
Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate
A method for manufacturing a semiconductor device can prevent defective products resulting from a plating liquid when surfaces of protruded portions of penetration electrodes are subjected to...
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6875671 |
Method of fabricating vertical integrated circuits
A method for fabricating a vertical integrated circuit is disclosed. Integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed...
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6867067 |
Methods for fabricating final substrates
Methods for fabricating final substrates for use in optics, electronics, or optoelectronics are described. In an embodiment, the method includes forming a zone of weakness beneath a surface of a...
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6867479 |
Method for rewiring pads in a wafer-level package
A method for rewiring contact pads in the wafer-level package is inventively provided. In order to be able to make the terminals of the characterization pads available for testing in a wafer-level...
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6860963 |
Sample separating apparatus and method, and substrate manufacturing method
This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack ( 101 ) having a porous layer ( 101 b ) is supported by...
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6861335 |
Method for fabricating a semiconductor device that includes light beam irradiation to separate a semiconductor layer from a single crystal substrate
A spacer layer is formed on a single-crystal substrate and an epitaxially grown layer composed of a group III-V compound semiconductor layer containing a nitride or the like is further formed on...
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6861291 |
Method producing a contact connection between a semiconductor chip and a substrate and the contact connection
A contact connection between a semiconductor chip and a substrate has a conductive adhesive extending between each contact of the chip and the substrate. The conductive adhesive includes a matrix...
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6858517 |
Methods of producing a heterogeneous semiconductor structure
The present invention relates to a method for forming a heterogeneous assembly of first and second materials having different coefficients of thermal expansion. The method includes bonding a...
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6852561 |
Encapsulated surface acoustic wave component and method of collective fabrication
The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave...
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6849512 |
Thin gate dielectric for a CMOS transistor and method of fabrication thereof
A method of making a thin gate dielectric includes implanting a barrier substance into a region of a silicon substrate. A capacitance-increasing material is implanted into the silicon substrate. An...
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6849524 |
Semiconductor wafer protection and cleaning for device separation using laser ablation
A method of protecting and cleaning a semiconductor wafer using laser ablation includes the following steps: applies a protective coating on the side to be cut of a wafer with sapphire substrate,...
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6846723 |
Semiconductor substrate, semiconductor device, and processes of production of same
A process of production of a semiconductor substrate having a semiconductor layer on an insulating film formed on a substrate. The process comprises the steps of forming a groove of a predetermined...
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6844241 |
Fabrication of semiconductor structures having multiple conductive layers in an opening
In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and...
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6844244 |
Dual sided lithographic substrate imaging
A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that...
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6841408 |
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
A method of aligning a plurality of empty-spaced buried patterns formed in semiconductor monocrystalline substrates is disclosed. In an exemplary embodiment, high-temperature metal marks are formed...
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6841455 |
Scribe street seals in semiconductor devices and method of fabrication
An integrated circuit wafer, covered by a protective overcoat, comprising an array of integrated circuit chips bordered by seal regions and separated by dicing lines; at least two sets of...
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6838358 |
Method of manufacturing a wafer
The present invention relates to a method of manufacturing a wafer in which a heterogeneous material compound is detached at a pre-determined detachment area of the compound, and the compound is...
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6830958 |
Method of making chip scale package
A semiconductor wafer and a substrate are positioned facing each other, and electrode pads of individual semiconductor chips and connecting electrode pads of package bases are bonded...
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6821376 |
Method for separating two elements and a device therefor
A process and device for separating two semi-conductor substrate wafers along an interface. The process includes forming a cavity, and initiating separation by applying force to the interface...
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6821803 |
Method of manufacturing an electroluminescence display device
Substrates suitable to manufacture and products of a thin film semiconductor device are provide, by at first preparing a manufacturing substrate having a characteristic of being capable of enduring...
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6818531 |
Method for manufacturing vertical GaN light emitting diodes
A method for manufacturing vertical GaN light emitting diodes starts by forming a light emitting structure on a sapphire substrate, said light emitting structure including a first conductive GaN...
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6815255 |
Semiconductor device and manufacturing method thereof
A semiconductor device includes a first semiconductor chip provided with a first electrode on a first main surface and a second semiconductor chip provided with a second electrode on a second main...
