Matches 201 - 250 out of 286 < 1 2 3 4 5 6 >
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6232140 Semiconductor integrated capacitive acceleration sensor and relative fabrication method  
The acceleration sensor is formed in a monocrystalline silicon wafer forming part of a dedicated SOI substrate presenting a first and second monocrystalline silicon wafer separated by an insulting...
6232150 Process for making microstructures and microstructures made thereby  
A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second...
6229158 Stacked die integrated circuit device  
A compound die may be formed of two dies each having face and back sides, said dies being connected with said dies in face to face alignment. A radiation communication system may be used to assist...
6210989 Ultra thin surface mount wafer sensor structures and methods for fabricating same  
There is disclosed a semiconductor sensor device comprising a semiconductor diaphragm member having a top surface coated with an oxide layer; P+ sensor elements fusion bonded to the oxide layer at...
6146917 Fabrication method for encapsulated micromachined structures  
A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond...
6143629 Process for producing semiconductor substrate  
In a process for producing a semiconductor substrate, comprising sealing surface pores of a porous silicon layer and thereafter forming a single-crystal layer on the porous silicon layer by...
6127243 Method for bonding two wafers  
The invention relates to a method for bonding two wafers, in which the wafers are placed over one another in such a way that a first surface of one wafer lies over a first surface of the other...
6114221 Method and apparatus for interconnecting multiple circuit chips  
A method for fabricating an interconnected multiple circuit chip structure by etching a first substrate to form protrusions on its surface. Then the protrusions are preferentially etched to produce...
6100107 Microchannel-element assembly and preparation method thereof  
A preparation method for an integrated assembly of a microchannel and an element is disclosed. In the preparation method of this invention, an element is prepared between a substrate and a...
6100109 Method for producing a memory device  
A memory device includes a multiplicity of memory cells disposed on a substrate for at least intermittent stable storage of at least two different information states. A writing device is associated...
6099677 Method of making microwave, multifunction modules using fluoropolymer composite substrates  
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite...
6090687 System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein  
A palladium contact and a gasket are formed on a first wafer. The gasket and contact are simultaneously engaged with a silicon layer of a second wafer. The wafers are then heated to a temperature...
6074891 Process for verifying a hermetic seal and semiconductor device therefor  
A method and device for verifying whether a cavity (16) enclosing a micromachined sensing structure (14) between a pair of wafers (10, 12) is hermetically sealed by detecting the presence of...
6057212 Method for making bonded metal back-plane substrates  
A method of forming a semiconductor structure, includes steps of growing an oxide layer on a substrate to form a first wafer, separately forming a metal film on an oxidized substrate to form a...
6036872 Method for making a wafer-pair having sealed chambers  
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited...
6030883 Method of bonding substrates, detector cell produced according to this method and optical measuring apparatus having this detector cell  
At a room temperature, cleaned glass substrates 8a, 8b are suitably positioned and placed one upon another. A hydrofluoric acid solution or alkaline solution 10 is dropped into the bonding...
6010591 Method for the releasable bonding and subsequent separation of reversibly bonded and polished wafers and also a wafer structure and wafer  
A method for the releasable bonding of at least two wafers (10, 12), for example of two silicon wafers (silicon discs), or of a silicon wafer and a glass wafer, or of a semiconductor wafer and a...
6001666 Manufacturing process of strain gauge sensor using the piezoresistive effect  
This invention relates to the manufacture of a strain gauge sensor using the piezoresistive effect, comprising a structure (1) made of a monocrystalline material acting as support to at least one...
6001673 Methods for packaging integrated circuit devices including cavities adjacent active regions  
A method for packaging an integrated circuit device includes forming a dielectric support layer on the surface of a substrate wherein the dielectric support layer includes an opening therein...
5955771 Sensors for use in high vibrational applications and methods for fabricating same  
A hermetically sealed sensor device having a glass member defining a mounting surface and base surface, the glass member including one or more pin apertures extending through the glass member from...
5956563 Method for reducing a transient thermal mismatch  
The invention relates to a method for reducing a transient thermal mismatch between a first component and a second component which are in mechanical contact with one another. The temperature of the...
5930651 Method of forming a semiconductor device having a plurality of cavity defined gating regions  
A P + layer is formed on the lower surface of an N - substrate, and recesses are defined in the upper surface of the N - substrate. Then, P + gate regions and bottom gate regions are formed...
5913134 Micromachined self packaged circuits for high-frequency applications  
A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of...
5897362 Bonding silicon wafers  
The specification describes a gettering technique for bonded wafers. The handle wafer is provided with a phosphorus predeposition to getter impurities from the handle wafer. The surface to be...
5882986 Semiconductor chips having a mesa structure provided by sawing  
Starting with a semiconductor wafer of known type including an internal, planar p-n junction parallel to major surfaces of the wafer, one of the wafer surfaces is covered with a masking layer of...
5883012 Method of etching a trench into a semiconductor substrate  
Trench structures (12,32,35,46) are formed in single crystal silicon substrates (10,30) that have either a (110) or (112) orientation. A selective wet etch solution is used that removes only the...
