Matches 151 - 200 out of 286 < 1 2 3 4 5 6 >
Match Document Document Title
6730990 Mountable microstructure and optical transmission apparatus  
A mountable microstructure is provided for mounting with high positional accuracy a compound semiconductor element such as a surface emitting laser element engaged under gravity in concavities on...
6727549 Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer  
A method of fabricating a film of active devices is provided. First damaged regions are formed, in a substrate, underneath first areas of the substrate where active devices are to be formed. Active...
6716661 Process to fabricate an integrated micro-fluidic system on a single wafer  
Formation of micro-fluidic systems is normally achieved using a multi-wafer fabrication procedure. The present invention teaches how a complete micro-fluidic system can be implemented on a single...
6716666 Wafer scale molding of protective caps  
The invention is a method of applying an array ( 134 ) of caps to a wafer ( 144 ) of semiconductor material which includes a plurality of microfabricated devices ( 146 ). The method includes...
6689627 Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness  
A process for manufacturing components in a multi-layer wafer, including the steps of: providing a multi-layer wafer comprising a first semiconductor material layer, a second semiconductor material...
6673694 Method for microfabricating structures using silicon-on-insulator material  
The invention provides a general fabrication method for producing MicroElectroMechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI). One first obtains an SOI wafer that has...
6673189 Method for producing a stable bond between two wafers  
A method for producing a re-releasable bond between two wafers which is stable at high temperatures and mechanically stable is described. The two wafers to be bonded are placed one on top of the...
6670257 Method for forming horizontal buried channels or cavities in wafers of monocrystalline semiconductor material  
A method of forming buried cavities in a wafer of monocrystalline semiconductor material with at least one cavity formed in a substrate of monocrystalline semiconductor material by timed TMAH...
6667252 Method of manufacturing compound semiconductor substrate  
A compound semiconductor substrate is manufactured by forming a higher-quality compound semiconductor layer having a smaller number of crystalline defects on a single-crystal substrate, and...
6645831 Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide  
A wafer pair comprising a substantially defect-free germanium wafer and methods of making the same. The wafer pair comprises the substantially defect-free germanium wafer directly bonded to a...
6645833 Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method  
The invention relates to a method of manufacturing layer-like structures in which a material layer having hollow cavities, preferably a porous material layer, is produced on or out of a substrate...
6624047 Substrate and method of manufacturing the same  
In a method of manufacturing a bonded substrate stack by bonding a first substrate having a porous layer to a second substrate to prepare a bonded substrate stack, and separating the bonded...
6620646 Chip size image sensor wirebond package fabrication method  
To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active...
6613652 Method for fabricating SOI devices with option of incorporating air-gap feature for better insulation and performance  
A method to form SOI devices using wafer bonding. A first substrate is provided having trenches in a first side. A first insulating layer is formed over the first side of the first substrate and...
6607934 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components  
A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of “flip chip” for fabrication of a...
6582985 SOI/glass process for forming thin silicon micromachined structures  
Methods for making thin silicon layers suspended over recesses in glass wafers. One method includes providing a thin silicon-on-insulator (SOI) wafer, and a glass wafer. The SOI wafer can include a...
6566233 Method for manufacturing bonded wafer  
A method for manufacturing a bonded wafer, in which when a bonded wafer is manufactured using an ion implantation separation method, impurities attached in the ion implantation step can be removed...
6562127 Method of making mosaic array of thin semiconductor material of large substrates  
A method for making an array of thin single-crystal substrates on a handle substrate comprising the steps: attaching a plurality of single-crystal substrates to a face of a support wafer; polishing...
6551851 Production of diaphragms over a cavity by grinding to reduce wafer thickness  
A method of manufacturing a diaphragm utilising a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on use of a...
6548322 Micromachined gas-filled chambers and method of microfabrication  
Micromachining, etching and bonding techniques are employed to fabricate hermetically sealed gas-filled chambers from silicon and/or glass wafers. The hermetically sealed gas-filled chambers have...
6548391 Method of vertically integrating electric components by means of back contacting  
The present invention relates to a method of connecting two semiconductor components comprising the steps of providing in a first main surface of a first semiconductor substrate first component...
6544863 Method of fabricating semiconductor wafers having multiple height subsurface layers  
A method for fabricating semiconductor wafers as multiple-depth structure (i.e., having portions of varying height). The method includes patterning a first substrate and bonding a second substrate...
6537846 Substrate bonding using a selenidation reaction  
A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on...