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6815313 |
Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
A first substrate has a plurality of bumps and a second substrate has a plurality of openings at positions in registration with the plurality of bumps when the first and second substrates are...
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6815278 |
Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations
The invention provides integrated semiconductor devices that are formed upon an SOI substrate having different crystal orientations that provide optimal performance for a specific device....
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6815240 |
Thin film semiconductor device and manufacturing method thereof
Substrates suitable to manufacture and products of a thin film semiconductor device are provide, by at first preparing a manufacturing substrate having a characteristic of being capable of enduring...
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6812064 |
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate
Methods are provided to improve the adhesive bonding of a semiconductor die to a substrate through an adhesive paste by forming a layer of silicon dioxide on the back surface of the semiconductor...
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6808959 |
Semiconductor device having reinforced coupling between solder balls and substrate
A semiconductor device comprises a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the...
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6802926 |
Method of producing semiconductor thin film and method of producing solar cell using same
A method of producing a semiconductor thin film is provided. While a semiconductor thin film formed on a substrate is supported on a curved surface of a support member having the curved surface,...
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6797591 |
Method for forming a semiconductor device and a semiconductor device formed by the method
A method for forming a multi-layer semiconductor device ( 1 ) having a lower silicon layer ( 4 ), an intermediate silicon layer ( 5 ) within which micro-mirrors ( 10 ) are formed and an upper...
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6794273 |
Semiconductor device and manufacturing method thereof
A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable...
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6794751 |
Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
Multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies, in which a planarizing coating provides improved and continued surface protection to the circuit surface...
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6790690 |
Method of manufacturing a display device
ICs ( 20 ) are nearly separated from the semiconductor substrate ( 10 ) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) ( 3 ) which is...
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6787382 |
Method and system for singulating semiconductor components
A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage...
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6784022 |
Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits
A method of producing semiconductor devices including the steps of providing a semiconductor wafer of substantially uniform thickness 22 , providing a heat-radiating plate 22 , and attaching the...
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6780733 |
Thinned semiconductor wafer and die and corresponding method
A wafer ( 10 ) having integrated circuit elements formed therein is thinned and a first carrier ( 41 ) is adhered thereto. The first carrier ( 41 ) facilitates handling of the thinned wafer ( 30 )....
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6777309 |
Method for fabricating thin film transistor display device
The present invention makes it possible to transfer thin film devices such as integrated semiconductor and optical components from a first substrate onto a second substrate through a thermal...
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6777312 |
Wafer-level transfer of membranes in semiconductor processing
Techniques for transferring a membrane from one wafer to another wafer to form integrated semiconductor devices.
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6773534 |
Sample processing apparatus and method
This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack ( 101 ) having a porous layer ( 101 b ) is separated in two...
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6774477 |
Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device
A structure and method of stacking multiple semiconductor substrates of a composite semiconductor device are disclosed. The structure and method of stacking multiple semiconductor substrates of a...
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6770542 |
Method for fabricating semiconductor layers
A method is provided for fabricating a useful layer containing at least one semiconductor layer, in which the useful layer is separated from a carrier. In this case, the useful layer is applied to...
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6770507 |
Semiconductor wafer and method for producing the same
There is provided a novel bonded semiconductor wafer having a layered structure alternately stacked with semiconductor layers and insulator layers in two cycles or more and manufactured by means of...
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6767802 |
Methods of making relaxed silicon-germanium on insulator via layer transfer
Methods of forming a SiGe layer overlying an insulator are provided. A layer of SiGe is deposited on a substrate and implanted with ion to form a defect region within the SiGe material below its...
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6764924 |
Process for producing a tool insert for injection molding a part with single-stage microstructures
Process for producing a tool insert for injection molding a part which is produced from a synthetic material, a metal or a ceramic material and which comprises an arrangement of microstructures...
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6759273 |
Method and device for protecting micro electromechanical systems structures during dicing of a wafer
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS...
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6759310 |
Method for making a semiconductor substrate comprising a variant porous layer
A semiconductor substrate includes a porous semiconductor having: a porous layer, with an impurity concentration on varying in the depth direction, or having a porous semiconductor containing an...
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6747725 |
Device for cutting liquid crystal display panel and method for cutting using the same
A device for cutting a liquid crystal display panel and a method for cutting using the same are disclosed in the present invention. The device includes a first scribing unit having first and second...
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