5866469 Method of anodic wafer bonding  
A process is provided for protecting, containing, and/or completing fragile microelectronic and microelectromechanical (MEM) structures on a low conductivity substrate during anodic wafer bonding...
5837562 Process for bonding a shell to a substrate for packaging a semiconductor  
A process for manufacturing a vacuum enclosure for a semiconductor device formed on a substrate with leads extending peripherally. Assembly of the enclosure is compatible with known batch...
5721162 All-silicon monolithic motion sensor with integrated conditioning circuit  
A motion sensor including a sensing wafer with a bulk micromachined sensing element, and a capping wafer on which is formed the conditioning circuitry for the sensor. The sensing and capping wafers...
5719069 One-chip integrated sensor process  
A method for concurrently forming a micromachine element and an integrated circuit device on the same substrate, such that fabrication of the micromachine element and the circuit device requires a...
5714690 Piezoresistive silicon pressure sensor manufacture implementing long diaphragms with large aspect ratios  
A form pressure sensor diaphragm and method of making that allows for formation of long rectangular plate structures in semiconducting materials, especially silicon. A plurality or multiplicity of...
5702619 Method for fabricating a high pressure piezoresistive transducer  
A method of fabricating a high pressure piezoresistive pressure transducer having a substantially linear pressure versus stress output over its full range of operation. The method involves bonding...
5702962 Fabrication process for a static induction transistor  
A semiconductor device, by which a base in which gates are buried can be formed by the junction of semiconductor substrates to each other at a lower temperature, and a fabrication process thereof...
5676851 Method of making a capacitance type acceleration sensor  
A capacitance acceleration sensor and method of making same are disclosed. A capacitance acceleration sensor includes a movable electrode etched from a silicon plate which is clamped between two...
5668033 Method for manufacturing a semiconductor acceleration sensor device  
On a silicon wafer there is formed a movable gate MOS transistor (sensing element: functional element). A bonding frame consisting of a silicon thin film is patterned around an element formation...
5660680 Method for fabrication of high vertical aspect ratio thin film structures  
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the...
5654226 Wafer bonding for power devices  
A method of processing wafers for power devices in which the wafer has a desired thickness less than the thickness necessary to provide mechanical support. A silicon wafer of the desired thickness...
5654220 Method of making a stacked 3D integrated circuit structure  
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
5620614 Printhead array and method of producing a printhead die assembly that minimizes end channel damage  
A method of fabricating a pagewidth array of buttable printheads reduces end channel damage. The wafer containing a plurality of arrays of channels is provided with V-grooves. A V-groove is...
5620929 Method of manufacturing a gas flow type sensor  
A gas flow type sensor with heat-wire bridge having an excellent performance which is attained by optimizing a sputtering process and a heat treatment process for forming a three-layer film...
5591679 Sealed cavity arrangement method  
This invention relates to a method for making sealed cavities on silicon wafer surfaces by anodic bonding and with electrically insulated conductors through the sealing areas to connect functional...
5585311 Capacitive absolute pressure sensor and method  
A capacitive absolute pressure sensor. The sensor includes a substrate having an electrode deposited thereon and a diaphragm assembly disposed on the substrate. As pressure increases, the diaphragm...
5576251 Process for making a semiconductor sensor with a fusion bonded flexible structure  
Fabrication of semiconductor devices with movable structures includes local oxidation of a wafer and oxide removal to form a depression in an elevated bonding surface. A second wafer is fusion...
5569355 Method for fabrication of microchannel electron multipliers  
The present invention discloses a method for constructing a completely micromachined MCP that is activated with thin-film dynodes wherein the interchannel regions are first dry etched in the...
5554304 Process for producing a micromotion mechanical structure  
In a micromotion mechanical structure, such as a vibration-type sensor or a step motor, comprising at least one fixed electrode and at least one movable electrode which is moved by electrostatic...
5545594 Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented  
A method for bonding a silicon substrate and a glass substrate through an anodic-bonding process, including steps of: forming at least two holes in the glass substrate; forming a recess on the...
5543349 Method for fabricating a beam pressure sensor employing dielectrically isolated resonant beams  
A pressure transducer comprising at least one diaphragm formed in a wafer of semiconducting material, the at least one diaphragm being spaced from a first surface of the wafer, a first layer of...
5504032 Micromechanical accelerometer and method of manufacture thereof  
A high precision micromechanical accelerometer comprises a layered structure of five (5) semiconductor wafers insulated from one another by thin semiconductor material oxide layers. The...
5503285 Method for forming an electrostatically force balanced silicon accelerometer  
An accelerometer is fabricated by forming a proofmass and at least one associated hinge in a silicon substrate by ion implantation and the formation of an oxide support layer below the proofmass,...
5492867 Method for manufacturing a miniaturized solid state mass spectrograph  
A method for forming a solid state mass spectrograph for analyzing a sample gas is provided in which a plurality of cavities are formed in a substrate, preferably, a semiconductor. Each of these...
Matches 201 - 250 out of 286 < 1 2 3 4 5 6 >