6531376 Method of making a semiconductor device with a low permittivity region  
A method of making a semiconductor device ( 10 ) having a low permittivity region ( 24 ) includes forming a first layer ( 30/42 ) over a surface of a trench ( 20 ), and etching through an opening (...
6527964 Methods and apparatuses for improved flow in performing fluidic self assembly  
Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one...
6524888 Method of attaching a conformal chip carrier to a flip chip  
Mixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads...
6524878 Microactuator, method for making the same, and magnetic head unit and magnetic recording apparatus using the same  
A microactuator has a first substrate, a second substrate, a first comb electrode having a plurality of first comb elements formed on an inner surface of the first substrate, a second comb...
6511866 Use of diverse materials in air-cavity packaging of electronic devices  
Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts—base, sidewalls, and lid. The die...
6495388 Surface micro-machined sensor with pedestal  
A surface micro-machined sensor uses a pedestal in a cavity to support a flexible structure and reduce the span of the flexible structure. The reduced span per sense area allows larger sensor areas...
6479366 Method of manufacturing a semiconductor device with air gaps formed between metal leads  
A semiconductor device is fabricated first by thermocompression-bonding a silicon oxide film onto a plurality of conductive films under vacuum using a film having the silicon oxide film formed...
6475880 Cassette invertor method  
A method of inverting a plurality of plate-like materials. One form of the method may include supporting the plurality of plate-like materials in an orientation such that the plate-like materials...
6458618 Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators  
The use of robust substrates on the surface micro-machined structures combines (1) the use of micro-machining technology; (2) the use of electronic packaging technologies; and (3) the use of...
6451668 Method of producing calibration structures in semiconductor substrates  
The invention relates to a method of producing calibration structures in semiconductor substrates in the manufacture of components, specifically micro-mechanical systems with integrated...
6417075 Method for producing thin substrate layers  
The present invention relates to a method of producing very thin substrate layers, particularly thin semiconductor areas, which may comprise integrated circuits. In the method two substrates ( 1, 2...
6395374 Method of making microwave, multifunction modules using fluoropolymer composite substrates  
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite...
6391742 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same  
A small size electronic part comprises a silicon substrate having a functional element and a signal output portion to output a signal from the functional element to outside the electronic part; a...
6380048 Die paddle enhancement for exposed pad in semiconductor packaging  
A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the...
6372608 Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method  
A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including...
6372609 Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method  
There is provided a method of fabricating an SOI wafer having high quality by hydrogen ion delamination method wherein a damage layer remaining on the surface of the SOI layer after delamination...
6362075 Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide  
Integrated circuits, semiconductor devices and methods for making the same are described. Each embodiment shows a diffused, doped backside layer in a device wafer that is oxide bonded to a handle...
6352875 Photoelectric conversion apparatus and method of manufacturing the same  
In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the...
6348358 Emitter array with individually addressable laser diodes  
A linear array of diode laser emitters is manufactured with sufficient thermal and electronic isolation among the emitters to permit separate addressability. The emitter bar has first and second...
6306680 Power overlay chip scale packages for discrete power devices  
A power semiconductor device package includes at least one power semiconductor device mounted onto at least one electrically and thermally conductive spacer having an upper end surface bonded to a...
6297072 Method of fabrication of a microstructure having an internal cavity  
A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a...
6277666 Precisely defined microelectromechanical structures and associated fabrication methods  
A method is provided for fabricating a MEMS structure from a silicon-on insulator (SOI) wafer that has been bonded to a support substrate, such as a glass substrate, in order to form silicon...
6261871 Method and structure for temperature stabilization in flip chip technology  
Phase Change Material ("PCM") are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a...
6248646 Discrete wafer array process  
A method of preparing small wafers for compatibility with conventional large wafer fabrication equipment comprising the following steps: indenting a face of a large wafer to form an array of...
6242319 Method for fabricating an integrated circuit configuration  
A first structure of a circuit configuration and a first alignment structure are produced in the region of a surface of a first substrate. The first alignment structure scatters electron beams...
6235611 Method for making silicon-on-sapphire transducers  
An improved method for making silicon-on-sapphire transducers including the steps of: forming a first silicon layer on a first side of a first sapphire wafer; bonding a second sapphire wafer to the...
6235612 Edge bond pads on integrated circuits  
The invention is to a device and the method of making circuit devices with side wall contacts produced on a semiconductor wafer (30) by forming grooves (33,34) partially through the wafer surface...
Matches 151 - 200 out of 286 < 1 2 3 4 5 6 >